CA2980276A1 - Drill bit cutters and cutter assemblies - Google Patents
Drill bit cutters and cutter assemblies Download PDFInfo
- Publication number
- CA2980276A1 CA2980276A1 CA2980276A CA2980276A CA2980276A1 CA 2980276 A1 CA2980276 A1 CA 2980276A1 CA 2980276 A CA2980276 A CA 2980276A CA 2980276 A CA2980276 A CA 2980276A CA 2980276 A1 CA2980276 A1 CA 2980276A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- diamond table
- protrusion
- hole
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000000712 assembly Effects 0.000 title description 2
- 238000000429 assembly Methods 0.000 title description 2
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 198
- 239000010432 diamond Substances 0.000 claims abstract description 198
- 239000000758 substrate Substances 0.000 claims abstract description 171
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 75
- 239000000956 alloy Substances 0.000 claims abstract description 75
- 230000006835 compression Effects 0.000 claims abstract description 16
- 238000007906 compression Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 68
- 239000004020 conductor Substances 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 238000005219 brazing Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 24
- 239000010949 copper Substances 0.000 description 18
- 238000001816 cooling Methods 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 12
- 230000007704 transition Effects 0.000 description 12
- 239000010931 gold Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000002386 leaching Methods 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 7
- 229910017052 cobalt Inorganic materials 0.000 description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 239000011572 manganese Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- -1 but not limited to Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
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- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical class C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical class [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- JZQOJFLIJNRDHK-CMDGGOBGSA-N alpha-irone Chemical compound CC1CC=C(C)C(\C=C\C(C)=O)C1(C)C JZQOJFLIJNRDHK-CMDGGOBGSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 229910021472 group 8 element Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000011591 potassium Chemical class 0.000 description 1
- 229910052700 potassium Chemical class 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
- E21B10/5735—Interface between the substrate and the cutting element
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/62—Drill bits characterised by parts, e.g. cutting elements, which are detachable or adjustable
- E21B10/627—Drill bits characterised by parts, e.g. cutting elements, which are detachable or adjustable with plural detachable cutting elements
- E21B10/633—Drill bits characterised by parts, e.g. cutting elements, which are detachable or adjustable with plural detachable cutting elements independently detachable
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Geology (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Fluid Mechanics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Drilling Tools (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A cutter for a drill bit includes a substrate defining a hole at least partially through the substrate. A diamond table including a protrusion is received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP). A braze alloy couples the diamond table to the substrate at an interface between the diamond table and the substrate. At least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
Description
DRILL BIT CUTTERS AND CUTTER ASSEMBLIES
BACKGROUND
[0001] Wel!bores for the oil and gas industry are commonly drilled by a process of rotary drilling. In conventional rotary drilling, a drill bit is mounted on the end of a drill string, which may be lengthened to reach a desired depth by progressively adding tubing segments on site while drilling. At the surface of the wellbore, a rotary table or top drive turns the drill string, including the drill bit arranged at the bottom of the hole to increasingly penetrate the earth, while drilling fluid is pumped through the drill string. In other drilling configurations, the drill bit may be rotated using a mud motor arranged in the drill string adjacent the drill bit and powered using the circulating drilling fluid.
BACKGROUND
[0001] Wel!bores for the oil and gas industry are commonly drilled by a process of rotary drilling. In conventional rotary drilling, a drill bit is mounted on the end of a drill string, which may be lengthened to reach a desired depth by progressively adding tubing segments on site while drilling. At the surface of the wellbore, a rotary table or top drive turns the drill string, including the drill bit arranged at the bottom of the hole to increasingly penetrate the earth, while drilling fluid is pumped through the drill string. In other drilling configurations, the drill bit may be rotated using a mud motor arranged in the drill string adjacent the drill bit and powered using the circulating drilling fluid.
[0002] One common type of drill bit used to drill wellbores is known as a "fixed cutter" or "drag" drill bit. A fixed cutter drill bit generally includes a bit body formed from a high strength and/or high toughness material and a plurality of cutters attached at fixed locations about the bit body. Cutters on fixed cutter drill bits often include a substrate or support stud made of cemented-carbide (e.g., tungsten carbide), and a cutting surface layer or "diamond table,"
which can be made of a variety of ultra-hard materials. One ultra-hard material commonly employed is polycrystalline diamond, and cutters that used polycrystalline diamond are commonly referred to as polycrystalline diamond compact ("PDC") cutters.
which can be made of a variety of ultra-hard materials. One ultra-hard material commonly employed is polycrystalline diamond, and cutters that used polycrystalline diamond are commonly referred to as polycrystalline diamond compact ("PDC") cutters.
[0003] Conventionally, the diamond table is simultaneously formed and bonded to the substrate in a single high-temperature, high-pressure (HTHP) press cycle. Various other methods for securing the diamond table to the substrate are also under investigation, whereby the diamond table may be formed in a first HTHP cycle, and optional post-processing steps may be performed, such as leaching the diamond table, before attaching or re-attaching the leached diamond table to a substrate. Such other methods of attachment may include, for example, bonding the diamond-table to the substrate in a subsequent press cycle, or by brazing the diamond table to a substrate with an active metal braze alloy.
BRIEF DESCRIPTION OF THE DRAWINGS
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] The following figures are included to illustrate certain aspects of the present disclosure, and should not be viewed as exclusive embodiments.
The subject matter disclosed is capable of considerable modifications, alterations, combinations, and equivalents in form and function, without departing from the scope of this disclosure.
The subject matter disclosed is capable of considerable modifications, alterations, combinations, and equivalents in form and function, without departing from the scope of this disclosure.
[0005] FIG. 1A is an isometric schematic drawing of an exemplary fixed-cutter drill bit that may employ the principles of the present disclosure.
[0006] FIG. 1B is a schematic drawing of an exemplary cutter that may be used with the drill bit of FIG. 1A.
[0007] FIGS. 2A and 2B are assembled and exploded cross-sectional side views, respectively, of an exemplary cutter.
[0008] FIG. 2C is an isometric view of another embodiment of the diamond table of FIGS. 2A and 2B.
[0009] FIGS. 3A and 3B are cross-sectional side views of the cutter of FIGS. 2A-2B.
[0010] FIG. 4 is an exploded cross-sectional side view of a cutter assembly.
[0011] FIG. 5 is an exploded cross-sectional side view of another cutter assembly.
DETAILED DESCRIPTION
DETAILED DESCRIPTION
[0012] The present disclosure is related to downhole tools used in the oil and gas industry and, more particularly, to drill bit cutters and methods of manufacturing and mounting drill bit cutters and cutter assemblies.
Embodiments of the present disclosure include methods of attaching a diamond table to a substrate of a drill bit cutter.
Embodiments of the present disclosure include methods of attaching a diamond table to a substrate of a drill bit cutter.
[0013] In some example embodiments discussed, the diamond table defines a protrusion that extends from a bottom surface of the diamond table to be received within a hole defined in the substrate, where the hole and the protrusion are formed with an intentionally-formed gap. Such a gap may be between, for example, 0.001 and 0.010 inches when the diamond and substrate are both at around room temperature. The protrusion may be brazed into the hole, with the intentional gap occupied by the braze alloy. The dimension of the hole and protrusion may be selected in view of the coefficient of thermal expansion of the substrate and/or the diamond table to allow the hole to expand during the heating induced by brazing, such that, upon cooling the substrate back to room temperature, the braze alloy is in compression. This may prove advantageous in improving the thermo-mechanical integrity of the drill bit cutter, improve abrasion resistance, and minimize failure at the joint between the substrate and the diamond table.
[0014] In other embodiments, in contrast to leaving an intentional gap, the protrusion may be secured within the hole via an interference fit. In such embodiments, the interference fit may withstand expected drilling operating temperatures. In yet other embodiments, the diamond table and the substrate may be coupled by a combination of an interference fit between the protrusion and hole, and brazing some portion of an interface between the diamond table and substrate.
[0015] FIG. 1A is an isometric view of an example of a fixed-cutter drill bit 100 that may employ the principles of the present disclosure. The drill bit 100 has a bit body 102 that includes radially and longitudinally extending blades 104 having leading faces 106. A threaded pin connection 108 is coupled to the bit body 102 for connecting the drill bit 100 to a drill string (not shown).
The bit body 102 may be made of steel or a metal matrix of a harder material, such as tungsten carbide. The bit body 102 is configured for rotation about a longitudinal axis 110 to drill into a subterranean formation via application of weight on the bit body 102 (i.e., weight-on-bit). Corresponding junk slots 112 are defined between circumferentially adjacent blades 104, and a plurality of nozzles or ports 114 can be defined within the junk slots 112 for ejecting drilling fluid that cools the drill bit 100 and flushes away cuttings and debris generated during the drilling operation.
The bit body 102 may be made of steel or a metal matrix of a harder material, such as tungsten carbide. The bit body 102 is configured for rotation about a longitudinal axis 110 to drill into a subterranean formation via application of weight on the bit body 102 (i.e., weight-on-bit). Corresponding junk slots 112 are defined between circumferentially adjacent blades 104, and a plurality of nozzles or ports 114 can be defined within the junk slots 112 for ejecting drilling fluid that cools the drill bit 100 and flushes away cuttings and debris generated during the drilling operation.
[0016] The bit body 102 further includes a plurality of cutters 116 each disposed within a corresponding cutter pocket 118 sized and shaped to receive the cutters 116. The cutters 116 are held in the blades 104 and corresponding cutter pockets 118 at predetermined angular orientations and radial locations to position the cutters 116 with a desired backrake angle against the formation being penetrated. As the bit body 102 is rotated, the cutters 116 are driven through the underlying rock by the combined forces of weight-on-bit and torque assumed at the drill bit 100.
[0017] FIG. 1B is a plan view of one of the cutters 116 of FIG. 1A, which includes a generally cylindrical substrate 120 and a diamond table 124 (alternatively referred to as a disc) coupled to the substrate 120 at an interface 122 between the substrate 120 and the diamond table 124. The substrate 120 may be formed of a variety of hard or ultra-hard materials including, but not limited to, steel, steel alloys, tungsten carbide, cemented carbide, and any derivatives and combinations thereof. Suitable cemented carbides may contain varying proportions of titanium carbide (TiC), tantalum carbide (TaC), and niobium carbide (NbC). In at least one embodiment, the substrate 120 may comprise a cylindrical tungsten carbide "blank" that is sufficiently long to act as a mounting stud for the diamond table 124.
[0018] The diamond table 124 may include one or more layers of an ultra-hard material, such as polycrystalline diamond (PCD), polycrystalline cubic boron nitride, impregnated diamond, or another super-abrasive material. The diamond table 124 generally defines or provides a working surface 126, at least a portion of which engages the formation during drilling for cutting/failing the formation. In the orientation shown in FIG. 1B, the interface 122 between the diamond table 124 and the substrate 120 extends between a top surface 128 of the substrate 120 and a bottom surface 130 of the diamond table 124, where the bottom surface 130 is opposite the working surface 126.
[0019] In some embodiments, the diamond table 124 may be formed by subjecting particulate material to a high-temperature, high-pressure (HTHP) press cycle. In at least one embodiment, a catalyzing material (alternately referred to in the art as a catalyst), such as cobalt, iron, nickel or Group VIII
elements (and alloys thereof), may be provided to promote bonding between diamond particles during formation of the diamond table 124. Optionally, following the HTHP press cycle used to form the diamond table, the diamond table 124 may be prepared for higher temperature resistance and/or higher wear/abrasion resistance by removing the residual cobalt catalyst from the diamond table 124, such as through a leaching process, prior to bonding the diamond table 124 to the substrate 120. Leaching the diamond table 124 prior to attaching it to the substrate may allow for a more thorough leaching than could be obtained if the diamond table 124 were already mounted to the substrate, in which case leaching can only be done to a controlled depth away from the interface between the diamond table 124 and substrate 120. The leaching may result in what may be referred to as thermally stable polycrystalline (TSP) diamond. Accordingly, such a diamond table 124 may alternatively be referred to as a "TSP."
elements (and alloys thereof), may be provided to promote bonding between diamond particles during formation of the diamond table 124. Optionally, following the HTHP press cycle used to form the diamond table, the diamond table 124 may be prepared for higher temperature resistance and/or higher wear/abrasion resistance by removing the residual cobalt catalyst from the diamond table 124, such as through a leaching process, prior to bonding the diamond table 124 to the substrate 120. Leaching the diamond table 124 prior to attaching it to the substrate may allow for a more thorough leaching than could be obtained if the diamond table 124 were already mounted to the substrate, in which case leaching can only be done to a controlled depth away from the interface between the diamond table 124 and substrate 120. The leaching may result in what may be referred to as thermally stable polycrystalline (TSP) diamond. Accordingly, such a diamond table 124 may alternatively be referred to as a "TSP."
[0020] In other embodiments, the TSP may be produced without leaching, by forming the diamond with a non-cobalt catalyst during a single HTHP press cycle. In such embodiments, a particulate mixture comprising grains of a hard material and a non-cobalt or carbonate catalyst material (e.g., a carbonate of one or more of magnesium, calcium, strontium, and barium) may be subjected to elevated temperatures (e.g., temperatures greater than about 2000 C) and elevated pressures (e.g., pressures greater than about 7GPa). This HTHP press cycle may result in the formation of inter-granular bonds between the particles of hard material, and thereby forming the inter-bonded grains of the TSP diamond material without the need for leaching. Accordingly, in at least one embodiment, the diamond table 124 may comprise TSP diamond, but may generally include any PCD that has been become thermally stable, whether leached or not. The as-formed diamond table 124 may subsequently be bonded to the substrate 120, as discussed below.
[0021] Referring now to FIGS. 2A and 2B, illustrated are assembled and exploded cross-sectional side views, respectively, of an exemplary cutter 200, according to one or more embodiments of the disclosure. The cutter 200 may be the same as or similar to the cutter 116 of FIG. 1B and therefore may be best understood with reference thereto, where like numerals represent like elements or components not described again. Similar to the cutter 116 of FIG. 1B, for example, the cutter 200 may include the substrate 120 and the diamond table 124.
[0022] As illustrated, the substrate 120 may provide a first end 202a and a second end 202b opposite the first end 202a. The first end 202a is the same as or similar to the top surface 128 of the substrate 120 depicted in FIG.
1B. At least one hole 204 may be defined within the substrate 120 at the first end 202a. In some embodiments, as illustrated, the hole 204 may extend between the first and second ends 202a,b and otherwise through the entire length of the substrate 120. In other embodiments, however, the hole 204 may not extend the entire length of the substrate 120. Rather, the substrate 120 may alternatively provide a bottom 206 (shown in dashed lines) at a location between the first and second ends 202a,b.
1B. At least one hole 204 may be defined within the substrate 120 at the first end 202a. In some embodiments, as illustrated, the hole 204 may extend between the first and second ends 202a,b and otherwise through the entire length of the substrate 120. In other embodiments, however, the hole 204 may not extend the entire length of the substrate 120. Rather, the substrate 120 may alternatively provide a bottom 206 (shown in dashed lines) at a location between the first and second ends 202a,b.
[0023] The diamond table 124 may provide and otherwise define one or more protrusions 208 (one shown) that protrude or extend from the bottom surface 130 of the diamond table 124. The protrusion 208 may be sized and otherwise configured to be received within the hole 204 of the substrate 120.
While only one protrusion 208 is depicted in FIGS. 2A and 2B, more than one protrusion 208 may protrude from the bottom surface 130 of the diamond table 124, as shown in FIG. 2C, without departing from the scope of the present disclosure. In such embodiments, each protrusion 208 may be received within a corresponding individual hole 204 defined in the first end 202a of the substrate 120.
While only one protrusion 208 is depicted in FIGS. 2A and 2B, more than one protrusion 208 may protrude from the bottom surface 130 of the diamond table 124, as shown in FIG. 2C, without departing from the scope of the present disclosure. In such embodiments, each protrusion 208 may be received within a corresponding individual hole 204 defined in the first end 202a of the substrate 120.
[0024] In some embodiments, the protrusion 208 may be formed by laser cutting the diamond table 124 to the desired dimensions and geometry that result in the formation of the protrusion 208. In other embodiments, the protrusion 208 may be formed by electrical discharge machining (EDM) the diamond table 124 to the desired dimensions and geometry. In yet other embodiments, the protrusion 208 may be formed through other known machining, processing, or forming (e.g., molding) methods. In at least one embodiment, the protrusion 208 may be formed during polycrystalline diamond sintering by introducing elements and/or materials inside the forming receptacle, which can provide the required contour or profile without being affected by the HTHP process.
[0025] In some embodiments, as illustrated, the protrusion 208 may exhibit a generally circular cross-section and the hole 204 may correspondingly exhibit a circular cross-section. In other embodiments, however, the protrusion 208 and the hole 208 may each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
[0026] The protrusion 208 may extend from the bottom surface 130 of the diamond table 124, terminating at an end 210. The length or height 212 (FIG. 2B) of the protrusion 208 extending between the bottom surface 130 and the end 210 may vary depending on the application and/or the depth of the hole 204. In at least one embodiment, the height 212 may be about 0.080 inches (2.0 mm), but could alternatively be more or less than 0.080 inches, without departing from the scope of the disclosure. As will be appreciated, having a larger or greater height 212 may prove advantageous in providing an increased amount of surface area between an outside surface of the protrusion 208 and an inside surface of the hole 204 that may be used to help attach the diamond table 124 to the substrate 120.
[0027] In some embodiments, the protrusion 208 may also provide and otherwise define a transition surface 214 extending between the bottom surface 130 of the diamond table 124 and the side(s) of the protrusion 208. In some embodiments, as illustrated, the transition surface 214 may comprise a radius and may otherwise provide a curved surface. In other embodiments, however, the transition surface 214 may comprise an angled surface, such as a beveled or chamfered surface. In yet other embodiments, the transition surface 214 may comprise a right angle between the bottom surface 130 and the side(s) of the protrusion 208, without departing from the scope of the disclosure. The opening to the hole 204 at the first end 202a of the substrate 120 may be configured to receive and otherwise accommodate the various configurations of the transition surface 214 such that a tight or close fit (but still, optionally, with either an intentional gap or an intentional interference fit, as further discussed herein) between the two components is facilitated.
[0028] As best seen in FIG. 2B, the hole 204 may exhibit a hole width 216a and the protrusion 208 may exhibit a protrusion width 216b. In embodiments where the hole 204 and the protrusion 208 are circular, as discussed above, the hole and protrusion widths 216a,b may comprise corresponding diameters for the hole 204 and the protrusion 208, respectively.
According to one or more embodiments, the diamond table 124 may be coupled to the substrate 120 by brazing with an active braze alloy. In such embodiments, the hole 204 may be at least slightly larger than the protrusion 208 at standard temperature and pressure, providing a gap 218 therebetween, such that the protrusion 208 is able to be received within the hole 204. As used herein, the term "standard temperature and pressure" (STP) refers to a pressure of 101325 Pa (1.01325 bar, 14.5 psi, 0.9869 atm) and a temperature of 273 K
(0 C, 32 F), although for most practical purposes, typical ambient temperature (i.e. room temperature) and ambient pressure conditions in a drill bit manufacturing environment will be a sufficient approximation of STP for purposes of the present disclosure.
According to one or more embodiments, the diamond table 124 may be coupled to the substrate 120 by brazing with an active braze alloy. In such embodiments, the hole 204 may be at least slightly larger than the protrusion 208 at standard temperature and pressure, providing a gap 218 therebetween, such that the protrusion 208 is able to be received within the hole 204. As used herein, the term "standard temperature and pressure" (STP) refers to a pressure of 101325 Pa (1.01325 bar, 14.5 psi, 0.9869 atm) and a temperature of 273 K
(0 C, 32 F), although for most practical purposes, typical ambient temperature (i.e. room temperature) and ambient pressure conditions in a drill bit manufacturing environment will be a sufficient approximation of STP for purposes of the present disclosure.
[0029] In the case of a circular hole 204 and protrusion 208, for example, the diameter of the hole 204 may be slightly larger than the diameter of the protrusion 208 to provide the gap 218. In such embodiments, as seen in the enlarged view of FIG. 2A, the gap 218 may be formed between the protrusion 208 and the hole 204 when the protrusion 208 is received within the hole 204. In embodiments where the protrusion 208 and the hole 204 are each circular, the gap 218 may comprise a radial gap between the hole 204 and the protrusion 208. In some embodiments, the gap 218 may occupy a constant radial volume between the about outer peripheries of the hole 204 and the protrusion 208. In other embodiments, however, the size of the gap 218 may vary either radially or along the height 212 (FIG. 2B) of the protrusion 208.
[0030] The gap 218 may allow a selected braze alloy 220 to be deposited at the interface between the protrusion 208 and the hole 204 to form a chemical bond between the diamond table 124 and the braze alloy 220 as well as between the braze alloy 220 and the substrate 120. The size of the gap 218 may allow the braze alloy 220 to migrate into and within the gap 218 during the brazing process by capillary action or otherwise, and thereby secure the diamond table 124 to the substrate 120. The presence of the gap 218 may further prevent the braze alloy 220 from being entirely squeezed out of the hole 204, so that the braze alloy 220 remains in the gap 218 to facilitate bonding between the diamond table 124 and the substrate 120. In at least one embodiment, for instance, the gap 218 may exhibit a dimension that allows for a thickness of the braze alloy 220 at standard temperature to be between about 0.001 inches and about 0.010 inches, since braze alloys achieve maximum joining strength when its thickness is between 0.001 inches to 0.010 inches.
[0031] The braze alloy 220 may comprise an inert, oxidation-resistant metal or metal alloy that can be brazed within the gap 218 with little or no generation of oxides. The material used for the braze alloy 220 may be selected based on one or more critical properties of the material, such as melting temperature (solidus and liquidus temperatures), coefficient of thermal expansion (CTE), ductility, corrosion resistance, and the presence of an active carbide former. An 'active' carbide former is a substance that forms a carbide layer with diamond. Active carbide formers that may be present in a selected braze alloy can include tungsten, molybdenum, titanium, chromium, manganese, yttrium, zirconium, niobium, hafnium, tantalum, vanadium, or any combination, mixture, or alloy thereof.
[0032] Suitable materials for the braze alloy 220 include, but are not limited to, silver (Ag), copper (Cu), gold (Au), nickel (Ni), indium (In), tin (Sn), palladium (Pd), boron (B), chromium (Cr), silicon (Si), molybdenum (Md), vanadium (Va), iron (Fe), aluminum (Al), manganese (Mg), cobalt (Co), any alloy thereof, and any eutectic/non-eutectic combination thereof. Example "active" braze materials that may be used include those having the following composition and liquidus temperature (LT) and solidus temperatures (ST), where the composition amounts are provided in the form of weight percentages: 81.25 Au, 18 Ni, 0.75 Ti, LT=960 C., ST=945 C.; 82 Au, 16 Ni, 0.75 Mo, 1.25 V
LT=960 C, ST=940 C.; 20.5 Au, 66.5 Ni, 2.1 B, 5.5 Cr, 3.2 Si, 2.2 Fe, LT=971 C., ST=941 C.; 56.55 Ni, 30.5 Pd, 2.45 B, 10.5 Cr, LT=977 C., ST=941 C.; 92.75Cu, 3 Si, 2 Al, 2.25 Ti, LT=1,024 C., ST=969 C.; 82.3 Ni, 3.2 B, 7 Cr, 4.5 Si, 3 Fe, LT=1,024 C.; ST=969 C.; 96.4 Au, 3 Ni, 0.6 Ti, LT=1,030 C., ST=1,003 C; 67.0 Ti, 33.0 Ni, LT=980 C, ST=942 C; 70.0 Ti, 15 Ni, 15 Cu, LT=960 C, ST=910 C, 60.0 Ti, 25 Ni, 15 Cu, LT=940 C, ST=890 C;
92.75 Ag, 5.0 Cu, 1.0 Al, 1.25 Ti, LT=912 C, ST=860 C; 68.8 Ag, 26.7 Cu, 4.5 Ti, LT=900 C, ST=780 C; 63.0 Ag, 35.25 Cu, 1.75 Ti, LT=815 C, ST=780 C;
63.0 Ag, 34.25 Cu, 1.0 Sn, 1.75 Ti, LT=805 C, ST=775 C; and 59.0 Ag, 27.25 Cu, 12.5 In, 1.25 Ti, LT=715 C, ST=605 C.
LT=960 C, ST=940 C.; 20.5 Au, 66.5 Ni, 2.1 B, 5.5 Cr, 3.2 Si, 2.2 Fe, LT=971 C., ST=941 C.; 56.55 Ni, 30.5 Pd, 2.45 B, 10.5 Cr, LT=977 C., ST=941 C.; 92.75Cu, 3 Si, 2 Al, 2.25 Ti, LT=1,024 C., ST=969 C.; 82.3 Ni, 3.2 B, 7 Cr, 4.5 Si, 3 Fe, LT=1,024 C.; ST=969 C.; 96.4 Au, 3 Ni, 0.6 Ti, LT=1,030 C., ST=1,003 C; 67.0 Ti, 33.0 Ni, LT=980 C, ST=942 C; 70.0 Ti, 15 Ni, 15 Cu, LT=960 C, ST=910 C, 60.0 Ti, 25 Ni, 15 Cu, LT=940 C, ST=890 C;
92.75 Ag, 5.0 Cu, 1.0 Al, 1.25 Ti, LT=912 C, ST=860 C; 68.8 Ag, 26.7 Cu, 4.5 Ti, LT=900 C, ST=780 C; 63.0 Ag, 35.25 Cu, 1.75 Ti, LT=815 C, ST=780 C;
63.0 Ag, 34.25 Cu, 1.0 Sn, 1.75 Ti, LT=805 C, ST=775 C; and 59.0 Ag, 27.25 Cu, 12.5 In, 1.25 Ti, LT=715 C, ST=605 C.
[0033] Example "nonactive" braze materials that may be used include those having the following composition and LT and ST, where the composition amounts are provided in the form of weight percentages: 52.5 Cu, 9.5 Ni, 38 Mn, LT=925 C., ST=880 C.; 31 Au, 43.5 Cu, 9.75 Ni, 9.75 Pd, 16 M, LT=949 C., ST=927 C.; 54 Ag, 21 Cu, 25 Pd, LT=950 C., ST=900 C.; 67.5 Cu, 9 Ni, 23.5 Mn, LT=955 C., ST=925 C.; 58.5 Cu, 10 Co, 31.5 Mn, LT=999 C., ST=896 C.; 35 Au, 31.5 Cu, 14 Ni, 10 Pd, 9.5 Mn, LT=1,004 C., ST=971 C.; 25 Su, 37 Cu, 10 Ni, 15 Pd, 13 Mn, LT=1,013 C., ST=970 C.; and 35 Au, 62 Cu, 3 Ni, LT=1,030 C., ST=1,000 C.
[0034] Braze materials suitable for use in accordance with the present disclosure can be active and react with the diamond table 124. In an example embodiment, where such an active braze material is used, the braze material can react with the material of the diamond table 124 to form a reaction product therein and/or between it and the adjacent substrate 120. The presence of such a reaction product can operate to enhance the thermal and/or mechanical properties of the diamond table 124. For example, where the braze material includes silicon or titanium and the diamond table 124 comprises a polycrystalline diamond ultra-hard phase, the silicon or titanium in the braze material can react with the carbon in the diamond to form silicon carbide (SiC) or titanium carbide (TiC).
[0035] In some embodiments, the braze alloy 220 may be doped and/or infiltrated with various materials to enhance the bond between the substrate 120 and the diamond table 124 and/or optimize the CTE of the braze alloy 220. Suitable doping or infiltration materials include a ceramic, a metal with high ductility or yield stress, a polymeric material, or a mixture or combination thereof. Suitable ceramics that may be used to dope the braze alloy 220 include, but are not limited to, tungsten carbide, silicon carbide, diamond, nanodiamond, nanocarbon, graphene, carbon nanotubes, and the like.
Suitable metals that may be used to dope the braze alloy 220 include, but are not limited to, copper, silver, gold, nickel, and any combination thereof.
Suitable metals that may be used to dope the braze alloy 220 include, but are not limited to, copper, silver, gold, nickel, and any combination thereof.
[0036] In preparation for the brazing process, the braze alloy 220 may be deposited at various locations on the cutter 200 to ensure a strong bond between the substrate 120 and the diamond table 124. Portions of the braze alloy 220, for example, may be deposited on outer surfaces of the diamond table 124, such as on the bottom surface 130, the end 210, the transition surface 214, and any locations therebetween. The braze alloy 220 may also be applied to the inner surfaces of the hole 204 and on the first end 202a (i.e., the top surface 128) of the substrate 120. In some embodiments, an amount of the braze alloy 220 may be deposited within the hole 204 via the opening at the second end 202b (i.e., when the bottom 206 is omitted) or placed at the bottom 206 of the hole 204. In such embodiments, upon melting the braze alloy 220 during the brazing process, the liquefied braze alloy 220 may migrate due to capillary effect and fill in the gap 218 between the substrate 120 and the diamond table 124.
[0037] In some embodiments, the substrate 120 may be made of a material that exhibits a CTE that is greater than the CTE of the material of the diamond table 124. For example, the substrate 120 may comprise cemented-tungsten carbide (WC), which exhibits a CTE (10-6/ K) of about 4.5 to about 6.5, and the diamond table 124 may comprise TSP, which exhibits a CTE (10-6/ K) of about 1.0 to about 1.5. Accordingly, during the brazing process, which increases the temperature of the cutter 200 to a point at or above the melting temperature of the braze alloy 220, the hole 204 will thermally expand to a greater extent than the protrusion 208, and the dimensions of the gap 218 will correspondingly increase. As the braze alloy 220 melts, as mentioned above, it may be able to migrate into and fill the expanded gap 218 between the substrate 120 and the diamond table 124 via capillary action. Upon cooling the cutter 200, the gap 218 returns to standard temperature dimensions (i.e., dimensions when the cutter is at or around room temperature) and thereby places the solidified braze alloy 220 between the protrusion 208 and the hole 204 in compression.
[0038] A small portion of the braze alloy 220 may be forced out of the gap 218 under compression while the temperature of the braze alloy 220 is higher than its solidus temperature and the size of the hole 204 decreases with decreasing temperature. Once the temperature of the braze alloy 220 reaches and surpasses the solidus temperature during the cooling cycle of the brazing process, however, the substrate 120 (i.e., the hole 204) still contracts at a faster rate than the diamond table 124 (i.e., the protrusion 208), and thereby places the braze alloy 220 in compression.
[0039] In one example case, the size of the gap 218 may be about 0.002 inches at standard temperature, but at brazing temperature the size of the gap 218 may increase to about 0.004 inches. As a result, during cooling back to standard temperature almost half of the volume of the braze alloy 220 will be squeezed out of the braze joint between the protrusion 208 and the hole 204, and the braze alloy 220 that remains in the braze joint will be placed in compression and tightly secured between the protrusion 208 and adjacent portions of the substrate 120. Moreover, the resulting compressive forces on the braze alloy 220 at the gap 218 may remain up to at least the solidus temperature of the braze alloy 220.
[0040] As will be appreciated, placing the braze alloy 220 in compression may increase the shear strength of the cutter 200 and reduce the risk of detaching the diamond table 124 from the substrate 120 during downhole drilling operations. This is in contrast to standard brazing of a TSP diamond disc with a flat interface to a substrate, where there is no resulting compression on the braze alloy 220. In such cases, residual stresses may be present at the interface between the TSP diamond and the substrate due to a mismatch in CTE
between the TSP diamond, the braze alloy 220, and the substrate.
between the TSP diamond, the braze alloy 220, and the substrate.
[0041] According to one or more additional embodiments, the diamond table 124 may alternatively be coupled to the substrate 120 by generating an interference fit between the protrusion 208 and the hole 204. As will be appreciated, an interference fit between the protrusion 208 and the hole 204 may optionally avoid the need for conventional joining techniques, such as brazing or an HTHP press cycle configured to join the diamond table 124 to the substrate 120. Rather, the respective geometries of the protrusion 208 and the hole 204 and the respective CTE of the substrate 120 and the diamond table 124 may be selected such that the interference fit, alone, may be sufficient to maintain the diamond table 124 coupled to the substrate 120 during drilling operations.
[0042] In such embodiments, for instance, the hole width 216a may be smaller than the protrusion width 216b at standard temperature and may also be smaller over an expected range of drilling operating temperatures.
Commonly expected drilling operating temperatures at least at a point of contact between the diamond table 214 and the formation being cut can range between about 800 C and about 900 C at the tip or outer surface of the diamond table(s) 214. To achieve a robust interference fit for drilling, the hole width 216a will be smaller than the protrusion width 216b and will remain smaller even at temperatures exceeding the expected range of drilling operating temperatures.
Commonly expected drilling operating temperatures at least at a point of contact between the diamond table 214 and the formation being cut can range between about 800 C and about 900 C at the tip or outer surface of the diamond table(s) 214. To achieve a robust interference fit for drilling, the hole width 216a will be smaller than the protrusion width 216b and will remain smaller even at temperatures exceeding the expected range of drilling operating temperatures.
[0043] Moreover, in such embodiments, the substrate 120 may again be made of a material (e.g., cemented-WC) that exhibits a CTE that is greater than the CTE of the material (e.g., TSP) of the diamond table 124. The interference fit between the protrusion 208 and the hole 204 may be generated by various methods. In one embodiment, for instance, the interference fit may be generated by heating the substrate 120 to a temperature above that of the expected range of drilling operating temperatures. This will allow the hole to thermally expand and otherwise increase the size of the hole width 216a to a dimension greater than that of the protrusion width 216b. At that point, the hole 204 may be large enough to receive the protrusion 208. Once the protrusion 208 is inserted into the hole 204, the substrate 120 may then be cooled back to standard temperature, thereby allowing the hole 204 to thermally contract as the size of the hole width 216a decreases to standard temperature dimensions. At standard temperature, the protrusion 208 may be secured within the hole 204 via an interference fit that may withstand the expected range of drilling operating temperatures.
[0044] In other cases, the interference fit may be generated by cooling the diamond table 124 such that the protrusion 208 thermally contracts and the dimensions of the protrusion width 216b otherwise become smaller than that of the hole width 216a. At that point, the protrusion 208 may be small enough to be received within the hole 204. Once the protrusion 208 is inserted into the hole 204, the diamond table 124 may then be allowed to warm back up to standard temperature, whereby the protrusion 208 thermally expands to the protrusion width 216b standard temperature dimensions and an interference fit is thereby generated at the interface between the protrusion 208 and the hole 204. In yet other cases, the interference fit may be generated by a combination of heating the substrate 120 to a temperature above that of the expected range of drilling operating temperatures and cooling the diamond table 124.
[0045] In even further embodiments, the interference fit may be generated by heating both the substrate 120 the diamond table 124 to a temperature above that of the expected range of drilling operating temperatures. In such embodiments, because of the large difference in CTE
between the substrate 120 the diamond table 124, the hole 204 will thermally expand at a rate much greater than that of the protrusion 208, thereby allowing the hole 204 to eventually be large enough to receive the protrusion 208.
Cooling the cutter 200 will then result in an interference fit between the hole 204 and the protrusion 208.
between the substrate 120 the diamond table 124, the hole 204 will thermally expand at a rate much greater than that of the protrusion 208, thereby allowing the hole 204 to eventually be large enough to receive the protrusion 208.
Cooling the cutter 200 will then result in an interference fit between the hole 204 and the protrusion 208.
[0046] With the interference fit successfully generated, there may be no need to braze the diamond table 124 to the substrate 120. In some embodiments, however, in addition to the interference fit, brazing may optionally be undertaken at the interface between the diamond table 124 to the substrate 120, without departing from the scope of the disclosure.
[0047] FIG. 2C is an isometric view of another embodiment of the diamond table 214. In the illustrated embodiment, the diamond table 124 may provide and otherwise define a plurality of protrusions 208, shown as a first protrusion 208a, a second protrusion 208b, and a third protrusion 208c. Each protrusion 208a-c protrudes or extends from the bottom surface 130 of the diamond table 124. Similar to the protrusion 208 of FIGS. 2A and 2B, each protrusion 208a-c may be sized to be received within a corresponding hole defined in the first end 202a (FIGS. 2A-2B) of the substrate 120 (FIGS. 2A-26).
While three protrusions 208a-c are depicted in FIG. 2C, it will be appreciated that more than three (or two) protrusion 208a-c may protrude from the bottom surface 130 of the diamond table 124, without departing from the scope of the present disclosure. Moreover, while the protrusions 208a-c are depicted as exhibiting a generally circular cross-section, any one of the protrusions 208a-c may alternatively each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
While three protrusions 208a-c are depicted in FIG. 2C, it will be appreciated that more than three (or two) protrusion 208a-c may protrude from the bottom surface 130 of the diamond table 124, without departing from the scope of the present disclosure. Moreover, while the protrusions 208a-c are depicted as exhibiting a generally circular cross-section, any one of the protrusions 208a-c may alternatively each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
[0048] Referring now to FIGS. 3A and 3B, with continued reference to FIGS. 2A-2B, illustrated are cross-sectional side views of the cutter 200, according to one or more embodiments of the disclosure. Once the diamond table 124 is successfully coupled to the substrate 120 via brazing or an interference fit, or a combination of the two, as generally described above, the remaining open portions of the hole 204 defined through the substrate 120 may serve several purposes. As shown in FIG. 3A, for example, the hole 204 may be at least partially filled with a thermally conductive material 302. The thermally conductive material 302 may draw thermal energy 304 away from the cutter 200 and, more particularly, from the diamond table 124 during operation. The cutter 200 may be secured within a corresponding cutter pocket 118 (FIG. 1) provided on the drill bit 100 (FIG. 1) with the second end 202b of the substrate 120 in contact with or otherwise adjacent the cutter pocket 118. As a result, the thermally conductive material 302 may also be in thermal communication with the body 102 (FIG. 1) of the drill bit 100 and may be able to transfer thermal energy 304 from the cutter 200 to the bit body 102 during operation.
[0049] Suitable materials that may be used as the thermally conductive material 302 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., aluminum, gold, copper, silver, steel, stainless steel, nickel, tungsten, titanium or alloys thereof), diamond, alumina, graphite, graphene, nanomaterials of the foregoing, and any combination thereof. Generally, the thermally conductive material 302 may comprise any material that exhibits thermal conductivity of 102 W/m=K or greater. Drawing thermal energy 304 away from the cutter 200 and using the bit body 102 (FIG.
1) as a heat sink may prove advantageous in mitigating or preventing graphitization of the diamond table 124, which would otherwise make the diamond table 124 less wear-resistant.
1) as a heat sink may prove advantageous in mitigating or preventing graphitization of the diamond table 124, which would otherwise make the diamond table 124 less wear-resistant.
[0050] With reference to FIG. 3B, in some embodiments, the hole 204 may alternatively be at least partially filled with one or more temperature-sensitive materials 306, shown as a first temperature-sensitive material 306a and a second temperature-sensitive material 306b. The temperature-sensitive materials 306a,b may each comprise a material that undergoes a phase transformation and/or a crystalline structure change at a known or fixed temperature. By examining the temperature-sensitive materials 306a,b following operation of the drill bit 100 (FIG. 1), it can be ascertained whether the drill bit 100 operated in downhole conditions that exceeded the known temperature.
[0051] In one or more embodiments, for example, the first temperature-sensitive material 306a may comprise a powder material capable of passing through a phase change, such as from a solid state to a liquid or molten state, at a specific temperature. Upon returning the drill bit 100 (FIG. 1) back to the surface, the cutter 200 may be removed and the first temperature-sensitive material 306a may be analyzed. If the first temperature-sensitive material 306a is a solid mass, that may be an indication that the drill bit 100 operated in a downhole temperature that exceeded the known melting temperature of first temperature-sensitive material 306a, which melted the powder and resulted in the solid mass upon cooling. If, however, the first temperature-sensitive material 306a remains a powder, that may be an indication that drilling conditions at the drill bit 100 failed to exceed the melting temperature of first temperature-sensitive material 306a.
[0052] Suitable phase changing materials that may be used as the first temperature-sensitive material 306a include, but are not limited to, aluminum, copper, nickel, manganese, lead, tin, cobalt, silver, phosphorous, zinc, any alloys thereof, and any mixtures of the metallic alloys. Other suitable phase changing materials include salts of sodium and potassium (e.g., KOH, KNO3, NaNO3, NaOH) or a combination thereof, such as NaCI (26.8%) / NaOH or NaCI
(42.5%) / KCI (20.5) / MgC12. As will be appreciated, a plurality of phase changing materials having known melting temperatures may be arranged in the hole 204 and post-analysis of the cutter 200 and the condition of the various phase change materials may reveal specific operating temperatures that drill bit 100 experienced during operation.
(42.5%) / KCI (20.5) / MgC12. As will be appreciated, a plurality of phase changing materials having known melting temperatures may be arranged in the hole 204 and post-analysis of the cutter 200 and the condition of the various phase change materials may reveal specific operating temperatures that drill bit 100 experienced during operation.
[0053] In other embodiments, the second temperature-sensitive material 306b may comprise a material that changes crystalline structure upon reaching and exceeding a known crystalline transition temperature. Upon returning the drill bit 100 (FIG. 1) to the surface following operation, the cutter 200 may be removed and the second temperature-sensitive material 306b may be analyzed. If the crystalline structure of the second temperature-sensitive material 306b has changed, that may be an indication that the drill bit 100 operated in a downhole temperature that exceeded the known crystalline transition temperature of the second temperature-sensitive material 306b. If, however, the crystalline structure of the second temperature-sensitive material 306b remains the same, that may be an indication that drilling conditions at the drill bit 100 failed to exceed the known crystalline transition temperature of the second temperature-sensitive material 306b.
[0054] In at least one embodiment, for example, the second temperature-sensitive material 306b may comprise a-iron (i.e., alpha-iron or 'ferrite'), which undergoes a crystalline phase transition at around 912 C
from body-centered cubic (BCC) to the face-centered cubic (FCC) configuration of y-iron (i.e. gamma-iron or laustenitel This is commonly called an allotropic transformation. Other suitable temperature-sensitive materials that may undergo a crystalline allotropic phase transition include, but are not limited to, zirconium, titanium, and cobalt. Moreover, as will be appreciated, a plurality of materials that change crystalline structure upon reaching and exceeding a known crystalline transition temperature may be arranged in the hole 204 and post-analysis of the cutter 200 and the condition of the various materials may reveal specific operating temperatures that drill bit 100 experienced during operation.
from body-centered cubic (BCC) to the face-centered cubic (FCC) configuration of y-iron (i.e. gamma-iron or laustenitel This is commonly called an allotropic transformation. Other suitable temperature-sensitive materials that may undergo a crystalline allotropic phase transition include, but are not limited to, zirconium, titanium, and cobalt. Moreover, as will be appreciated, a plurality of materials that change crystalline structure upon reaching and exceeding a known crystalline transition temperature may be arranged in the hole 204 and post-analysis of the cutter 200 and the condition of the various materials may reveal specific operating temperatures that drill bit 100 experienced during operation.
[0055] Referring now to FIG. 4, illustrated is an exploded cross-sectional side view of a cutter assembly 400, according to one or more embodiments. The cutter assembly 400 may be installed on a portion of the drill bit 100 of FIG. 1 and, more particularly, within a cutter pocket 118 defined on a blade 104 of the drill bit 100. As illustrated, the cutter assembly 400 may include a cutter 402 and a post 404. The cutter 402 may be similar to or the same as the cutter 116 of FIG. 1B, and therefore may be best understood with reference thereto. Similar to the cutter 116 of FIG. 1B, for example, the cutter 402 may include the substrate 120 and the diamond table 124.
[0056] As illustrated, the substrate 120 may provide a first end 406a and a second end 406b opposite the first end 406a. The first end 406a is the same as or similar to the top surface 128 of the substrate 120 depicted in FIG.
1B. At least one post receptacle 408 may be defined within the substrate 120 and extend at least partially between the first and second ends 406a,b. As will be appreciated, the post receptacle 408 may be the same as or similar to the hole 204 of FIGS. 2A-2B and 3A-3B. In some embodiments, as illustrated, the post receptacle 408 may extend all the way between the first and second ends 406a,b and thereby defining a corresponding elongate channel that extends through the entire length of the substrate 120. In some embodiments, at least one table post receptacle 410 may be defined within the diamond table 124 and extend at least partially between the working surface 126 and the bottom surface 130 of the diamond table 124. As illustrated, the table post receptacle 410 may generally align with the post receptacle 408. In other embodiments, however, the table post receptacle 410 may be omitted from the diamond table 124.
1B. At least one post receptacle 408 may be defined within the substrate 120 and extend at least partially between the first and second ends 406a,b. As will be appreciated, the post receptacle 408 may be the same as or similar to the hole 204 of FIGS. 2A-2B and 3A-3B. In some embodiments, as illustrated, the post receptacle 408 may extend all the way between the first and second ends 406a,b and thereby defining a corresponding elongate channel that extends through the entire length of the substrate 120. In some embodiments, at least one table post receptacle 410 may be defined within the diamond table 124 and extend at least partially between the working surface 126 and the bottom surface 130 of the diamond table 124. As illustrated, the table post receptacle 410 may generally align with the post receptacle 408. In other embodiments, however, the table post receptacle 410 may be omitted from the diamond table 124.
[0057] The post 404 may provide a first post end 412a and a second post end 412b opposite the first post end 412a. As illustrated, the second post end 412b of the post 404 may extend into the blade 104 and may otherwise be secured within a post orifice 414 defined in the bottom of the cutter pocket 118.
The post 404 may be secured within the post orifice 414 by a variety of attachment means including, but not limited to, brazing, welding, industrial adhesives, threading, one or more mechanical fasteners (e.g., snap rings, pins, screws, etc.), shrink-fitting, interference fitting, and any combination thereof. In some embodiments, however, the post 404 may comprise a molded portion that extends out of the cutter pocket 118. In yet other embodiments, the geometry and dimensions of the post 404 may be machined into the cutter pocket 118.
The post 404 may be secured within the post orifice 414 by a variety of attachment means including, but not limited to, brazing, welding, industrial adhesives, threading, one or more mechanical fasteners (e.g., snap rings, pins, screws, etc.), shrink-fitting, interference fitting, and any combination thereof. In some embodiments, however, the post 404 may comprise a molded portion that extends out of the cutter pocket 118. In yet other embodiments, the geometry and dimensions of the post 404 may be machined into the cutter pocket 118.
[0058] In some embodiments, as illustrated, the post 404 may provide and otherwise define an enlarged portion 416 (shown in dashed) at the second post end 412b. The enlarged portion 416 may take the form of any shape or configuration, and may prove advantageous in increasing the surface area of the post 404 within the blade 104. Such an increased surface area may provide greater pull-out resistance and for the post 404 and increase the rigidity of the coupling engagement between the cutter 402 and the cutter pocket 118.
[0059] The post 404 may be sized and otherwise configured to be received within the post receptacle 408 of the substrate 120. While only one post 404 is depicted in FIG. 4, it will be appreciated that more than one post may protrude from the cutter pocket 118, without departing from the scope of the present disclosure. In such embodiments, the plurality of posts 404 may be received within a corresponding plurality of post receptacles 408 defined in the second end 406b of the substrate 120.
[0060] In some embodiments, as illustrated, the post 404 may exhibit a generally circular cross-section and the post receptacle 408 (and the table post receptacle 410, if used) may correspondingly exhibit a circular cross-section.
In other embodiments, however, the post 404 and the post receptacle 408 (and the table post receptacle 410, if used) may each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
In other embodiments, however, the post 404 and the post receptacle 408 (and the table post receptacle 410, if used) may each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
[0061] The post receptacle 408 may exhibit a first width 418a and the post 404 may exhibit a second width 418b. In embodiments where the post receptacle 408 and the post 404 are circular, as discussed above, the first and second widths 418a,b may comprise corresponding diameters for the post receptacle 408 and the post 404, respectively. In embodiments where the post receptacle 408 and the post 404 are polygonal, however, the first and second widths 418a,b may comprise the largest distance between opposing sides of each respective structure.
[0062] In some embodiments, the cutter 402, or at least the substrate 120, may be coupled to the cutter pocket 118 by brazing the post 404 into the post receptacle 408. In other embodiments, however, the cutter 402 may be coupled to the cutter pocket 118 by generating an interference fit between the post 404 and the post receptacle 408. As will be appreciated, an interference fit between the post 404 and the post receptacle 408 may optionally avoid the need for conventional joining techniques, such as brazing the cutter 402 into the cutter pocket 118. Rather, the respective geometries of the post 404 and the post receptacle 408 and the respective CTE of the substrate 120 and the post 404 may be selected such that the interference fit, alone, may be sufficient to maintain the substrate 120 coupled to post 404 during drilling operations.
[0063] In such embodiments, for instance, the first width 418a may be smaller than the second width 418b at standard temperature and may also be smaller over an expected range of drilling operating temperatures. In other words, in order to achieve a robust interference fit for drilling, the first width 418a is smaller than the second width 418b and will remain smaller even at temperatures exceeding the expected range of drilling operating temperatures.
[0064] Moreover, in such embodiments, the substrate 120 may be made of a material (e.g., WC) that exhibits a CTE that is greater than the CTE
of the material of the post 404. The interference fit between the post 404 and the post receptacle 408 may be generated by various methods. In one embodiment, for instance, the interference fit may be generated by heating the substrate to a temperature above that of the expected range of drilling operating temperatures. This will allow the post receptacle 408 to thermally expand and otherwise increase the size of the first width 418a to a dimension greater than that of the second width 418b. At that point, the post receptacle 408 may be large enough to receive the post 404. Once the post 404 is inserted into the post receptacle 408, the substrate 120 may then be cooled back to standard temperature, thereby allowing the post receptacle 408 to thermally contract as the size of the first width 418a decreases to standard temperature dimensions.
At standard temperature, the post 404 may be secured within the post receptacle 408 via an interference fit that may withstand the expected range of drilling operating temperatures.
of the material of the post 404. The interference fit between the post 404 and the post receptacle 408 may be generated by various methods. In one embodiment, for instance, the interference fit may be generated by heating the substrate to a temperature above that of the expected range of drilling operating temperatures. This will allow the post receptacle 408 to thermally expand and otherwise increase the size of the first width 418a to a dimension greater than that of the second width 418b. At that point, the post receptacle 408 may be large enough to receive the post 404. Once the post 404 is inserted into the post receptacle 408, the substrate 120 may then be cooled back to standard temperature, thereby allowing the post receptacle 408 to thermally contract as the size of the first width 418a decreases to standard temperature dimensions.
At standard temperature, the post 404 may be secured within the post receptacle 408 via an interference fit that may withstand the expected range of drilling operating temperatures.
[0065] In other cases, the interference fit may be generated by cooling the post 404 such that the post 404 thermally contracts and the dimensions of the second width 418b otherwise become smaller than that of the first width 418a. At that point, the post receptacle 408 may be large enough to receive the post 404, or otherwise the post 404 may be small enough to be received within the post receptacle 408. Once the post 404 is inserted into the post receptacle 408, the post 404 may then be allowed to warm back up to standard temperature, whereby the post 404 thermally expands to second width 418b standard temperature dimensions and an interference fit is thereby generated at the interface between the post 404 and the post receptacle 408. In yet other cases, the interference fit may be generated by a combination of heating the substrate 120 to a temperature above that of the expected range of drilling operating temperatures and cooling the post 404.
[0066] In even further embodiments, the interference fit may be generated by heating both the substrate 120 and the post 404 to a temperature above that of the expected range of drilling operating temperatures, without departing from the scope of the disclosure. In such embodiments, because of the large difference in CTE between the substrate 120 the post 404, the post receptacle 408 will thermally expand at a rate much greater than the post 404, thereby allowing the post receptacle 408 to eventually be large enough to receive the post 404. Cooling the cutter 402 will then result in an interference fit between the post receptacle 408 and the post 404.
[0067] With the interference fit successfully generated, there may be no need to braze the post 404 to the substrate 120. In some embodiments, however, in addition to the interference fit, brazing may optionally be undertaken at the interface between the post 404 to the substrate 120 or at the interface between the substrate 120 and the cutter pocket 118, without departing from the scope of the disclosure.
[0068] In some embodiments, the diamond table 124 may be coupled to the substrate 120 via conventional means, such as brazing or an HTHP
process. In other embodiments, however, the length of the post 404 may be sufficiently long to extend through the post receptacle 408 and at least partially into the table post receptacle 410 and thereby allow an attachment point for the diamond table 124. In such embodiments, the diamond table 124 may be brazed to the substrate 120 via the post 404. In other embodiments, however, the diamond table 124 may be coupled to the substrate 120 via an interference fit with the post 404. More particularly, the table post receptacle 410 may exhibit a third width 418c, which may comprise a diameter if the table post receptacle 410 and the post 404 are each circular, or may otherwise comprise the largest distance between opposing sides of table post receptacle 410 in the event the table post receptacle 410 and the post 404 are each polygonal.
process. In other embodiments, however, the length of the post 404 may be sufficiently long to extend through the post receptacle 408 and at least partially into the table post receptacle 410 and thereby allow an attachment point for the diamond table 124. In such embodiments, the diamond table 124 may be brazed to the substrate 120 via the post 404. In other embodiments, however, the diamond table 124 may be coupled to the substrate 120 via an interference fit with the post 404. More particularly, the table post receptacle 410 may exhibit a third width 418c, which may comprise a diameter if the table post receptacle 410 and the post 404 are each circular, or may otherwise comprise the largest distance between opposing sides of table post receptacle 410 in the event the table post receptacle 410 and the post 404 are each polygonal.
[0069] To generate an interference fit, the third width 418c may be smaller than the second width 418b at standard temperature and may also be smaller over an expected range of drilling operating temperatures. The interference fit may be generated as generally described above, such as by heating the diamond table 124 to a temperature above that of the expected range of drilling operating temperatures, which allows the table post receptacle 410 to thermally expand and otherwise increase the size of the third width 418c to a dimension greater than that of the second width 418b. At that point, the table post receptacle 410 may be large enough to receive the post 404, and once it cools, the table post receptacle 410 thermally contracts to secure the post 404 via an interference fit that may withstand the expected range of drilling operating temperatures. In other cases, the interference fit may be similarly generated by cooling the post 404, or a combination of heating the diamond table 124 and cooling the post 404. In even further embodiments, the interference fit may be generated by heating both the diamond table 124 the post 404 to a temperature above that of the expected range of drilling operating temperatures, as discussed above.
[0070] With the interference fit successfully generated, there may be no need to braze the post 404 to the diamond table 124. In some embodiments, however, in addition to the interference fit, brazing may optionally be undertaken at the interface between the post 404 to the diamond table 124, without departing from the scope of the disclosure.
[0071] Referring now to FIG. 5, illustrated is an exploded cross-sectional side view of another cutter assembly 500, according to one or more embodiments. The cutter assembly 500 may be installed on a portion of the drill bit 100 of FIG. 1 and, more particularly, on a blade 104 of the drill bit 100.
The cutter assembly 500 may include a cutter 502 and a post 504. Unlike the cutters 116, 200, and 400 of FIGS. 1A-1B, 2A-2B, 3A-3B, and 4, the cutter 502 may include only the diamond table 124. As illustrated, the diamond table 124 may provide the working surface 126 and a bottom surface 130 opposite the working surface 126. At least one table post receptacle 506 may be defined within the diamond table 124 and extend at least partially between the working surface 126 and the bottom surface 130 of the diamond table 124. In at least one embodiment, the table post receptacle 506 may extend entirely through the diamond table 124 between the working and bottom surfaces 126, 130.
The cutter assembly 500 may include a cutter 502 and a post 504. Unlike the cutters 116, 200, and 400 of FIGS. 1A-1B, 2A-2B, 3A-3B, and 4, the cutter 502 may include only the diamond table 124. As illustrated, the diamond table 124 may provide the working surface 126 and a bottom surface 130 opposite the working surface 126. At least one table post receptacle 506 may be defined within the diamond table 124 and extend at least partially between the working surface 126 and the bottom surface 130 of the diamond table 124. In at least one embodiment, the table post receptacle 506 may extend entirely through the diamond table 124 between the working and bottom surfaces 126, 130.
[0072] The post 504 may provide a first post end 508a and a second post end 508b opposite the first post end 508a. As illustrated, the second post end 508b of the post 504 may extend into the blade 104 and may otherwise be secured within a post orifice 510 defined in the blade 104. In some embodiments, as illustrated, the post orifice 510 may be defined in a body protrusion 512 extending from the outer surface of the blade 104. The body protrusion 512 may form an integral part of the bit body 102 (FIG. 1) and may otherwise be molded as a feature of the blade 104. The body protrusion 512 may provide a location to house the post 504 and may otherwise replace the substrate 120.
[0073] The post 504 may be secured within the post orifice 510 by a variety of attachment means including, but not limited to, brazing, welding, industrial adhesives, threading, one or more mechanical fasteners (e.g., snap rings, pins, screws, etc.), shrink-fitting, interference fitting, and any combination thereof. In some embodiments, however, the post 504 may comprise a molded portion of the blade 104 that extends away from the body protrusion 512. In yet other embodiments, the geometry and dimensions of the post 504 may be machined into the body protrusion 512.
[0074] In some embodiments, as illustrated, the post 504 may provide and otherwise define an enlarged portion 514 (shown in dashed) at the second post end 508b. The enlarged portion 514 may take the form of any shape or configuration, and may prove advantageous in increasing the surface area of the post 504 within the blade 104. Such an increased surface area may provide greater pull-out resistance and for the post 504 and increase the rigidity of the coupling engagement between the cutter 502 and the body protrusion 512.
[0075] The post 504 may be sized and otherwise configured to be received within the table post receptacle 506 of the diamond table 124. While only one post 504 is depicted in FIG. 5, it will be appreciated that more than one post 504 may protrude from the body protrusion 512, without departing from the scope of the present disclosure. In such embodiments, the plurality of posts 504 may be received within a corresponding plurality of table post receptacles 506 defined in the bottom surface 130 of the diamond table 124.
[0076] In some embodiments, as illustrated, the post 504 may exhibit a generally circular cross-section and the table post receptacle 506 may correspondingly exhibit a circular cross-section. In other embodiments, however, the post 504 and the table post receptacle 506 may each exhibit other cross-sectional shapes including, but not limited to, oval, ovoid, polygonal (e.g., triangular, square, rectangular, pentagonal, etc.), or any combination thereof, without departing from the scope of the disclosure.
[0077] The table post receptacle 506 may exhibit a first width 516a and the post 504 may exhibit a second width 516b. In embodiments where the table post receptacle 506 and the post 504 are circular, as discussed above, the first and second widths 516a,b may comprise corresponding diameters for the table post receptacle 506 and the post 504, respectively. In embodiments where the table post receptacle 506 and the post 504 are polygonal, however, the first and second widths 516a,b may comprise the largest distance between opposing sides of each respective structure.
[0078] In some embodiments, the diamond table 124 may be coupled to the body protrusion 512 by brazing the post 504 into the table post receptacle 506. In other embodiments, however, the diamond table 124 may be coupled to the body protrusion 512 by generating an interference fit between the post 504 and the table post receptacle 506. As will be appreciated, an interference fit between the post 504 and the table post receptacle 506 may optionally avoid the need for conventional joining techniques, such as brazing the diamond table to the body protrusion 512. Rather, the respective geometries of the post 504 and the table post receptacle 506 and the respective CTE of the diamond table 124 and the post 504 may be selected such that the interference fit, alone, may be sufficient to maintain the diamond table 124 coupled to post 504 during drilling operations.
[0079] In such embodiments, for instance, the first width 516a may be smaller than the second width 516b at standard temperature and may also be smaller over an expected range of drilling operating temperatures. In other words, in order to achieve a robust interference fit for drilling, the first width 516a is smaller than the second width 516b and will remain smaller even at temperatures exceeding the expected range of drilling operating temperatures.
[0080] The interference fit between the post 504 and the table post receptacle 506 may be generated by various methods. In one embodiment, for instance, the interference fit may be generated by heating the diamond table 124 to a temperature above that of the expected range of drilling operating temperatures. This will allow the table post receptacle 506 to thermally expand and otherwise increase the size of the first width 516a to a dimension greater than that of the second width 516b. At that point, the table post receptacle may be large enough to receive the post 504. Once the post 504 is inserted into the table post receptacle 506, the diamond table 124 may then be cooled back to standard temperature, thereby allowing the table post receptacle 506 to thermally contract as the size of the first width 516a decreases to standard temperature dimensions. At standard temperature, the post 504 may be secured within the table post receptacle 506 via an interference fit that may withstand the expected range of drilling operating temperatures.
[0081] In other cases, the interference fit may be generated by cooling the post 504 such that the post 504 thermally contracts and the dimensions of the second width 516b otherwise become smaller than that of the first width 516a. At that point, the table post receptacle 506 may be large enough to receive the post 504, or otherwise the post 504 may be small enough to be received within the table post receptacle 506. Once the post 504 is inserted into the table post receptacle 506, the post 504 may then be allowed to warm back up to standard temperature, whereby the post 504 thermally expands to second width 516b standard temperature dimensions and an interference fit is thereby generated at the interface between the post 504 and the table post receptacle 506. In yet other cases, the interference fit may be generated by a combination of heating the diamond table 124 to a temperature above that of the expected range of drilling operating temperatures and cooling the post 504.
[0082] With the interference fit successfully generated, there may be no need to braze the diamond table 124 to the post 504. In some embodiments, however, in addition to the interference fit, brazing may optionally be undertaken at the interface between the post 504 to the diamond table 124 or at the interface between the diamond table 124 and the body protrusion 512, without departing from the scope of the disclosure.
[0083] Embodiments disclosed herein include:
[0084] A. A cutter for a drill bit that includes a substrate defining a hole at least partially through the substrate, a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP), and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
[0085] B. A cutter for a drill bit that includes a substrate defining a hole at least partially through the substrate, a diamond table, and a protrusion extending from the diamond table at least partially into the hole and in direct mechanical contact with the substrate via an interference fit between the protrusion and the substrate when at STP.
[0086] C. A drill bit that includes a bit body having one or more blades extending therefrom, and a plurality of cutters secured to the one or more blades, wherein at least one cutter of the plurality of cutters includes a substrate defining a hole at least partially through the substrate, a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP), and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
[0087] Each of embodiments A, B, and C may have one or more of the following additional elements in any combination: Element 1: wherein the interface between the diamond table and the substrate further comprises a planar face about the protrusion on the diamond table in close engagement with a corresponding planar face about the hole on the substrate, and wherein another portion of the braze alloy secures the planar face of the diamond table to the planar face of the substrate. Element 2: wherein the protrusion on the diamond table and the hole on the substrate are both circular, and the gap is a substantially constant-radial gap between the protrusion and the substrate.
Element 3: wherein the diamond table has a first coefficient of thermal expansion (CTE) and the substrate has a second CTE greater than the first CTE.
Element 4: wherein the diamond table comprises a plurality of protrusions.
Element 5: wherein the braze alloy remains in compression up to at least a solidus temperature of the braze alloy. Element 6: further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy.
Element 7: wherein the thermally conductive material or the temperature-sensitive material is in direct mechanical contact with an end of the protrusion.
Element 3: wherein the diamond table has a first coefficient of thermal expansion (CTE) and the substrate has a second CTE greater than the first CTE.
Element 4: wherein the diamond table comprises a plurality of protrusions.
Element 5: wherein the braze alloy remains in compression up to at least a solidus temperature of the braze alloy. Element 6: further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy.
Element 7: wherein the thermally conductive material or the temperature-sensitive material is in direct mechanical contact with an end of the protrusion.
[0088] Element 8: wherein the diamond table defines the protrusion.
Element 9: wherein the protrusion comprises a post extending all the way through the hole on the substrate and having one end coupled to the diamond table and another end opposite the diamond table for coupling to a cutter pocket of a drill bit. Element 10: wherein the diamond table comprises a hole aligned with the hole on the substrate, and wherein the post extends into the hole on the diamond table. Element 11: further comprising a braze alloy between a planar face about the protrusion on the diamond table and a corresponding planar face about the hole on the substrate, wherein the braze alloy secures the planar face of the diamond table to the planar face of the substrate.
Element 9: wherein the protrusion comprises a post extending all the way through the hole on the substrate and having one end coupled to the diamond table and another end opposite the diamond table for coupling to a cutter pocket of a drill bit. Element 10: wherein the diamond table comprises a hole aligned with the hole on the substrate, and wherein the post extends into the hole on the diamond table. Element 11: further comprising a braze alloy between a planar face about the protrusion on the diamond table and a corresponding planar face about the hole on the substrate, wherein the braze alloy secures the planar face of the diamond table to the planar face of the substrate.
[0089] Element 12: wherein the interface between the diamond table and the substrate further comprises a planar face about the protrusion on the diamond table in close engagement with a corresponding planar face about the hole on the substrate, and wherein a braze alloy at the interface secures the planar face of the diamond table to the planar face of the substrate. Element 13: wherein the protrusion on the diamond table and the hole on the substrate are both circular, and the gap is a substantially constant-radial gap between the protrusion and the substrate. Element 14: wherein the diamond table has a first coefficient of thermal expansion (CTE) and the substrate has a second CTE
greater than the first CTE. Element 15: wherein the compression on the braze alloy is maintained up to at least a solidus temperature of the braze alloy.
Element 16: further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy. Element 17: further comprising a post extending from a cutter pocket on the one or more blades and secured within the hole of the substrate.
greater than the first CTE. Element 15: wherein the compression on the braze alloy is maintained up to at least a solidus temperature of the braze alloy.
Element 16: further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy. Element 17: further comprising a post extending from a cutter pocket on the one or more blades and secured within the hole of the substrate.
[0090] By way of non-limiting example, exemplary combinations applicable to A, B, and C include: Element 9 with Element 10.
[0091] Therefore, the disclosed systems and methods are well adapted to attain the ends and advantages mentioned as well as those that are inherent therein. The particular embodiments disclosed above are illustrative only, as the teachings of the present disclosure may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular illustrative embodiments disclosed above may be altered, combined, or modified and all such variations are considered within the scope of the present disclosure. The systems and methods illustratively disclosed herein may suitably be practiced in the absence of any element that is not specifically disclosed herein and/or any optional element disclosed herein. While compositions and methods are described in terms of "comprising," "containing," or "including" various components or steps, the compositions and methods can also "consist essentially of" or "consist of"
the various components and steps. All numbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, "from about a to about b," or, equivalently, "from approximately a to b," or, equivalently, "from approximately a-b") disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values. Also, the terms in the claims have their plain, ordinary meaning unless otherwise explicitly and clearly defined by the patentee. Moreover, the indefinite articles "a" or "an," as used in the claims, are defined herein to mean one or more than one of the elements that it introduces. If there is any conflict in the usages of a word or term in this specification and one or more patent or other documents that may be incorporated herein by reference, the definitions that are consistent with this specification should be adopted.
the various components and steps. All numbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, "from about a to about b," or, equivalently, "from approximately a to b," or, equivalently, "from approximately a-b") disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values. Also, the terms in the claims have their plain, ordinary meaning unless otherwise explicitly and clearly defined by the patentee. Moreover, the indefinite articles "a" or "an," as used in the claims, are defined herein to mean one or more than one of the elements that it introduces. If there is any conflict in the usages of a word or term in this specification and one or more patent or other documents that may be incorporated herein by reference, the definitions that are consistent with this specification should be adopted.
[0092] As used herein, the phrase "at least one of" preceding a series of items, with the terms "and" or "or" to separate any of the items, modifies the list as a whole, rather than each member of the list (i.e., each item). The phrase "at least one of" allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items. By way of example, the phrases "at least one of A, B, and C" or "at least one of A, B, or C" each refer to only A, only B, or only C;
any combination of A, B, and C; and/or at least one of each of A, B, and C.
any combination of A, B, and C; and/or at least one of each of A, B, and C.
Claims (20)
1. A cutter for a drill bit, the cutter comprising:
a substrate defining a hole at least partially through the substrate;
a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP); and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
a substrate defining a hole at least partially through the substrate;
a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP); and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
2. The cutter of claim 1, wherein the interface between the diamond table and the substrate further comprises a planar face about the protrusion on the diamond table in close engagement with a corresponding planar face about the hole on the substrate, and wherein another portion of the braze alloy secures the planar face of the diamond table to the planar face of the substrate.
3. The cutter of claim 1, wherein the protrusion on the diamond table and the hole on the substrate are both circular, and the gap is a substantially constant-radial gap between the protrusion and the substrate.
4. The cutter of claim 1, wherein the diamond table has a first coefficient of thermal expansion (CTE) and the substrate has a second CTE
greater than the first CTE.
greater than the first CTE.
5. The cutter of claim 1, wherein the diamond table comprises a plurality of protrusions.
6. The cutter of claim 1, wherein the braze alloy remains in compression up to at least a solidus temperature of the braze alloy.
7. The cutter of claim 1, further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy.
8. The cutter of claim 7, wherein the thermally conductive material or the temperature-sensitive material is in direct mechanical contact with an end of the protrusion.
9. A cutter for a drill bit, the cutter comprising:
a substrate defining a hole at least partially through the substrate;
a diamond table; and a protrusion extending from the diamond table at least partially into the hole and in direct mechanical contact with the substrate via an interference fit between the protrusion and the substrate when at STP.
a substrate defining a hole at least partially through the substrate;
a diamond table; and a protrusion extending from the diamond table at least partially into the hole and in direct mechanical contact with the substrate via an interference fit between the protrusion and the substrate when at STP.
10. The cutter of claim 9, wherein the diamond table defines the protrusion.
11. The cutter of claim 9, wherein the protrusion comprises a post extending all the way through the hole on the substrate and having one end coupled to the diamond table and another end opposite the diamond table for coupling to a cutter pocket of a drill bit.
12. The cutter of claim 11, wherein the diamond table comprises a hole aligned with the hole on the substrate, and wherein the post extends into the hole on the diamond table.
13. The cutter of claim 9, further comprising a braze alloy between a planar face about the protrusion on the diamond table and a corresponding planar face about the hole on the substrate, wherein the braze alloy secures the planar face of the diamond table to the planar face of the substrate.
14. A drill bit, comprising:
a bit body having one or more blades extending therefrom; and a plurality of cutters secured to the one or more blades, wherein at least one cutter of the plurality of cutters includes:
a substrate defining a hole at least partially through the substrate;
a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP); and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
a bit body having one or more blades extending therefrom; and a plurality of cutters secured to the one or more blades, wherein at least one cutter of the plurality of cutters includes:
a substrate defining a hole at least partially through the substrate;
a diamond table including a protrusion received within the hole such that a gap is defined between the protrusion and the substrate ranging between 0.001 and 0.010 inches when the substrate and diamond table are at standard temperature and pressure (STP); and a braze alloy coupling the diamond table to the substrate at an interface between the diamond table and the substrate, wherein at least a portion of the braze alloy is disposed in the gap in compression between the protrusion on the diamond and the hole in the substrate.
15. The drill bit of claim 14, wherein the interface between the diamond table and the substrate further comprises a planar face about the protrusion on the diamond table in close engagement with a corresponding planar face about the hole on the substrate, and wherein a braze alloy at the interface secures the planar face of the diamond table to the planar face of the substrate.
16. The drill bit of claim 14, wherein the protrusion on the diamond table and the hole on the substrate are both circular, and the gap is a substantially constant-radial gap between the protrusion and the substrate.
17. The drill bit of claim 14, wherein the diamond table has a first coefficient of thermal expansion (CTE) and the substrate has a second CTE
greater than the first CTE.
greater than the first CTE.
18. The drill bit of claim 14, wherein the compression on the braze alloy is maintained up to at least a solidus temperature of the braze alloy.
19. The drill bit of claim 14, further comprising one of a thermally conductive material and a temperature-sensitive material positioned in the hole at a location not occupied by the protrusion and the braze alloy.
20. The drill bit of claim 14, further comprising a post extending from a cutter pocket on the one or more blades and secured within the hole of the substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/037450 WO2016209228A1 (en) | 2015-06-24 | 2015-06-24 | Drill bit cutters and cutter assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2980276A1 true CA2980276A1 (en) | 2016-12-29 |
Family
ID=57586513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2980276A Abandoned CA2980276A1 (en) | 2015-06-24 | 2015-06-24 | Drill bit cutters and cutter assemblies |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180128055A1 (en) |
KR (2) | KR20170129943A (en) |
CN (1) | CN107532455A (en) |
CA (1) | CA2980276A1 (en) |
GB (1) | GB2555285A (en) |
WO (1) | WO2016209228A1 (en) |
Families Citing this family (1)
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CN114508307B (en) * | 2022-02-15 | 2025-01-28 | 中国石油大学(华东) | Bionic high impact resistant polycrystalline diamond composite sheet |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU670642B2 (en) * | 1992-12-23 | 1996-07-25 | De Beers Industrial Diamond Division (Proprietary) Limited | Tool component |
US5590729A (en) * | 1993-12-09 | 1997-01-07 | Baker Hughes Incorporated | Superhard cutting structures for earth boring with enhanced stiffness and heat transfer capabilities |
US6003623A (en) * | 1998-04-24 | 1999-12-21 | Dresser Industries, Inc. | Cutters and bits for terrestrial boring |
US20050133276A1 (en) * | 2003-12-17 | 2005-06-23 | Azar Michael G. | Bits and cutting structures |
US7703559B2 (en) * | 2006-05-30 | 2010-04-27 | Smith International, Inc. | Rolling cutter |
EP2113049A4 (en) * | 2007-01-31 | 2015-12-02 | Halliburton Energy Services Inc | Rotary drill bits with protected cutting elements and methods |
US8517123B2 (en) * | 2009-05-29 | 2013-08-27 | Varel International, Ind., L.P. | Milling cap for a polycrystalline diamond compact cutter |
US8727044B2 (en) * | 2011-03-24 | 2014-05-20 | Us Synthetic Corporation | Polycrystalline diamond compact including a carbonate-catalyzed polycrystalline diamond body and applications therefor |
EP2756153A4 (en) * | 2011-09-16 | 2015-08-05 | Baker Hughes Inc | Methods of attaching a polycrystalline diamond compact to a substrate and cutting elements formed using such methods |
US9186740B2 (en) * | 2011-11-07 | 2015-11-17 | Siemens Energy, Inc. | Projection resistance brazing of superalloys |
US9322219B2 (en) * | 2011-12-05 | 2016-04-26 | Smith International, Inc. | Rolling cutter using pin, ball or extrusion on the bit body as attachment methods |
US10107043B1 (en) * | 2015-02-11 | 2018-10-23 | Us Synthetic Corporation | Superabrasive elements, drill bits, and bearing apparatuses |
-
2015
- 2015-06-24 KR KR1020177030839A patent/KR20170129943A/en not_active Abandoned
- 2015-06-24 GB GB1719296.4A patent/GB2555285A/en not_active Withdrawn
- 2015-06-24 CA CA2980276A patent/CA2980276A1/en not_active Abandoned
- 2015-06-24 US US15/577,744 patent/US20180128055A1/en not_active Abandoned
- 2015-06-24 WO PCT/US2015/037450 patent/WO2016209228A1/en active Application Filing
- 2015-06-24 CN CN201580079180.XA patent/CN107532455A/en active Pending
- 2015-06-24 KR KR1020197029736A patent/KR20190117824A/en not_active Withdrawn
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CN107532455A (en) | 2018-01-02 |
KR20190117824A (en) | 2019-10-16 |
GB201719296D0 (en) | 2018-01-03 |
WO2016209228A1 (en) | 2016-12-29 |
US20180128055A1 (en) | 2018-05-10 |
GB2555285A (en) | 2018-04-25 |
KR20170129943A (en) | 2017-11-27 |
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EEER | Examination request |
Effective date: 20170919 |
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Effective date: 20210831 |