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CH522288A - Halbleitereinheit und Verfahren zur Herstellung derselben - Google Patents

Halbleitereinheit und Verfahren zur Herstellung derselben

Info

Publication number
CH522288A
CH522288A CH1456570A CH1456570A CH522288A CH 522288 A CH522288 A CH 522288A CH 1456570 A CH1456570 A CH 1456570A CH 1456570 A CH1456570 A CH 1456570A CH 522288 A CH522288 A CH 522288A
Authority
CH
Switzerland
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
Prior art date
Application number
CH1456570A
Other languages
English (en)
Inventor
Vogel Xaver
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1456570A priority Critical patent/CH522288A/de
Priority to DE19707040956U priority patent/DE7040956U/de
Priority to DE19702054393 priority patent/DE2054393A1/de
Priority to US00180415A priority patent/US3740618A/en
Priority to FR7134614A priority patent/FR2108055B1/fr
Priority to GB4487171A priority patent/GB1341309A/en
Priority to SE7112215A priority patent/SE374980B/xx
Priority to CH1759271A priority patent/CH526857A/de
Publication of CH522288A publication Critical patent/CH522288A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CH1456570A 1970-09-29 1970-09-29 Halbleitereinheit und Verfahren zur Herstellung derselben CH522288A (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CH1456570A CH522288A (de) 1970-09-29 1970-09-29 Halbleitereinheit und Verfahren zur Herstellung derselben
DE19707040956U DE7040956U (de) 1970-09-29 1970-11-05 Halbleitereinheit
DE19702054393 DE2054393A1 (de) 1970-09-29 1970-11-05 Halbleitereinheit und Verfahren zur Herstellung derselben
US00180415A US3740618A (en) 1970-09-29 1971-09-14 Semiconductor unit and method of manufacture thereof
FR7134614A FR2108055B1 (de) 1970-09-29 1971-09-27
GB4487171A GB1341309A (en) 1970-09-29 1971-09-27 Semiconductor units
SE7112215A SE374980B (de) 1970-09-29 1971-09-27
CH1759271A CH526857A (de) 1970-09-29 1971-12-03 Halbleitereinheit und Verfahren zur Herstellung derselben

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1456570A CH522288A (de) 1970-09-29 1970-09-29 Halbleitereinheit und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
CH522288A true CH522288A (de) 1972-06-15

Family

ID=4401891

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1456570A CH522288A (de) 1970-09-29 1970-09-29 Halbleitereinheit und Verfahren zur Herstellung derselben

Country Status (6)

Country Link
US (1) US3740618A (de)
CH (1) CH522288A (de)
DE (2) DE2054393A1 (de)
FR (1) FR2108055B1 (de)
GB (1) GB1341309A (de)
SE (1) SE374980B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
FR2287107A1 (fr) * 1974-10-01 1976-04-30 Jeumont Schneider Procede pour le serrage d'un boitier de semi-conducteur de puissance monte entre deux radiateurs et dispositif pour la mise en oeuvre de ce procede
CH593560A5 (de) * 1976-01-22 1977-12-15 Bbc Brown Boveri & Cie
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
US4414562A (en) * 1980-07-24 1983-11-08 Thermal Associates, Inc. Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
US4603344A (en) * 1984-07-30 1986-07-29 Sundstrand Corporation Rotating rectifier assembly
JPH0225057A (ja) * 1988-07-13 1990-01-26 Mitsubishi Electric Corp 半導体装置の製造方法
JP2010517308A (ja) * 2007-01-26 2010-05-20 インダクトサーム・コーポレイション 半導体製品のコンプレッションクランプ
JP2014112583A (ja) * 2012-12-05 2014-06-19 Toyota Motor Corp 冷却器付き半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE411966C (de) * 1923-07-05 1925-04-09 Carl Taenzler Kristalldetektor fuer elektrische Wellen
GB1000023A (en) * 1963-02-06 1965-08-04 Westinghouse Brake & Signal Semi-conductor devices
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
FR1600561A (de) * 1968-01-26 1970-07-27
CH474153A (de) * 1968-05-16 1969-06-15 Bbc Brown Boveri & Cie Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren
DE1924011C3 (de) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Stromrichter mit zwei parallelen, durch Abstandsstücke getrennten Schienen
US3661013A (en) * 1969-12-23 1972-05-09 Electric Regulator Corp Semiconductor assembly
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink

Also Published As

Publication number Publication date
SE374980B (de) 1975-03-24
FR2108055A1 (de) 1972-05-12
DE2054393A1 (de) 1972-03-30
FR2108055B1 (de) 1974-06-07
US3740618A (en) 1973-06-19
DE7040956U (de) 1972-06-15
GB1341309A (en) 1973-12-19

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Legal Events

Date Code Title Description
PL Patent ceased
PW Restitution
PL Patent ceased