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CH521408A - Process for the production of epoxy resin molding materials - Google Patents

Process for the production of epoxy resin molding materials

Info

Publication number
CH521408A
CH521408A CH1382569A CH1382569A CH521408A CH 521408 A CH521408 A CH 521408A CH 1382569 A CH1382569 A CH 1382569A CH 1382569 A CH1382569 A CH 1382569A CH 521408 A CH521408 A CH 521408A
Authority
CH
Switzerland
Prior art keywords
production
epoxy resin
resin molding
molding materials
materials
Prior art date
Application number
CH1382569A
Other languages
German (de)
Inventor
Raubach Heinz Dr Dipl-Chem
Wolfgang Dipl Chem Teige
Fedtke Manfred Dr Dipl-Chem
Original Assignee
Akad Wissenschaften Ddr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akad Wissenschaften Ddr filed Critical Akad Wissenschaften Ddr
Publication of CH521408A publication Critical patent/CH521408A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CH1382569A 1968-09-13 1969-09-12 Process for the production of epoxy resin molding materials CH521408A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD13471868 1968-09-13

Publications (1)

Publication Number Publication Date
CH521408A true CH521408A (en) 1972-04-15

Family

ID=5480385

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1382569A CH521408A (en) 1968-09-13 1969-09-12 Process for the production of epoxy resin molding materials

Country Status (3)

Country Link
AT (1) AT291594B (en)
CH (1) CH521408A (en)
DE (1) DE1932305A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH550820A (en) * 1971-04-14 1974-06-28 Ciba Geigy Ag METHOD FOR PREPARING HETEROCYCLIC TRIGLYCIDYL COMPOUNDS.
DE2858073C2 (en) * 1977-04-19 1985-12-12 Blasius Industries Inc., Clifton, N.J. High-voltage plug with insulating protective cap for cathode ray tubes
JP5973401B2 (en) * 2013-09-13 2016-08-23 四国化成工業株式会社 Glycidyl glycolurils and their use
JP6415233B2 (en) * 2013-11-19 2018-10-31 四国化成工業株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP6430787B2 (en) * 2013-11-20 2018-11-28 四国化成工業株式会社 Optical semiconductor device
TWI685495B (en) * 2013-11-25 2020-02-21 日商四國化成工業股份有限公司 Composition containing glycidyl glycolurils
JP6472289B2 (en) * 2014-03-27 2019-02-20 四国化成工業株式会社 Resist underlayer film forming composition and method for producing semiconductor device
CN107614564B (en) * 2015-03-04 2020-04-14 爱沃特株式会社 Thermal expansion modifier, use thereof as thermal expansion modifier, and thermosetting resin composition

Also Published As

Publication number Publication date
DE1932305A1 (en) 1970-03-19
AT291594B (en) 1971-06-15

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Legal Events

Date Code Title Description
PL Patent ceased