CH603728A5 - - Google Patents
Info
- Publication number
- CH603728A5 CH603728A5 CH1251773A CH1251773A CH603728A5 CH 603728 A5 CH603728 A5 CH 603728A5 CH 1251773 A CH1251773 A CH 1251773A CH 1251773 A CH1251773 A CH 1251773A CH 603728 A5 CH603728 A5 CH 603728A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2201/00—Polymeric substrate or laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2350/00—Pretreatment of the substrate
- B05D2350/30—Change of the surface
- B05D2350/33—Roughening
- B05D2350/35—Roughening by chemical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US291717A US3864147A (en) | 1972-09-25 | 1972-09-25 | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CH603728A5 true CH603728A5 (fr) | 1978-08-31 |
Family
ID=23121530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1251773A CH603728A5 (fr) | 1972-09-25 | 1973-08-31 |
Country Status (12)
Country | Link |
---|---|
US (1) | US3864147A (fr) |
JP (2) | JPS5315744B2 (fr) |
BE (1) | BE804975A (fr) |
CH (1) | CH603728A5 (fr) |
DE (1) | DE2347884A1 (fr) |
ES (1) | ES419056A1 (fr) |
FR (1) | FR2208769B1 (fr) |
GB (1) | GB1414097A (fr) |
IL (1) | IL42775A (fr) |
IT (1) | IT996188B (fr) |
NL (1) | NL7313213A (fr) |
SE (1) | SE404035B (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864147A (en) * | 1972-09-25 | 1975-02-04 | Macdermid Inc | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
JPS5418875A (en) * | 1977-07-12 | 1979-02-13 | Nippon Denki Kagaku Co Ltd | Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate |
JPS58200200A (ja) * | 1982-05-18 | 1983-11-21 | 富士写真フイルム株式会社 | 放射線像変換パネルおよびその製造法 |
EP0127691B1 (fr) * | 1983-06-01 | 1987-05-13 | Ibm Deutschland Gmbh | Procédé pour produire des circuits imprimés avec des parcours conducteurs superficiels |
JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
US5268203A (en) * | 1989-10-30 | 1993-12-07 | H. B. Fuller Company | Method of introducing an integral thermo-bonded layer into the surface of a thermoformed substrate |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3035944A (en) * | 1960-08-05 | 1962-05-22 | Ben C Sher | Electrical component preparation utilizing a pre-acid treatment followed by chemical metal deposition |
US3331710A (en) * | 1963-08-23 | 1967-07-18 | Hooker Chemical Corp | Method for coating aluminum |
JPS4811459B1 (fr) * | 1967-12-13 | 1973-04-13 | ||
US3666549A (en) * | 1969-05-09 | 1972-05-30 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
US3655467A (en) * | 1969-05-14 | 1972-04-11 | Aluminum Co Of America | Etching of aluminum base alloys |
GB1357631A (en) * | 1971-01-21 | 1974-06-26 | Ici Ltd | Polyurethane foams |
US3864147A (en) * | 1972-09-25 | 1975-02-04 | Macdermid Inc | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
-
1972
- 1972-09-25 US US291717A patent/US3864147A/en not_active Expired - Lifetime
-
1973
- 1973-07-18 IL IL42775A patent/IL42775A/en unknown
- 1973-08-15 GB GB3861273A patent/GB1414097A/en not_active Expired
- 1973-08-31 CH CH1251773A patent/CH603728A5/xx not_active IP Right Cessation
- 1973-09-14 JP JP10332873A patent/JPS5315744B2/ja not_active Expired
- 1973-09-14 SE SE7312565A patent/SE404035B/xx unknown
- 1973-09-18 BE BE135753A patent/BE804975A/fr unknown
- 1973-09-20 IT IT52639/73A patent/IT996188B/it active
- 1973-09-20 DE DE19732347884 patent/DE2347884A1/de not_active Ceased
- 1973-09-21 FR FR7333935A patent/FR2208769B1/fr not_active Expired
- 1973-09-25 NL NL7313213A patent/NL7313213A/xx not_active Application Discontinuation
- 1973-09-25 ES ES419056A patent/ES419056A1/es not_active Expired
-
1977
- 1977-11-11 JP JP13557077A patent/JPS53121077A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ES419056A1 (es) | 1976-07-01 |
NL7313213A (fr) | 1974-03-27 |
SE404035B (sv) | 1978-09-18 |
US3864147A (en) | 1975-02-04 |
DE2347884A1 (de) | 1974-04-11 |
IT996188B (it) | 1975-12-10 |
FR2208769B1 (fr) | 1980-08-08 |
AU5861673A (en) | 1975-01-30 |
GB1414097A (en) | 1975-11-19 |
IL42775A0 (en) | 1973-10-25 |
BE804975A (fr) | 1974-01-16 |
JPS53121077A (en) | 1978-10-23 |
FR2208769A1 (fr) | 1974-06-28 |
JPS4971058A (fr) | 1974-07-09 |
IL42775A (en) | 1976-06-30 |
JPS5315744B2 (fr) | 1978-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased | ||
PL | Patent ceased |