CA2403116A1 - Electro-plating apparatus and a method of electro-plating - Google Patents
Electro-plating apparatus and a method of electro-plating Download PDFInfo
- Publication number
- CA2403116A1 CA2403116A1 CA002403116A CA2403116A CA2403116A1 CA 2403116 A1 CA2403116 A1 CA 2403116A1 CA 002403116 A CA002403116 A CA 002403116A CA 2403116 A CA2403116 A CA 2403116A CA 2403116 A1 CA2403116 A1 CA 2403116A1
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- CA
- Canada
- Prior art keywords
- substrate
- cathode connector
- cathode
- deposited
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000003792 electrolyte Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- 238000004590 computer program Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Electro-plating apparatus (1) has an electro-plating bath (2) containing electrolyte (3), an anode configuration immersed in electrolyte (3) being a planar anode (4) and an arcuate solid anode (5). In use, a continuous web of flexible substrate (6) (onto both side of which material is to be deposited) is passed along a transport system (7) in a direction shown by arrow (A).
Transport system (7) comprises a set of rollers (8, 9) of which rollers (8) are generally cylindrical, driving rollers while rollers (9) are cathode connectors and have a number of circumferential projections (10) which ensure electrical contact with unconnected or discreet regions on substrate (6).
Another electro-plating apparatus (20) has a cathode connector configuration (21) with four comb electrodes (22) each having a main portion (23) with a plurality of teeth (24) each of which has end (25) inclined in the direction of the movement of the substrate.
Transport system (7) comprises a set of rollers (8, 9) of which rollers (8) are generally cylindrical, driving rollers while rollers (9) are cathode connectors and have a number of circumferential projections (10) which ensure electrical contact with unconnected or discreet regions on substrate (6).
Another electro-plating apparatus (20) has a cathode connector configuration (21) with four comb electrodes (22) each having a main portion (23) with a plurality of teeth (24) each of which has end (25) inclined in the direction of the movement of the substrate.
Description
Y
ELECTRO-PLATING APPARATUS AND A METHOD OF
ELECTRO-PLATING
The present invention related to electro-plating apparatus and a method of electro-plating.
In a conventional electro-plating process, the object to be plated is immersed in a bath of electrolyte together with, but not touching, one or more pieces of the metal with which it is to be plated. Connections are made to a source of electrical current such that the item to be plated becomes the cathode and the pieces of metal become the anode. When an electric current is supplied, ions flow towards the cathode and are reduced thereon~to give a coating of the metal from which the anodes are made.
In another electro-plating process, described in International Patent Application No.
W99/52336, conductive tracks are provided on a printed circuit by use of a tool having an absorptive member carrying a plating solution.
According to the present invention, there is provided electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate, when present, and not in the plane of the substrate.
r , According to the present invention, there is also provided electro-plating apparatus comprising an elongate connector cathode for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode and at least one projection which extends away from the main body section.
In this way, apparatus of the invention may ensure that electrical contact is maintained with portions of the substrate which would be otherwise electrically isolated from the main body of the substrate.
The present invention may include any one or more of the following preferred features:-~ the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
~ at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
~ each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
~ the cathode connector is formed of copper, or beryllium copper, or s phosphor bronze, or stainless steel, or any other material with the required electrical and mechanical properties.
~ means to pass a substrate, onto which material is to be deposited, over the cathode the length of which extends a substantial part of, or all, the to width of the substrate.
~ an electro-plating bath into which the substrate is immersed for deposition of material.
is ~ the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate before entering the bath.
~ the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
2o ~ cleaning means to remove electrolyte from the substrate downstream of the cathode connector.
~ cleaning means to remove electrolyte from the substrate upstream of the 2s cathode connector.
~ at least one nozzle means to direct cleansing fluid towards the substrate.
~ electro-plating means to effect dry plating of material onto a substrate.
ELECTRO-PLATING APPARATUS AND A METHOD OF
ELECTRO-PLATING
The present invention related to electro-plating apparatus and a method of electro-plating.
In a conventional electro-plating process, the object to be plated is immersed in a bath of electrolyte together with, but not touching, one or more pieces of the metal with which it is to be plated. Connections are made to a source of electrical current such that the item to be plated becomes the cathode and the pieces of metal become the anode. When an electric current is supplied, ions flow towards the cathode and are reduced thereon~to give a coating of the metal from which the anodes are made.
In another electro-plating process, described in International Patent Application No.
W99/52336, conductive tracks are provided on a printed circuit by use of a tool having an absorptive member carrying a plating solution.
According to the present invention, there is provided electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate, when present, and not in the plane of the substrate.
r , According to the present invention, there is also provided electro-plating apparatus comprising an elongate connector cathode for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode and at least one projection which extends away from the main body section.
In this way, apparatus of the invention may ensure that electrical contact is maintained with portions of the substrate which would be otherwise electrically isolated from the main body of the substrate.
The present invention may include any one or more of the following preferred features:-~ the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
~ at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
~ each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
~ the cathode connector is formed of copper, or beryllium copper, or s phosphor bronze, or stainless steel, or any other material with the required electrical and mechanical properties.
~ means to pass a substrate, onto which material is to be deposited, over the cathode the length of which extends a substantial part of, or all, the to width of the substrate.
~ an electro-plating bath into which the substrate is immersed for deposition of material.
is ~ the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate before entering the bath.
~ the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
2o ~ cleaning means to remove electrolyte from the substrate downstream of the cathode connector.
~ cleaning means to remove electrolyte from the substrate upstream of the 2s cathode connector.
~ at least one nozzle means to direct cleansing fluid towards the substrate.
~ electro-plating means to effect dry plating of material onto a substrate.
a tool having an absorptive member to carry plating solution.
the electrode comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
the teeth or discs are adjustably spaced along the main portion.
The present invention also provides an electroplating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate and not in the plane of the substrate.
The present invention may also provide an electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
The method may include any one or more of the following preferred features:
~ passing a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial or part of, or all, the width of the substrate.
immersing the substrate, onto which material is to be deposited into an electro-plating bath containing electrolyte.
~ passing the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before entering the bath.
~ passing the substrate over the cathode connector located adjacent to the s path of a substrate to contact with the substrate after leaving the bath.
~ cleaning the substrate downstream of the cathode connector to remove electrolyte.
to ~ cleaning the substrate upstream of the cathode connector to remove electrolyte.
~ effecting dry plating of material onto a substrate.
is Apparatus or methods of the present invention as described herein may provide the following advantages:-~ effective electro-plating of isolated regions (i.e. not connected with one another) of the substrate is ensured.
~ effective electro-plating is achieved even for highly-flexible substrates.
~ effective electro-plating is achieved even for substrates having very 2s roughened surface.
The present invention also provides a computer program product directly loadable into the internal memory of digital computer, comprising software code portions for performing the steps of a method of the present invention when said product is run on a computer.
The invention is applicable to electro-plating processes including, but not limited to, those as described hereinabove.
In order that the present invention may more readily be understood, a description is now given, by way of example only, reference being made to the accompanying drawings, in which:-Figure 1 is a block schematic drawing of electro-plating apparatus embodying the present invention;
Figure 2 is a schematic drawing of an alternative apparatus;
Figure 3A is a detailed view of part of a conventional apparatus;
Figure 3B is a detailed view of part of the apparatus of Figure 2;
Figure 4 is a schematic drawing of a further embodiment of apparatus;
Figure 5 is a schematic drawing of a further embodiment of apparatus.
Electro-plating apparatus 1 as shown in Figure 1 comprises an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 and comprising a planar anode 4 and an arcuate solid anode 5.
2o In use, a continuous web of flexible substrate 6 (onto both sides of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8,9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connector and have a number of circumferential projections 10 which ensure electrical contact (in spite of the transport speed, substrate flexibility or roughness of substrate 6) with unconnected or discrete regions on substrate 6.
Figure 2 shows another electro-plating apparatus 20 having a cathode 3o connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement of the substrate.
In each embodiment, the teeth 24 may be equi-spaced along the comb main portion 23 or they may be spaced to fit with the required region spacing of the substrate. The positioning of the teeth along the main portion 23 may be adjustable to accommodate either option.
Figure 3A show the problem associated with disconnected areas in a to conventional plating bath. The inner conducting area 50 is electrically isolated from the outer conducting area 51 by the non-conducting area 52 and, therefore, the inner area 50 is not connected electrically to the negative terminal 53 of the current source.
Figure 3B shows how cathode connector 60 connects discrete areas to the negative potential and shows the use of a cathode connector 60 whereby the substrate 61 passes over the cathode connector 60 just prior to entering the electrolyte 62. All conducting areas on the substrate 61 are contacted by one or more fingers 63 of the cathode connector 60 such that contact is 2o maintained until at least 50% the length, in the direction of substrate travel, has passed into the electrolyte 62. The gap between the cathode connector 60 and the electrolyte 62 causes a portion of the conducting parts of the substrate not to be plated because of the loss of contact. These portions are plated at the time of exit from the electrolyte 62 when the already plated area make contact with a further cathode connector situated just above the point at which the substrate exits the electrolyte 62. Conducting area 64 on substrate 61 is surrounded by non-conducting areas 65 but fingers 63 of cathode 60 still make contact to ensure electro-plating happens.
Figure 4 shows an electro-plating apparatus 30 for plating a rigid substrate 31 which hence cannot be immersed in an electrolyte bath in the manner of Figures 1 and 2. Apparatus 30 comprises a hollow anode 32 through the centre of which electrolyte 33 is directed onto a portion of substrate 31 moving in direction B and then removed along side channels 34. Cathode connectors 35 are in the form of comb main portions 36 with teeth 37 to ensure that unconnected regions of substrate 31 are electrically connected to cathode connectors 35 before and after impingement of electrolyte 33 to ensure that there is adequate deposition of material onto all required parts of to substrate 31.
Two cleaners 38 with nozzles 39 are provided to direct de-ionised water onto the substrate 30 before and after contact with cathodes 35.
In a variant, roller 8 or main comb portion 23 may have a brush instead of projections 10, disc or teeth 24 to contact the discrete or unconnected regions on substrate 6.
Figure 5 shows a variant of the apparatus of Figure 4 but wherein both sides of substrate 31 are plated.
the electrode comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
the teeth or discs are adjustably spaced along the main portion.
The present invention also provides an electroplating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate and not in the plane of the substrate.
The present invention may also provide an electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
The method may include any one or more of the following preferred features:
~ passing a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial or part of, or all, the width of the substrate.
immersing the substrate, onto which material is to be deposited into an electro-plating bath containing electrolyte.
~ passing the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before entering the bath.
~ passing the substrate over the cathode connector located adjacent to the s path of a substrate to contact with the substrate after leaving the bath.
~ cleaning the substrate downstream of the cathode connector to remove electrolyte.
to ~ cleaning the substrate upstream of the cathode connector to remove electrolyte.
~ effecting dry plating of material onto a substrate.
is Apparatus or methods of the present invention as described herein may provide the following advantages:-~ effective electro-plating of isolated regions (i.e. not connected with one another) of the substrate is ensured.
~ effective electro-plating is achieved even for highly-flexible substrates.
~ effective electro-plating is achieved even for substrates having very 2s roughened surface.
The present invention also provides a computer program product directly loadable into the internal memory of digital computer, comprising software code portions for performing the steps of a method of the present invention when said product is run on a computer.
The invention is applicable to electro-plating processes including, but not limited to, those as described hereinabove.
In order that the present invention may more readily be understood, a description is now given, by way of example only, reference being made to the accompanying drawings, in which:-Figure 1 is a block schematic drawing of electro-plating apparatus embodying the present invention;
Figure 2 is a schematic drawing of an alternative apparatus;
Figure 3A is a detailed view of part of a conventional apparatus;
Figure 3B is a detailed view of part of the apparatus of Figure 2;
Figure 4 is a schematic drawing of a further embodiment of apparatus;
Figure 5 is a schematic drawing of a further embodiment of apparatus.
Electro-plating apparatus 1 as shown in Figure 1 comprises an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 and comprising a planar anode 4 and an arcuate solid anode 5.
2o In use, a continuous web of flexible substrate 6 (onto both sides of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8,9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connector and have a number of circumferential projections 10 which ensure electrical contact (in spite of the transport speed, substrate flexibility or roughness of substrate 6) with unconnected or discrete regions on substrate 6.
Figure 2 shows another electro-plating apparatus 20 having a cathode 3o connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement of the substrate.
In each embodiment, the teeth 24 may be equi-spaced along the comb main portion 23 or they may be spaced to fit with the required region spacing of the substrate. The positioning of the teeth along the main portion 23 may be adjustable to accommodate either option.
Figure 3A show the problem associated with disconnected areas in a to conventional plating bath. The inner conducting area 50 is electrically isolated from the outer conducting area 51 by the non-conducting area 52 and, therefore, the inner area 50 is not connected electrically to the negative terminal 53 of the current source.
Figure 3B shows how cathode connector 60 connects discrete areas to the negative potential and shows the use of a cathode connector 60 whereby the substrate 61 passes over the cathode connector 60 just prior to entering the electrolyte 62. All conducting areas on the substrate 61 are contacted by one or more fingers 63 of the cathode connector 60 such that contact is 2o maintained until at least 50% the length, in the direction of substrate travel, has passed into the electrolyte 62. The gap between the cathode connector 60 and the electrolyte 62 causes a portion of the conducting parts of the substrate not to be plated because of the loss of contact. These portions are plated at the time of exit from the electrolyte 62 when the already plated area make contact with a further cathode connector situated just above the point at which the substrate exits the electrolyte 62. Conducting area 64 on substrate 61 is surrounded by non-conducting areas 65 but fingers 63 of cathode 60 still make contact to ensure electro-plating happens.
Figure 4 shows an electro-plating apparatus 30 for plating a rigid substrate 31 which hence cannot be immersed in an electrolyte bath in the manner of Figures 1 and 2. Apparatus 30 comprises a hollow anode 32 through the centre of which electrolyte 33 is directed onto a portion of substrate 31 moving in direction B and then removed along side channels 34. Cathode connectors 35 are in the form of comb main portions 36 with teeth 37 to ensure that unconnected regions of substrate 31 are electrically connected to cathode connectors 35 before and after impingement of electrolyte 33 to ensure that there is adequate deposition of material onto all required parts of to substrate 31.
Two cleaners 38 with nozzles 39 are provided to direct de-ionised water onto the substrate 30 before and after contact with cathodes 35.
In a variant, roller 8 or main comb portion 23 may have a brush instead of projections 10, disc or teeth 24 to contact the discrete or unconnected regions on substrate 6.
Figure 5 shows a variant of the apparatus of Figure 4 but wherein both sides of substrate 31 are plated.
Claims (38)
1. Electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate, when present, and not in the plane of the substrate.
2. Electro-plating apparatus comprising an elongate cathode connector for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode and at least one projection which extends away from the main body section.
3. Apparatus according to Claim 1 or 2 wherein the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
4. Apparatus according to Claim 3 wherein the at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
5. Apparatus according to Claim 3 or 4 wherein said at least one tooth comprises an end portion inclined, relative to the remainder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location of a substrate on which material is to be deposited.
6. ~Apparatus according to Claim 1 or 2 wherein the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
7. Apparatus according to any preceding claim wherein the cathode connector is formed of copper or beryllium copper, or phosphor bronze, or stainless steel.
8. Apparatus according to any preceding claim comprising means to pass a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial part of, or all, the width of the substrate.
9. Apparatus according to any preceding claim comprising an electro-plating bath into which the substrate is immersed for deposition of material.
10. Apparatus according to Claim 9 wherein the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate before entering the bath.
11. Apparatus according to Claim 9 or 10 wherein the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
12. Apparatus according to any of Claims 9 to 11 comprising cleaning means to remove electrolyte from the substrate downstream of the cathode.
13. Apparatus according to any of Claims 9 to 12 comprising cleaning means to remove electrolyte from the substrate upstream of the cathode connector.
14. Apparatus according to any of Claims 9 to 13 comprising at least one nozzle to direct cleansing fluid towards the substrate.
15. Apparatus according to any of Claims 1 to 7 comprising electro-plating means to effect dry plating of material onto a substrate.
16. Apparatus according to Claim 15 comprising a tool having a absorptive member to carry plating solution.
17. Apparatus according to any preceding claim wherein the cathode connector comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
18. Apparatus according to Claim 17 wherein teeth or discs are adjustably spaced along the main portion of the cathode.
19. Electro-plating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with a plurality of discrete regions extending substantially across the width of the substrate and normal to the direction of movement of the substrate and not in the plane of the substrate.
20. An electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
21. A method according to Claim 19 wherein the cathode connector comprises a comb-shaped element having an elongate body and at least one finger extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
22. A method according to Claim 21 wherein said connector includes at least one tooth flexibly biased towards a location for a substrate on which material is to be deposited.
23. A method according to Claim 21 or 22 wherein said at least one tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
24. A method according to Claim 20 wherein the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
25. A method according to any of Claims 19 to 24 wherein the cathode is formed of copper or beryllium copper, or phosphor bronze, or stainless steel.
26. A method according to any of Claims 19 to 25 comprising passing a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial or part of, or all, the width of the substrate.
27. A method according to any of Claims 19 to 26 comprising immersing the substrate, onto which material is to be deposited, into an electro-plating bath containing electrolyte.
28. A method according to Claim 27 comprising passing the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before entering the bath.
29. A method according to Claim 27 or 28 comprising passing the substrate over the cathode connector located adjacent to the path of a substrate to contact with the substrate after leaving the bath.
30. A method according to any of Claims 27 to 29 comprising cleaning the substrate downstream of the cathode connector to remove electrolyte.
31. A method according to any of Claims 27 to 30 comprising cleaning the substrate upstream of the cathode to remove electrolyte.
32. A method according to any of Claims 27 to 31 comprising directing a cleansing fluid against the substrate.
33. A method according to any of Claims 19 to 26 comprising effecting dry plating of material onto a substrate.
34. A method according to Claim 33 comprising a tool having a absorptive member to carry plating solution.
35. A method according to any of Claims 19 to 34 wherein the cathode connector comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
36. A method according to any of Claims 19 to 35 comprising adjusting the spacing of the teeth or discs along the main portion of the cathode.
37. A computer program product directly loadable into the internal memory of a digital computer, comprising software code portions for performing the steps of a method according to any one or more of Claims 19 to 36 when said product is run on a computer.
38. Electronic distribution of a computer program as defined in Claim 37.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0005883.4A GB0005883D0 (en) | 2000-03-13 | 2000-03-13 | Electro-plating apparatus and a method of electoplating |
| GB0005883.4 | 2000-03-13 | ||
| PCT/GB2001/001086 WO2001068951A1 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2403116A1 true CA2403116A1 (en) | 2001-09-20 |
Family
ID=9887431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002403116A Abandoned CA2403116A1 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
Country Status (12)
| Country | Link |
|---|---|
| EP (1) | EP1266052A1 (en) |
| JP (1) | JP2003527489A (en) |
| KR (1) | KR20030007464A (en) |
| CN (1) | CN1425080A (en) |
| AU (1) | AU775221B2 (en) |
| BR (1) | BR0109301A (en) |
| CA (1) | CA2403116A1 (en) |
| GB (1) | GB0005883D0 (en) |
| HK (1) | HK1053153A1 (en) |
| MX (1) | MXPA02008976A (en) |
| RU (1) | RU2244767C2 (en) |
| WO (1) | WO2001068951A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4479535B2 (en) | 2005-02-21 | 2010-06-09 | セイコーエプソン株式会社 | Optical element manufacturing method |
| CN103603025A (en) * | 2013-12-02 | 2014-02-26 | 昆山亿诚化工容器有限公司 | Device for electroplating metal coiled material |
| CN105603494A (en) * | 2016-01-27 | 2016-05-25 | 南通彩都新能源科技有限公司 | Electrophoretic deposition system and method for preparing silicon-based anode material of lithium ion battery |
| CN109750281B (en) * | 2017-11-07 | 2024-04-12 | 东莞市腾明智能设备有限公司 | Horizontal copper deposition device |
| JP7113881B2 (en) * | 2019-12-11 | 2022-08-05 | エスケー ネクシリス カンパニー リミテッド | Cathode assembly for plating equipment |
| CN111270283A (en) * | 2020-03-19 | 2020-06-12 | 苏州太阳井新能源有限公司 | Upper electrode-free horizontal electroplating method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2156981A5 (en) * | 1971-10-13 | 1973-06-01 | Honeywell Bull | |
| DE3603856C2 (en) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Method and device for galvanizing flat workpieces such as printed circuit boards |
| EP0889680A3 (en) * | 1997-07-01 | 2000-07-05 | Deutsche Thomson-Brandt Gmbh | Method of removing and/or applying conductive material |
| IT1298150B1 (en) * | 1998-01-19 | 1999-12-20 | Occleppo Di Francesco Occleppo | DEVICE FOR ELECTROLYTIC DEPOSITION ON TRANSLATING METALLIC SHEETS IN SPECIES FOR PRINTED CIRCUITS, BY CLOSING A |
-
2000
- 2000-03-13 GB GBGB0005883.4A patent/GB0005883D0/en not_active Ceased
-
2001
- 2001-03-13 WO PCT/GB2001/001086 patent/WO2001068951A1/en active IP Right Grant
- 2001-03-13 KR KR1020027012079A patent/KR20030007464A/en active IP Right Grant
- 2001-03-13 JP JP2001567826A patent/JP2003527489A/en active Pending
- 2001-03-13 AU AU40804/01A patent/AU775221B2/en not_active Ceased
- 2001-03-13 BR BR0109301-0A patent/BR0109301A/en not_active IP Right Cessation
- 2001-03-13 MX MXPA02008976A patent/MXPA02008976A/en not_active Application Discontinuation
- 2001-03-13 CA CA002403116A patent/CA2403116A1/en not_active Abandoned
- 2001-03-13 CN CN01808237A patent/CN1425080A/en active Pending
- 2001-03-13 EP EP01911882A patent/EP1266052A1/en not_active Withdrawn
- 2001-03-13 RU RU2002127419/02A patent/RU2244767C2/en not_active IP Right Cessation
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2003
- 2003-06-18 HK HK03104367.4A patent/HK1053153A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB0005883D0 (en) | 2000-05-03 |
| MXPA02008976A (en) | 2004-10-14 |
| AU4080401A (en) | 2001-09-24 |
| AU775221B2 (en) | 2004-07-22 |
| KR20030007464A (en) | 2003-01-23 |
| CN1425080A (en) | 2003-06-18 |
| HK1053153A1 (en) | 2003-10-10 |
| BR0109301A (en) | 2002-12-24 |
| EP1266052A1 (en) | 2002-12-18 |
| JP2003527489A (en) | 2003-09-16 |
| WO2001068951A1 (en) | 2001-09-20 |
| RU2244767C2 (en) | 2005-01-20 |
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