CA2520442A1 - Vacuum metalized pigment patterns and method of making same - Google Patents
Vacuum metalized pigment patterns and method of making same Download PDFInfo
- Publication number
- CA2520442A1 CA2520442A1 CA 2520442 CA2520442A CA2520442A1 CA 2520442 A1 CA2520442 A1 CA 2520442A1 CA 2520442 CA2520442 CA 2520442 CA 2520442 A CA2520442 A CA 2520442A CA 2520442 A1 CA2520442 A1 CA 2520442A1
- Authority
- CA
- Canada
- Prior art keywords
- pattern
- vmp
- carrier
- metalized
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000049 pigment Substances 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000010409 thin film Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000000976 ink Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
- B41M5/03—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet by pressure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Decoration By Transfer Pictures (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A method of transferring in pattern or image form a thin film of vacuum metalized pigment (VMP) from a carrier to a substrate is disclosed. The pattern or image as a thin film adhesive is applied to the substrate and when in contact with the carrier, causes an identical image or pattern of VMP to be removed from the carrier. The VMP itself is itself optically and/or conductively continuous and thus can be used in producing decorative metallic images or conductive electrical circuits including RFID antennae.
Description
VACUUM METAi-IZED PIGMENT PATTERNS
AND METHQD OF MAKING SAME
This invention relates to the use of vacuum metalized pigment in the creation of patterns and the method of making same.
The production of vacuum metalized pigment employing a vapor deposition process which produces thin metal flake is well known in the art and is frequently used in the production of paints and inks.
Attempts have also been made to produce a conductive ink composition employing conductive flake material capable of providing sufficient conductivity for RFID tag antenna and other printed conductive and semi-conductive structures as disclosed, for example, in U.S. Patent publication 200310151028, Lawrence et al., published August 14, 2003.
This invention relates to a method of laying down on a substrate a suitable image or pattern made up from vacuum metalized pigment and which has the added advantage of also being suitable as a conductor which advantageously can be employed in producing metal circuit patterns and also other designs where a metalized appearance is desired.
_1 The metal flakes as employed in this invention are derived from metal vacuum deposition whereby the deposited metal is washed or stripped into a suitable solvent to produce a passive, stable and substantially pure metallic flake before being processed into an optimized particle size. Sized vacuum metalized pigment (VMP) typically have an aspect ratio of 1:5.
In accordance with this invention, the VMP while in suspension or slurry form is applied as a thin coating to the surface of a carrier. Preferably, the slurry is of a predetermined thickness and is applied to the exterior surface of a rotating cylinder. This can be achieved by employing any suitable application means such as a duct in which the rotating cylinder is partially immersed, or from an enclosed applicator blade as currently used in flexographic and gravure printing presses.
The VMP slurry coating as applied to a carrier, such as the exterior surface of a rotating cylinder, is permitted to dry so as to fom~, in a transfer area on the carrier, a thin layer of optically andlor conductively continuous VMP on the surface thereof.
The substrate itself is provided with a thin film adhesive thereon which is in the shape of the image or pattern of the thin layer of optically conductively continuous VMP to be transferred from the carrier to the substrate. The adhesive on the substrate, upon contact with the thin metal flake on the carrier, causes the _2_ predetermined image or pattern to be removed from the thin flm VMP in the transfer area. The remainder of the VMP after the removal of the patterned VMP
therefrom, is subsequently removed from the carrier by solvent washing or the like.
It will be appreciated that the thin metal VMP that has been transferred and applied to the substrate is relatively pure, being free of polymers or binders which interfere with its conductivity. The purity of the metal and the extremely thin nature of the flake combine to produce a cohesive metal surface which is secured to the substrate by the patterned adhesive.
In accordance with my invention, there is provided a method of transferring an image or pattern made up from vacuum metalized pigment (VMP) which comprises the steps of (a) providing a thin film adhesive in the shape of the image or pattern to be transferred on a surFace of a substrate; (b) applying a thin coating of VMP while in suspension or slurry form to a surface of a carrier;
(c) drying said thin coating on said carrier in a transfer area to produce a thin layer of optically andlor conductively continuous VMP on the surface of said carrier;
and (d) transferring the image or pattern from the carrier to the substrate by contacting the dry VMP in the transfer area with said thin film adhesive on the substrate to thereby remove dry VMP in image or pattern form from said transfer area.
The VMP typically is one of aluminum, copper, nickel, silver and chrome. The weight of the applied thin coating of VMP on the surface of the substrate can range from 1.0 to 10.0 grams per square meter with the thickness of the transferred thin layer image or film being in the range of from 100 to 600 Angstroms.
In keeping with this invention, it will be appreciated that the transferred thin film VMP can be applied to any suitable substrate for decorative purposes or where desired, employed as a conductor as used in printed circuit boards or the like or as an antenna in RFID applications.
AND METHQD OF MAKING SAME
This invention relates to the use of vacuum metalized pigment in the creation of patterns and the method of making same.
The production of vacuum metalized pigment employing a vapor deposition process which produces thin metal flake is well known in the art and is frequently used in the production of paints and inks.
Attempts have also been made to produce a conductive ink composition employing conductive flake material capable of providing sufficient conductivity for RFID tag antenna and other printed conductive and semi-conductive structures as disclosed, for example, in U.S. Patent publication 200310151028, Lawrence et al., published August 14, 2003.
This invention relates to a method of laying down on a substrate a suitable image or pattern made up from vacuum metalized pigment and which has the added advantage of also being suitable as a conductor which advantageously can be employed in producing metal circuit patterns and also other designs where a metalized appearance is desired.
_1 The metal flakes as employed in this invention are derived from metal vacuum deposition whereby the deposited metal is washed or stripped into a suitable solvent to produce a passive, stable and substantially pure metallic flake before being processed into an optimized particle size. Sized vacuum metalized pigment (VMP) typically have an aspect ratio of 1:5.
In accordance with this invention, the VMP while in suspension or slurry form is applied as a thin coating to the surface of a carrier. Preferably, the slurry is of a predetermined thickness and is applied to the exterior surface of a rotating cylinder. This can be achieved by employing any suitable application means such as a duct in which the rotating cylinder is partially immersed, or from an enclosed applicator blade as currently used in flexographic and gravure printing presses.
The VMP slurry coating as applied to a carrier, such as the exterior surface of a rotating cylinder, is permitted to dry so as to fom~, in a transfer area on the carrier, a thin layer of optically andlor conductively continuous VMP on the surface thereof.
The substrate itself is provided with a thin film adhesive thereon which is in the shape of the image or pattern of the thin layer of optically conductively continuous VMP to be transferred from the carrier to the substrate. The adhesive on the substrate, upon contact with the thin metal flake on the carrier, causes the _2_ predetermined image or pattern to be removed from the thin flm VMP in the transfer area. The remainder of the VMP after the removal of the patterned VMP
therefrom, is subsequently removed from the carrier by solvent washing or the like.
It will be appreciated that the thin metal VMP that has been transferred and applied to the substrate is relatively pure, being free of polymers or binders which interfere with its conductivity. The purity of the metal and the extremely thin nature of the flake combine to produce a cohesive metal surface which is secured to the substrate by the patterned adhesive.
In accordance with my invention, there is provided a method of transferring an image or pattern made up from vacuum metalized pigment (VMP) which comprises the steps of (a) providing a thin film adhesive in the shape of the image or pattern to be transferred on a surFace of a substrate; (b) applying a thin coating of VMP while in suspension or slurry form to a surface of a carrier;
(c) drying said thin coating on said carrier in a transfer area to produce a thin layer of optically andlor conductively continuous VMP on the surface of said carrier;
and (d) transferring the image or pattern from the carrier to the substrate by contacting the dry VMP in the transfer area with said thin film adhesive on the substrate to thereby remove dry VMP in image or pattern form from said transfer area.
The VMP typically is one of aluminum, copper, nickel, silver and chrome. The weight of the applied thin coating of VMP on the surface of the substrate can range from 1.0 to 10.0 grams per square meter with the thickness of the transferred thin layer image or film being in the range of from 100 to 600 Angstroms.
In keeping with this invention, it will be appreciated that the transferred thin film VMP can be applied to any suitable substrate for decorative purposes or where desired, employed as a conductor as used in printed circuit boards or the like or as an antenna in RFID applications.
Claims (16)
1. A method of transferring an image made up from a vacuum metalized pigment (VMP), comprising the steps of:
(a) providing a thin film adhesive in the shape of the image or pattern to be transferred on a surface of a substrate;
(b) applying a thin coating of VMP while in suspension or slurry form to a surface of a carrier;
(c) drying said thin coating on said carrier to form in a transfer area a thin layer of dry optically and/or conductively continuous VMP on the surface of said carrier;
(d) transferring said image or pattern from said carrier to said substrate by contacting dry VMP in the transfer area with said thin film adhesive on said substrate to thereby remove dry VMP in image or pattern form from said transfer area.
(a) providing a thin film adhesive in the shape of the image or pattern to be transferred on a surface of a substrate;
(b) applying a thin coating of VMP while in suspension or slurry form to a surface of a carrier;
(c) drying said thin coating on said carrier to form in a transfer area a thin layer of dry optically and/or conductively continuous VMP on the surface of said carrier;
(d) transferring said image or pattern from said carrier to said substrate by contacting dry VMP in the transfer area with said thin film adhesive on said substrate to thereby remove dry VMP in image or pattern form from said transfer area.
2. The method as claimed in claim 1, wherein the VMP is one of aluminum, copper, nickel, silver and chrome.
3. The method as claimed in claims 1 or 2, wherein the weight of said coating is in the range from 1.0 to 10.0 grams per square meter.
4. The method as claimed in claims 1, 2 or 3, wherein the thickness of the transferred thin layer image or pattern is from 100 to 600 Angstroms.
5. The method as claimed in claims 1-4, wherein the carrier is the exterior circumference of a rotating cylinder.
6. The method as claimed in claim 5, wherein said substrate comprises an elongated web which is in synchronous movement with said carrier comprising the outer surface of a rotating cylinder and which contacts the outer surface of said cylinder at said transfer area.
7. The method as claimed in claims 1-6, wherein the remainder of said VMP
in said transfer area is removed from said carrier for recycling.
in said transfer area is removed from said carrier for recycling.
8. The method as claimed in claims 1-7, wherein said thin film adhesive is a pressure sensitive adhesive.
9. The method as claimed in claims 1-7, wherein said thin film adhesive is a temperature sensitive adhesive.
10. The method as claimed in claims 1-9 wherein the transferred image or pattern is an electrical conductor pattern applied to and forming part of a printed circuit board.
11. The method as claimed in claims 1-9 wherein the transferred image is an electrical conductor having a RFID pattern.
12. A metalized pattern applied to a substrate, wherein the pattern is formed from a thin film of optically or conductively continuous vacuum metalized pigment (VMP) and is bonded to said substrate by means of an adhesive having a pattern which corresponds to that of said metalized pattern.
13. The metalized pattern as claimed in claim 12, wherein the VMP is in the form of metal flakes which have an aspect ratio of 5:1.
14. The metalized pattern as claimed in claim 12 or 13 comprising a metalized electrical circuit pattern.
15. The metalized pattern as claimed in claim 14, wherein the metalized electrical circuit pattern is a RFID antenna pattern.
16. The metalized pattern as claimed in claims 12-15, wherein said VMP is selected from the group consisting of silver, gold, aluminum, chrome and copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2520442 CA2520442A1 (en) | 2005-09-15 | 2005-09-15 | Vacuum metalized pigment patterns and method of making same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2520442 CA2520442A1 (en) | 2005-09-15 | 2005-09-15 | Vacuum metalized pigment patterns and method of making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2520442A1 true CA2520442A1 (en) | 2007-03-15 |
Family
ID=37872078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2520442 Abandoned CA2520442A1 (en) | 2005-09-15 | 2005-09-15 | Vacuum metalized pigment patterns and method of making same |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2520442A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016189519A1 (en) * | 2015-05-27 | 2016-12-01 | Landa Labs (2012) Ltd | Metal printed constructions |
| WO2022084027A1 (en) * | 2020-10-19 | 2022-04-28 | Actega Metal Print | Process for printing particles |
| WO2022148658A1 (en) * | 2021-01-11 | 2022-07-14 | Eckart Gmbh | Silica encapsulated pigments for nano-metallography |
| US11701684B2 (en) | 2015-05-27 | 2023-07-18 | Landa Labs (2012) Ltd. | Method for coating a surface with a transferable layer of thermoplastic particles and related apparatus |
-
2005
- 2005-09-15 CA CA 2520442 patent/CA2520442A1/en not_active Abandoned
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10751750B2 (en) | 2015-05-27 | 2020-08-25 | Actega Metal Print Gmbh | Coating apparatus with donor surface, application device, and surplus extraction system |
| US10906064B2 (en) | 2015-05-27 | 2021-02-02 | Actega Metal Print Gmbh | Printing system and method |
| CN107848315A (en) * | 2015-05-27 | 2018-03-27 | 阿塔卡金属印刷有限公司 | Operplate printing constructs |
| JP2018520033A (en) * | 2015-05-27 | 2018-07-26 | アクテガ メタル プリント ゲーエムベーハー | Metal printing structure |
| US10583455B2 (en) | 2015-05-27 | 2020-03-10 | Actega Metal Print Gmbh | Coating apparatus |
| RU2722435C2 (en) * | 2015-05-27 | 2020-06-01 | Актега Метал Принт Гмбх | Metallized printed structure |
| IL255828A (en) * | 2015-05-27 | 2018-01-31 | Actega Metal Print Gmbh | Metal printed constructions |
| US11701684B2 (en) | 2015-05-27 | 2023-07-18 | Landa Labs (2012) Ltd. | Method for coating a surface with a transferable layer of thermoplastic particles and related apparatus |
| WO2016189519A1 (en) * | 2015-05-27 | 2016-12-01 | Landa Labs (2012) Ltd | Metal printed constructions |
| CN107848315B (en) * | 2015-05-27 | 2021-08-20 | 阿塔卡金属印刷有限公司 | Metal printed construction |
| US10981191B2 (en) | 2015-05-27 | 2021-04-20 | Actega Metal Print Gmbh | Metal printed constructions |
| US11679408B2 (en) | 2015-05-27 | 2023-06-20 | Actega Metal Print Gmbh | Printing system and method |
| JP7182461B2 (en) | 2015-05-27 | 2022-12-02 | アクテガ メタル プリント ゲーエムベーハー | metal print structure |
| WO2022084027A1 (en) * | 2020-10-19 | 2022-04-28 | Actega Metal Print | Process for printing particles |
| WO2022148658A1 (en) * | 2021-01-11 | 2022-07-14 | Eckart Gmbh | Silica encapsulated pigments for nano-metallography |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |