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CA2383740A1 - Silicon-based sensor system - Google Patents

Silicon-based sensor system Download PDF

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Publication number
CA2383740A1
CA2383740A1 CA002383740A CA2383740A CA2383740A1 CA 2383740 A1 CA2383740 A1 CA 2383740A1 CA 002383740 A CA002383740 A CA 002383740A CA 2383740 A CA2383740 A CA 2383740A CA 2383740 A1 CA2383740 A1 CA 2383740A1
Authority
CA
Canada
Prior art keywords
microphone
silicon
surface mount
different elements
sensor system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002383740A
Other languages
French (fr)
Other versions
CA2383740C (en
Inventor
Matthias Mullenborn
Jochen F. Kuhmann
Peter U. Scheel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pulse Mems ApS
TDK Corp
Original Assignee
MEMS APS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by MEMS APS filed Critical MEMS APS
Publication of CA2383740A1 publication Critical patent/CA2383740A1/en
Application granted granted Critical
Publication of CA2383740C publication Critical patent/CA2383740C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Air Bags (AREA)
  • Silicon Polymers (AREA)

Abstract

The present invention relates to solid state silicon-based condenser microphone systems suitable for batch production.
The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.
CA002383740A 1999-09-06 2000-09-06 Silicon-based sensor system Expired - Fee Related CA2383740C (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DKPA1999/01254 1999-09-06
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/391,628 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
US09/570,434 2000-05-12
PCT/DK2000/000491 WO2001019134A2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Publications (2)

Publication Number Publication Date
CA2383740A1 true CA2383740A1 (en) 2001-03-15
CA2383740C CA2383740C (en) 2005-04-05

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002383740A Expired - Fee Related CA2383740C (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Country Status (10)

Country Link
EP (1) EP1214864B1 (en)
JP (2) JP4459498B2 (en)
CN (1) CN1203726C (en)
AT (1) ATE242587T1 (en)
AU (1) AU6984100A (en)
CA (1) CA2383740C (en)
DE (1) DE60003199T2 (en)
DK (1) DK1214864T3 (en)
PL (1) PL209935B1 (en)
WO (1) WO2001019134A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE40781E1 (en) 2001-05-31 2009-06-23 Pulse Mems Aps Method of providing a hydrophobic layer and condenser microphone having such a layer

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US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (en) * 2003-05-27 2004-12-16 Hosiden Corp Sound detection mechanism and manufacturing method thereof
CN100515119C (en) * 2003-08-12 2009-07-15 中国科学院声学研究所 Chip for silicon micro capacitor microphone and its preparation method
CN100499877C (en) * 2003-12-17 2009-06-10 中国科学院声学研究所 Chip having high sensitivity for silicon micro-capacitor microphone and preparation method thereof
DE102004011203B4 (en) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Method for mounting semiconductor chips and corresponding semiconductor chip arrangement
JP4553611B2 (en) 2004-03-15 2010-09-29 三洋電機株式会社 Circuit equipment
JP4539450B2 (en) * 2004-11-04 2010-09-08 オムロン株式会社 Capacitive vibration sensor and manufacturing method thereof
DE102005008511B4 (en) 2005-02-24 2019-09-12 Tdk Corporation MEMS microphone
DE102005008512B4 (en) 2005-02-24 2016-06-23 Epcos Ag Electrical module with a MEMS microphone
DE102005053767B4 (en) 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102005053765B4 (en) 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
DE102005056759A1 (en) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units
CN101005718B (en) * 2006-01-16 2011-04-20 财团法人工业技术研究院 Microacoustic sensor and manufacturing method thereof
JP4771290B2 (en) * 2006-07-19 2011-09-14 ヤマハ株式会社 Manufacturing method of pressure sensor
DE112007003083B4 (en) * 2006-12-22 2019-05-09 Tdk Corp. Microphone assembly with underfill with low coefficient of thermal expansion
JP4893380B2 (en) * 2007-03-09 2012-03-07 ヤマハ株式会社 Condenser microphone device
DE102007008518A1 (en) * 2007-02-21 2008-08-28 Infineon Technologies Ag Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
US8767983B2 (en) 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (en) * 2007-09-26 2009-04-16 Rohm Co Ltd Semiconductor sensor device
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
JP5844155B2 (en) * 2008-10-14 2016-01-13 ノールズ エレクトロニクス，リミテッド ライアビリティ カンパニー Microphone including multiple transducer elements
CN102428711A (en) * 2009-05-18 2012-04-25 美商楼氏电子有限公司 Microphone with reduced vibration sensitivity
KR101609270B1 (en) 2009-08-12 2016-04-06 삼성전자주식회사 Piezoelectric micro speaker and method of manufacturing the same
DE102009047592B4 (en) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Process for producing a silicon intermediate carrier
IT1397976B1 (en) * 2009-12-23 2013-02-04 St Microelectronics Rousset MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE.
JP2013093637A (en) * 2010-02-24 2013-05-16 Panasonic Corp Semiconductor device and manufacturing method of the same
TWI491009B (en) 2010-10-08 2015-07-01 Chip level emi shielding structure and manufacture method thereof
CN102456669B (en) * 2010-10-25 2015-07-22 环旭电子股份有限公司 Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
US9108840B2 (en) * 2010-12-30 2015-08-18 Goertek Inc. MEMS microphone and method for packaging the same
JP5721452B2 (en) * 2011-01-27 2015-05-20 ローム株式会社 Capacitive MEMS sensor
JP5799619B2 (en) 2011-06-24 2015-10-28 船井電機株式会社 Microphone unit
DE102011086722A1 (en) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (en) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Micromechanical sound transducer arrangement and a corresponding manufacturing method
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
DE112012007235T5 (en) * 2012-12-18 2015-09-24 Epcos Ag Top port mems microphone and method of making it
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (en) * 2013-04-30 2014-10-31 St Microelectronics Srl SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE
US9264832B2 (en) * 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2529134B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
JP6657545B2 (en) * 2014-09-17 2020-03-04 インテル・コーポレーション Die with integrated microphone device using through silicon via (TSV)
CN104780490A (en) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 MEMS microphone packaging structure and manufacturing method thereof
TWI660466B (en) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 Package structure and method of manufacture thereof
CN111711903B (en) * 2020-06-24 2021-10-01 歌尔微电子有限公司 Miniature Microphone Dustproof Device and MEMS Microphone

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US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE40781E1 (en) 2001-05-31 2009-06-23 Pulse Mems Aps Method of providing a hydrophobic layer and condenser microphone having such a layer

Also Published As

Publication number Publication date
CN1387741A (en) 2002-12-25
WO2001019134A2 (en) 2001-03-15
AU6984100A (en) 2001-04-10
DK1214864T3 (en) 2003-08-25
CA2383740C (en) 2005-04-05
JP4303742B2 (en) 2009-07-29
EP1214864A2 (en) 2002-06-19
DE60003199D1 (en) 2003-07-10
PL209935B1 (en) 2011-11-30
WO2001019134A3 (en) 2001-09-07
EP1214864B1 (en) 2003-06-04
JP4459498B2 (en) 2010-04-28
JP2003508998A (en) 2003-03-04
CN1203726C (en) 2005-05-25
PL354095A1 (en) 2003-12-29
DE60003199T2 (en) 2004-07-01
JP2007028671A (en) 2007-02-01
ATE242587T1 (en) 2003-06-15

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MKLA Lapsed

Effective date: 20190906