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CA2541356A1 - Method for production of a card with a double interface and microcircuit card obtained thus - Google Patents

Method for production of a card with a double interface and microcircuit card obtained thus Download PDF

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Publication number
CA2541356A1
CA2541356A1 CA002541356A CA2541356A CA2541356A1 CA 2541356 A1 CA2541356 A1 CA 2541356A1 CA 002541356 A CA002541356 A CA 002541356A CA 2541356 A CA2541356 A CA 2541356A CA 2541356 A1 CA2541356 A1 CA 2541356A1
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CA
Canada
Prior art keywords
card
cavity
resin
adhesive
beaches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002541356A
Other languages
French (fr)
Other versions
CA2541356C (en
Inventor
Francois Launay
Jacques Venambre
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Idemia France SAS
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2541356A1 publication Critical patent/CA2541356A1/en
Application granted granted Critical
Publication of CA2541356C publication Critical patent/CA2541356C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Un procédé de fabrication d'une carte à microcircuit selon lequel on réalise un corps de carte comportant dans son épaisseur des bornes de connexion à un composant électronique et muni d'une cavité ayant un fond et bordée par un gradin sur lequel sont situés ces bornes de connexion et on réalise un module comportant un film support portant, sur une face externe, des contacts externes et, sur une face interne, des contacts internes et un microcircuit connecté audits contacts internes puis : - on applique sur la périphérie de la face interne dudit film un adhésif flexible conducteur anisotrope; - on dépose dans la cavité du corps de carte une résine de plus grande rigidité que l'adhésif ; - on insère dans la cavité le module en sorte que l'adhésif anisotrope se situe en regard de la périphérie du gradin de la cavité ; - on active thermiquement l'adhésif anisotrope sous pression, et on polymérise la résine. A method of manufacturing a microcircuit card according to which one realizes a card body having in its thickness connection terminals to a electronic component and provided with a cavity having a bottom and bordered by a step on which are located these connection terminals and a module is realized comprising a support film carrying, on an external face, contacts external and, on an internal face, internal contacts and a microcircuit connected audits internal contacts then: - we apply on the periphery of the inner face of said film an anisotropic flexible conductive adhesive; - we put down in the cavity of the card body a resin of greater rigidity than the adhesive; the module is inserted into the cavity so that the adhesive anisotropic is located opposite the periphery of the step of the cavity; - we thermally activates the anisotropic adhesive under pressure, and polymerizes the resin.

Claims (26)

1. Procédé de fabrication d'une carte à microcircuit selon lequel on réalise un corps de carte comportant dans son épaisseur des bornes de connexion à un composant électronique et muni d'une cavité ayant un fond et bordée par un gradin sur lequel sont situés ces bornes de connexion et on réalise un module comportant un film support portant, sur une face externe, des contacts externes et, sur une face interne, des contacts internes et un microcircuit connecté audits contacts internes puis :
- on applique sur la périphérie de la face interne dudit film un adhésif flexible conducteur anisotrope;
- on dépose dans la cavité du corps de carte une résine de plus grande rigidité que l'adhésif ;
- on insère dans la cavité le module en sorte que l'adhésif anisotrope se situe en regard de la périphérie du gradin de la cavité;
- on active thermiquement l'adhésif anisotrope sous pression, et on polymérise la résine. 1. A method of manufacturing a microcircuit card according to which realizes a card body having in its thickness connection to an electronic component and provided with a cavity having a bottom and bordered by a step on which are located these connection terminals and realizes a module comprising a support film carrying, on an external face, of the external contacts and, on an internal face, internal contacts and a microcircuit connected audits internal contacts then:
the periphery of the internal face of said film is applied to flexible anisotropic conductive adhesive;
- depositing in the cavity of the card body a resin of more high rigidity as the adhesive;
the module is inserted into the cavity so that the adhesive anisotropic is located opposite the periphery of the step of the cavity;
the anisotropic adhesive is thermally activated under pressure, and the resin is polymerized. 2. Procédé selon la revendication 1, caractérisé en ce que ce composant est une antenne. 2. Method according to claim 1, characterized in that component is an antenna. 3. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que la résine est choisie en sorte de présenter un coefficient de retrait d'au moins de l'ordre du pourcent lors de sa polymérisation, grâce à
quoi, lors de cette opération, le volume occupé par ladite résine se contracte. 3. Method according to claim 1 or claim 2, characterized in that the resin is selected so as to present a coefficient by at least one percent when it is polymerized, thanks to at what, during this operation, the volume occupied by said resin is contracted. 4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que l'on polymérise la résine à une température plus basse que celle à laquelle on active thermiquement l'adhésif. 4. Method according to any one of claims 1 to 3, characterized in that the resin is polymerized at a lower temperature than that to which the adhesive is thermally activated. 5. Procédé selon la revendication 4, caractérisé en ce que l'on active l'adhésif à une température d'activation de l'ordre de 150°C-160°C et l'on polymérise la résine à une température significativement inférieure à cette température d'activation (par exemple aux alentours de 60°C). 5. Method according to claim 4, characterized in that one activates the adhesive at an activation temperature of the order of 150 ° C.
160 ° C and one polymerizes the resin at a temperature significantly lower than this activation temperature (for example around 60 ° C). 6. Procédé selon l'une quelconque des revendications 1 à 5, caractérisé en ce que l'on conforme les bornes de connexion en sorte que l'une au moins d'entre elles soit subdivisée en au moins deux plages disposées à
distance l'une de l'autre. 6. Process according to any one of claims 1 to 5, characterized in that the connection terminals are conformed so that one at least of them be subdivided into at least two beaches arranged at distance from each other. 7. Procédé selon la revendication 6, caractérisé en ce que l'on conforme les bornes de connexion en sorte que ces deux plages soient situées en des zones du gradin présentant des orientations différentes vis-à-vis d'une direction de référence du corps de carte. 7. Method according to claim 6, characterized in that one comply with the connection terminals so that these two beaches are located in areas of the step with different orientations towards a reference direction of the card body. 8. Procédé selon la revendication 6 ou la revendication 7, caractérisé en ce que l'on conforme chaque borne de connexion en sorte qu'elle soit subdivisée en au moins deux plages qui font face à des plages de l'autre borne de connexion selon des directions différentes. 8. Process according to claim 6 or claim 7, characterized in that each connection terminal is conformed so that that it be subdivided into at least two beaches that face beaches of the other connection terminal in different directions. 9. Procédé selon l'une quelconque des revendications 6 à 8, caractérisé en ce que l'on conforme chaque borne de connexion en sorte que chacune d'entre elles soit subdivisée en au moins deux plages, dont l'une borde la cavité transversalement au corps de carte, et dont l'autre borde longitudinalement cette cavité. 9. Process according to any one of claims 6 to 8, characterized in that each connection terminal is conformed so that each of them is subdivided into at least two beaches, one of which borders the cavity transversely to the card body, and the other side of which longitudinally this cavity. 10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce que les contacts internes du module qui sont en regard des bornes de connexion sont réalisés en une pluralité de plages de contact plages de contact. 10. Process according to any one of claims 1 to 9, characterized in that the internal module contacts which are opposite the connection terminals are made in a plurality of contact pads ranges of contact. 11. Procédé selon la revendication 10, caractérisé en ce que les plages de contact sont disposées en sorte de border selon des directions différentes la cavité. 11. Process according to claim 10, characterized in that the contact pads are arranged so as to border according to directions different the cavity. 12. Procédé selon l'une quelconque des revendications 1 à 11, caractérisé en ce que l'on réalise le corps de carte au moyen de couches de matériaux choisis dans le groupe constitué du polychlorure de vinyle, de l'acrylonitrile butadiène styrène, du polyéthylène téréphtalate ou polycarbonate. 12. Method according to any one of claims 1 to 11, characterized in that the card body is made by means of layers of materials selected from the group consisting of polyvinyl chloride, acrylonitrile butadiene styrene, polyethylene terephthalate or polycarbonate. 13. Procédé selon la revendication 12, caractérisé en ce que l'on réalise le corps de carte sous la forme d'une alternance de telles couches. 13. The method of claim 12, characterized in that one realizes the card body in the form of an alternation of such layers. 14. Carte à microcircuit comportant un corps de carte comportant dans son épaisseur des bornes de connexion à un composant et muni d'une cavité ayant un fond et bordée par un gradin sur lequel sont situés ces bornes de connexion et un module comportant un film support portant, sur une face externe, des contacts externes et, sur une face interne, des contacts internes et un microcircuit connecté audits contacts internes dans lequel:
- les contacts internes sont connectés aux bornes de connexion par un adhésif conducteur anisotrope;
- le microcircuit est encapsulé dans une résine s'étendant jusqu'à
une portion de fond de la cavité, cette résine étant de plus grande rigidité
que l'adhésif. 14. Microcircuit card comprising a card body comprising in its thickness of the connection terminals to a component and provided with a cavity having a bottom and bordered by a step on which these terminals are located connection and a module comprising a support film carrying, on one side externally, external contacts and, on an internal face, internal contacts and a microcircuit connected to internal contacts audits in which:
- the internal contacts are connected to the connection terminals by an anisotropic conductive adhesive;
the microcircuit is encapsulated in a resin extending up to a bottom portion of the cavity, this resin being of greater rigidity than the adhesive. 15. Carte selon la revendication 14 caractérisée en ce que le composant est une antenne. 15. Card according to claim 14 characterized in that the component is an antenna. 16. Carte selon la revendication 14 ou la revendication 15, caractérisée en ce que la résine est choisie en sorte de présenter un coefficient de retrait d'au moins de l'ordre du pourcent lors de sa polymérisation, grâce à
quoi, après cette opération, le volume occupé par ladite résine est sous tension. Card according to claim 14 or claim 15, characterized in that the resin is selected so as to present a coefficient by at least one percent when it is polymerized, thanks to at what, after this operation, the volume occupied by said resin is under voltage. 17. Carte selon l'une quelconque des revendications 14 à 16, caractérisée en ce que la résine a une température de polymérisation plus basse que la température d'activation de l'adhésif. 17. Card according to any one of claims 14 to 16, characterized in that the resin has a higher polymerization temperature lower than the activation temperature of the adhesive. 18. Carte selon la revendication 17, caractérisée en ce que l'adhésif a une température d'activation de l'ordre de 150°C-160°C tandis que la résine a une température de polymérisation significativement inférieure à cette température d'activation (par exemple aux alentours de 60°C). 18. Card according to claim 17, characterized in that the adhesive has an activation temperature of the order of 150 ° C-160 ° C while that the resin has a polymerization temperature significantly lower than this activation temperature (for example around 60 ° C). 19. Carte selon l'une quelconque des revendications 14 à 18, caractérisée en ce que les bornes de connexion sont conformées en sorte que l'une au moins d'entre elles soit subdivisée en au moins deux plages disposées à distance l'une de l'autre. 19. Card according to any one of claims 14 to 18, characterized in that the connection terminals are shaped so that at least one of them is subdivided into at least two arranged beaches at a distance from each other. 20. Carte selon la revendication 19, caractérisée en ce que les bornes de connexion sont conformées en sorte que ces deux plages soient situées en des zones du gradin présentant des orientations différentes vis-à-vis d'une direction de référence du corps de carte. 20. Card according to claim 19, characterized in that the connection terminals are shaped so that these two ranges are situated in areas of the step with different orientations to screw a reference direction of the card body. 21. Carte selon la revendication 19 ou la revendication 20, caractérisée en ce que chaque borne de connexion est conformée en sorte qu'elle soit subdivisée en au moins deux plages qui font face à des plages de l'autre borne de connexion selon des directions différentes. Card according to claim 19 or claim 20, characterized in that each connection terminal is shaped so that it be subdivided into at least two beaches that face beaches of the other connection terminal in different directions. 22. Carte selon l'une quelconque des revendications 19 à 21, caractérisée en ce chaque borne de connexion est conformée en sorte que chacune d'entre elles soit subdivisée en au moins deux plages, dont l'une borde la cavité transversalement au corps de carte, et dont l'autre borde longitudinalement cette cavité. 22. Card according to any one of claims 19 to 21, characterized in that each connection terminal is shaped so that each of them is subdivided into at least two beaches, one of which borders the cavity transversely to the card body, and the other side of which longitudinally this cavity. 23. Carte selon l'une quelconque des revendications 14 à 22, caractérisée en ce que les contacts internes du module qui sont en regard des bornes de connexion sont réalisés en une pluralité de plages de contact plages de contact. 23. Card according to any one of claims 14 to 22, characterized in that the internal contacts of the module which are opposite connection terminals are made in a plurality of contact pads ranges of contact. 24. Procédé selon la revendication 23, caractérisé en ce que les plages de contact sont disposées en sorte de border selon des directions différentes la cavité. 24. The method of claim 23, characterized in that the contact pads are arranged so as to border according to directions different the cavity. 25. Carte selon l'une quelconque des revendications 14 à 24, caractérisée en ce que le corps de carte est réalisé au moyen de couches de matériaux choisis dans le groupe constitué du polychlorure de vinyle, de l'acrylonitrile butadiène styrène, du polyéthylène téréphtalate ou polycarbonate. 25. Card according to any one of claims 14 to 24, characterized in that the card body is made by means of layers of materials selected from the group consisting of polyvinyl chloride, acrylonitrile butadiene styrene, polyethylene terephthalate or polycarbonate. 26. Carte selon la revendication 25, caractérisée en ce que le corps de carte est réalisé sous la forme d'une alternance de telles couches. 26. The card according to claim 25, characterized in that the body card is made in the form of an alternation of such layers.
CA2541356A 2003-10-17 2004-10-12 Method for production of a card with a double interface and microcircuit card obtained thus Expired - Fee Related CA2541356C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0312204 2003-10-17
FR0312204A FR2861201B1 (en) 2003-10-17 2003-10-17 METHOD FOR MANUFACTURING A CARD WITH A DOUBLE INTERFACE, AND MICROCIRCUIT CARD THUS OBTAINED
PCT/FR2004/002582 WO2005038702A2 (en) 2003-10-17 2004-10-12 Method for production of a card with a double interface and microcircuit card obtained thus

Publications (2)

Publication Number Publication Date
CA2541356A1 true CA2541356A1 (en) 2005-04-28
CA2541356C CA2541356C (en) 2012-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA2541356A Expired - Fee Related CA2541356C (en) 2003-10-17 2004-10-12 Method for production of a card with a double interface and microcircuit card obtained thus

Country Status (11)

Country Link
US (1) US7735741B2 (en)
EP (1) EP1673715B1 (en)
JP (1) JP4579924B2 (en)
KR (1) KR100846032B1 (en)
CN (1) CN100428274C (en)
BR (1) BRPI0415371B8 (en)
CA (1) CA2541356C (en)
DE (1) DE04817215T1 (en)
ES (1) ES2264911T3 (en)
FR (1) FR2861201B1 (en)
WO (1) WO2005038702A2 (en)

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CA2541356C (en) 2012-05-08
FR2861201A1 (en) 2005-04-22
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WO2005038702A2 (en) 2005-04-28
CN100428274C (en) 2008-10-22
CN1867929A (en) 2006-11-22
JP4579924B2 (en) 2010-11-10
US7735741B2 (en) 2010-06-15
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