CH403087A - Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase - Google Patents
Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der GasphaseInfo
- Publication number
- CH403087A CH403087A CH263162A CH263162A CH403087A CH 403087 A CH403087 A CH 403087A CH 263162 A CH263162 A CH 263162A CH 263162 A CH263162 A CH 263162A CH 403087 A CH403087 A CH 403087A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor
- production
- gas phase
- crystal deposition
- semiconductor material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/067—Graded energy gap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/071—Heating, selective
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/072—Heterojunctions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/073—Hollow body
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES74266A DE1137807B (de) | 1961-06-09 | 1961-06-09 | Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase |
Publications (1)
Publication Number | Publication Date |
---|---|
CH403087A true CH403087A (de) | 1965-11-30 |
Family
ID=7504529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH263162A CH403087A (de) | 1961-06-09 | 1962-03-05 | Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase |
Country Status (5)
Country | Link |
---|---|
US (1) | US3226254A (de) |
BE (1) | BE618583A (de) |
CH (1) | CH403087A (de) |
DE (1) | DE1137807B (de) |
GB (1) | GB1007710A (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3306602A (en) * | 1964-08-11 | 1967-02-28 | Bendix Corp | Work holder fixture |
DE1289832B (de) * | 1964-08-21 | 1969-02-27 | Siemens Ag | Vorrichtung zur Herstellung planer Oberflaechen von aus der Gasphase abgeschiedenen Halbleiterkristallschichten |
US3407783A (en) * | 1964-08-31 | 1968-10-29 | Emil R. Capita | Vapor deposition apparatus |
DE1544253C3 (de) * | 1964-09-14 | 1974-08-15 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum epitaktischen Abscheiden yon Halbleitermaterial |
US3421924A (en) * | 1965-06-01 | 1969-01-14 | Pilling Chain Co Inc | Method and apparatus for coating articles |
US3461842A (en) * | 1965-11-19 | 1969-08-19 | Ibm | Work holder rack |
DE1521494B1 (de) * | 1966-02-25 | 1970-11-26 | Siemens Ag | Vorrichtung zum Eindiffundieren von Fremdstoffen in Halbleiterkoerper |
US3460510A (en) * | 1966-05-12 | 1969-08-12 | Dow Corning | Large volume semiconductor coating reactor |
US3408982A (en) * | 1966-08-25 | 1968-11-05 | Emil R. Capita | Vapor plating apparatus including rotatable substrate support |
US3805735A (en) * | 1970-07-27 | 1974-04-23 | Siemens Ag | Device for indiffusing dopants into semiconductor wafers |
DE2349512C3 (de) * | 1973-10-02 | 1978-06-08 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von Halterungen aus Silicium oder Siliciumcarbid für Diffusions- und Temperprozesse |
DE2541215C3 (de) * | 1975-09-16 | 1978-08-03 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Verfahren zur Herstellung von Siliciumhohlkörpern |
JPS5936417B2 (ja) * | 1975-11-26 | 1984-09-04 | 株式会社デンソー | 半導体基板への高周波誘導加熱による拡散装置 |
US4068814A (en) * | 1976-10-18 | 1978-01-17 | General Electric Company | Semiconductor body holder |
US4062318A (en) * | 1976-11-19 | 1977-12-13 | Rca Corporation | Apparatus for chemical vapor deposition |
US4411729A (en) * | 1979-09-29 | 1983-10-25 | Fujitsu Limited | Method for a vapor phase growth of a compound semiconductor |
US4401689A (en) * | 1980-01-31 | 1983-08-30 | Rca Corporation | Radiation heated reactor process for chemical vapor deposition on substrates |
US4263872A (en) * | 1980-01-31 | 1981-04-28 | Rca Corporation | Radiation heated reactor for chemical vapor deposition on substrates |
US5197271A (en) * | 1981-03-22 | 1993-03-30 | Texas Instruments Incorporated | Method and apparatus for back side damage of silicon wafers |
JPS6211224A (ja) * | 1986-07-18 | 1987-01-20 | Hitachi Ltd | 半導体ウエハの熱処理方法 |
JPS6323313A (ja) * | 1987-06-19 | 1988-01-30 | Hitachi Ltd | 半導体ウエハの熱処理方法 |
US4851593A (en) * | 1987-10-13 | 1989-07-25 | Sherex Chemical Company | Dihydroxy or polyhydroxy compounds and process for producing same |
US5155336A (en) * | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
US5320680A (en) * | 1991-04-25 | 1994-06-14 | Silicon Valley Group, Inc. | Primary flow CVD apparatus comprising gas preheater and means for substantially eddy-free gas flow |
JP3125199B2 (ja) * | 1993-03-18 | 2001-01-15 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP3348936B2 (ja) * | 1993-10-21 | 2002-11-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
US5458688A (en) * | 1993-03-09 | 1995-10-17 | Tokyo Electron Kabushiki Kaisha | Heat treatment boat |
JP2732224B2 (ja) * | 1994-09-30 | 1998-03-25 | 信越半導体株式会社 | ウエーハ支持ボート |
US5534074A (en) * | 1995-05-17 | 1996-07-09 | Heraeus Amersil, Inc. | Vertical boat for holding semiconductor wafers |
JPH10256161A (ja) * | 1997-03-07 | 1998-09-25 | Mitsubishi Electric Corp | Cvd用治具、それを用いた半導体装置の製造方法、およびcvd用治具の製造方法 |
US6005225A (en) * | 1997-03-28 | 1999-12-21 | Silicon Valley Group, Inc. | Thermal processing apparatus |
US6059567A (en) * | 1998-02-10 | 2000-05-09 | Silicon Valley Group, Inc. | Semiconductor thermal processor with recirculating heater exhaust cooling system |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE443422C (de) * | 1925-03-15 | 1927-04-28 | John Eckhoff | Vorrichtung zur Herstellung von Buegelfalten an Beinkleidern |
US2520334A (en) * | 1947-09-11 | 1950-08-29 | Borg Warner | Method of selective carburization |
DE1046196B (de) * | 1954-11-27 | 1958-12-11 | Siemens Ag | Verfahren zur Herstellung eines Halbleiters fuer Flaechengleichrichter, -transistoren od. dgl. mit mehreren Bereichen verschiedener Leitfaehigkeit |
FR1141561A (fr) * | 1956-01-20 | 1957-09-04 | Cedel | Procédé et moyens pour la fabrication de matériaux semi-conducteurs |
BE555455A (de) * | 1956-05-18 | |||
US3011877A (en) * | 1956-06-25 | 1961-12-05 | Siemens Ag | Production of high-purity semiconductor materials for electrical purposes |
US3031338A (en) * | 1959-04-03 | 1962-04-24 | Alloyd Res Corp | Metal deposition process and apparatus |
NL133151C (de) * | 1959-05-28 | 1900-01-01 | ||
NL256255A (de) * | 1959-11-02 | |||
NL268294A (de) * | 1960-10-10 | |||
BE632892A (de) * | 1962-05-29 |
-
1961
- 1961-06-09 DE DES74266A patent/DE1137807B/de active Pending
-
1962
- 1962-03-05 CH CH263162A patent/CH403087A/de unknown
- 1962-05-24 GB GB20111/62A patent/GB1007710A/en not_active Expired
- 1962-06-06 BE BE618583A patent/BE618583A/fr unknown
- 1962-06-06 US US200525A patent/US3226254A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB1007710A (en) | 1965-10-22 |
DE1137807B (de) | 1962-10-11 |
US3226254A (en) | 1965-12-28 |
BE618583A (fr) | 1962-12-14 |
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