CA1146272A - Memory cards - Google Patents
Memory cardsInfo
- Publication number
- CA1146272A CA1146272A CA000374666A CA374666A CA1146272A CA 1146272 A CA1146272 A CA 1146272A CA 000374666 A CA000374666 A CA 000374666A CA 374666 A CA374666 A CA 374666A CA 1146272 A CA1146272 A CA 1146272A
- Authority
- CA
- Canada
- Prior art keywords
- memory card
- conductive
- card according
- circuit
- plastic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
Abstract
ABSTRACT
IMPROVEMENTS TO MEMORY CARDS
In a plastic transaction card containing and integrated memory and data processing circuit, the circuit is surrounded by an electrostatic screen comprising an electrically-conductive polyurethane foam with a sufficiently high resistivity to avoid short-circuiting the circuit terminals, or a foil of metal or metallised plastic, or both. If the circuit is mounted using TAB
(tape automated bonding), the screen can be formed by retention of part of the metallisation on the film substrate surrounding the circuit.
IMPROVEMENTS TO MEMORY CARDS
In a plastic transaction card containing and integrated memory and data processing circuit, the circuit is surrounded by an electrostatic screen comprising an electrically-conductive polyurethane foam with a sufficiently high resistivity to avoid short-circuiting the circuit terminals, or a foil of metal or metallised plastic, or both. If the circuit is mounted using TAB
(tape automated bonding), the screen can be formed by retention of part of the metallisation on the film substrate surrounding the circuit.
Description
IMPROVEMENTS TO MEMORY CARDS
-This invention relates to portable memory cards and more particularly to cards containing an electronic circuit in the form of an integrated circuit eomprising a memory and date processing circuitry.
It is known to use such cards as identification or access control cards, credit or payment cards, or more generally as transaction cards for keeping account of banking or commercial operations. Hereinafter, the term "memory card" will be used to refer to a card of the above type, whatever its purpose may be.
In a memory card, the chip forming the electronic circuit is embedded in an insulating plastic material constituting the card proper with standardised dimensions.
The circuitry contained in the chip is provided with eonduetors ending at contact terminals, external or internal, for example as described in Canadian Patent Application No. 365.505 filed by the present applicant on the 26th November 1980, to enable this circuitry to be electrically connected to a transfer apparatus for the reading and/or writing of date in the card memory.
It can happen that, as a result of rubbing for example, electrostatie eharges are indueed on the surfaee and in the plastie material eonstituting the eard and that these localised charges cause electrostatic potentials which are dangerous not only in relation to the use of data in the card, but also for the eleetronic circuit itself which can be damaged, in particular if this cireuit is fabrieated using the MOS semieonduetor technique.
Thus the invention has as its objeet a memory eard of the type deseribed above in whieh there is provision for avoiding the appearance and development of sueh eleetrostatie potentials.
Aeeording to this invention there is provided a portable memory card of the type eomprising an eleetronic eireuit in the form of an integrated eireuit embedded in an insulating plastie material, the said circuit having eonduetors eoupled to eontaet terminals ,~
1 enabling the card to be electrically connected with a data transfer apparatus, characterised in that it ~urther comprises means for producing a conductive equipokential region at least partly surrounding the said electronic circuit and within which parasitic electrostatic charges tend to distribute themselves equipotentially.
The said means for producing a conductive equip-otential region around the electronic circuit can comprise either a coating of plastic material containing conductive material, or a screen formed by a conductive jacket embedded in the plastic material of the card, or a combination of these two arrangements.
The use of a material containing conductive material, that is to say conductive in the mass, permits parasitic electric charges to flow and distribute themselves equipotentially thereby avoiding localised charges sufficiently large to affect the integrated circuit in the card and perturb in particular the data memory. Likewise, the use of a conductive jacket also enables the formation of an equipotential region within it~ protecting the circuit from the influence of static electric charges.
Various memory cards in accordance with this ~-inYention will now be described, by way of ex~mple, with reference ~o the accompanying drawings, in which:-Figure 1 shows schematically in longitudinal section a first embodiment of a memory card, with internal contac~ terminals, Figure 2 shows a first embodiment of a memory card, -with external contact terminals;
Figure 3 shows schematically another embodiment of a memory card7with internal contact terminals;
Figure 4 shows a memory card as in the embodiment 3~ of Figure 3, but with external contact terminals;
-This invention relates to portable memory cards and more particularly to cards containing an electronic circuit in the form of an integrated circuit eomprising a memory and date processing circuitry.
It is known to use such cards as identification or access control cards, credit or payment cards, or more generally as transaction cards for keeping account of banking or commercial operations. Hereinafter, the term "memory card" will be used to refer to a card of the above type, whatever its purpose may be.
In a memory card, the chip forming the electronic circuit is embedded in an insulating plastic material constituting the card proper with standardised dimensions.
The circuitry contained in the chip is provided with eonduetors ending at contact terminals, external or internal, for example as described in Canadian Patent Application No. 365.505 filed by the present applicant on the 26th November 1980, to enable this circuitry to be electrically connected to a transfer apparatus for the reading and/or writing of date in the card memory.
It can happen that, as a result of rubbing for example, electrostatie eharges are indueed on the surfaee and in the plastie material eonstituting the eard and that these localised charges cause electrostatic potentials which are dangerous not only in relation to the use of data in the card, but also for the eleetronic circuit itself which can be damaged, in particular if this cireuit is fabrieated using the MOS semieonduetor technique.
Thus the invention has as its objeet a memory eard of the type deseribed above in whieh there is provision for avoiding the appearance and development of sueh eleetrostatie potentials.
Aeeording to this invention there is provided a portable memory card of the type eomprising an eleetronic eireuit in the form of an integrated eireuit embedded in an insulating plastie material, the said circuit having eonduetors eoupled to eontaet terminals ,~
1 enabling the card to be electrically connected with a data transfer apparatus, characterised in that it ~urther comprises means for producing a conductive equipokential region at least partly surrounding the said electronic circuit and within which parasitic electrostatic charges tend to distribute themselves equipotentially.
The said means for producing a conductive equip-otential region around the electronic circuit can comprise either a coating of plastic material containing conductive material, or a screen formed by a conductive jacket embedded in the plastic material of the card, or a combination of these two arrangements.
The use of a material containing conductive material, that is to say conductive in the mass, permits parasitic electric charges to flow and distribute themselves equipotentially thereby avoiding localised charges sufficiently large to affect the integrated circuit in the card and perturb in particular the data memory. Likewise, the use of a conductive jacket also enables the formation of an equipotential region within it~ protecting the circuit from the influence of static electric charges.
Various memory cards in accordance with this ~-inYention will now be described, by way of ex~mple, with reference ~o the accompanying drawings, in which:-Figure 1 shows schematically in longitudinal section a first embodiment of a memory card, with internal contac~ terminals, Figure 2 shows a first embodiment of a memory card, -with external contact terminals;
Figure 3 shows schematically another embodiment of a memory card7with internal contact terminals;
Figure 4 shows a memory card as in the embodiment 3~ of Figure 3, but with external contact terminals;
2'7.~
- 3 -1 Figures 5 and 6 sho~s a memory card incorporating both the arrangements of the preceding embodiments; and Figure 7 shows yet another embodiment of the invention.
Referring to Fig~ure 1, there is shown a memory card 10 in longitudinal section, in which an electronic circuit 11~
such as an integrated circuit in the form of a chip, connected by conductors 12 to internal contact ter~inals 13, is coated in a plastic material 14. This material 14 is for example formed of polyurethane foam, or more generally of an anti-static and electrically-conductiYe elastomer. The terminals 13 have been previously covered with a perforable plastic material 15, as described in the aforementioned patent application. The assembly of parts 11 to 15 is then embedded or coated in a plastic meterial 16 which forms the actual card 10 of standardised dimensions. The material 14 produces around the circuit 11 and its associated parts 12 and 13 a conductive region to avoid localised accumulation of electrostatic charges by facilitating the flow and equipotential distribution of these charges.
The conductivity of the material 14 is chosen to be sufficient to avoid such accumulation, but nonetheless to be too low to cause a short-circuit between neighbouring ` 25 conductors or contact terminals for the Yoltages normally used in the transfer apparatus enabl;ng processing of data contained in the circuit 11. The resistivity of the material 14 is for example chosen to produce a resistance of the order of 1 to 10 kilohms between neighbouring terminals.
Figure 2 shows a memory card of the same form as that preceding, but with external contact terminals. In this figure and those that follow, the same reference numerals will be used to indicate corresponding parts. As in the ; 35 case of Figure 1, the circuit 11 with its contact terminals . ~ . , ...... . .. ~, , .
1 13 and their perforable covering 15 is first coated in the conductive material 14, but such that this material is flush with the level of the covering 15 of the terminals 13 and forms in plan a surface surrounding at the same time the S circuit 11 and its terminals 13. This first assembly is then partially embedded in the material 16 giving the card 10 its final form, while leaving the conductive material 14 free of an~ covering in the central part of the card in its upper part.
Figure 3 shows another embodiment of memory card in which an electrostatic screen is used to produce the conductive equipotential region around the electronic circuit of the card. The circuit 11 and its associated parts 12, 13 and 15 are placed within a conductive jacket 17 comprising one or several thin foils of a good electrical conductivity metal or of a metallised insulator, before being embedded in the material 16 to form the card to its final size.
The conductive jackethas of ~ourse openings 18 formed over the terminals 13 and perm~tting movable contacts of the transFer apparatus to a pass through and come into contact with the corresponding terminals of the card 10. The jacket 17 thus produces around the circuit 11 and its associated parts a conductive equipotential region acting as a Faraday cage and protecting it from external parasitic electrostatic potent;als.
In Figure 4 there is shown a memory card with surface contacts and formed in the same way as the precading example, the upper part of the jacket 17 extending flush in this case with the surface of the card 10.
Figure 5 shows a memory card with internal contacts in which the arrangements of Figures 1 and 3 are used together, that is to say in which the conductive material 14 is itself enclosed in a conductive jacket 17 before being embedded in the material 16, so as to augment thereby the protection against external electrostatic charges.
Figure 6 shows a memory card with external contacts having the double protective arrangement- of the preceding figure.
l Where the integrated circuit chip is mounted on a flexible insulating film, commonly called TAB (tape automated bonding), to which it is joined by conductors obtained by chem-ical etching of metallisation deposited on this ~i~m, another ihlplementation of the conductive jacket advantageously comprises retaining the metallisation of the film in a zone surrounding the chip and its conductors to form, on one of the faces o~
the circuit, part of the conductive jacket acting as electro-static screen. Figure 7 shows schematically a plan view of `this implementation. In this figure, the circuit ll is shown joined by its conductors 12 to the terminals 13 which lie at the edges of an opening 21 formed in a substrate consisting of a flexible film 20, for example of polyamide material, such as Kapton (trade mark) made by the firm du PDnt de Nemours.
The conductors 12 and the terminals 13 are formed, ;n known manner, by an initial metallisation of the film 20 and by the selective removal of this metallisation, for example by chemical attack, according to the configuration of the conductive tracks which it is desired to keep.
In using the present invention the initial metallisation of the film 20 is further retained in a zone 22 surrounding the terminals 13 and the opening 21 so that this auxilary metallisation 22 forms the first part of the electrostatic 6creen on the upper surface of the circuit ll. Preferably, the metallisation 22 is coupled by a conductive track 25 to a voltage reference point, such as the terminal 130 at zero volts. The second part of the electrostatic screen on the lower surface of the circuit ll can-be proYided either by an additional metallisation on the other side 23 of the film 20 in a zone corresponding to the zone 22, or by the application of a thin metallised plastic foil 24. The two upper and lower metallisations 22 and 23 or 24 are connected together by a conductive link 26 extending through the film 20 such that both are connected i2~
1 to the same potential, for e~ample zero volts. It will be understood that the assembly, having been metallised on both sides, is then embedded in the plastic material making the card into its final form as in the preceding examples.
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, . .
Referring to Fig~ure 1, there is shown a memory card 10 in longitudinal section, in which an electronic circuit 11~
such as an integrated circuit in the form of a chip, connected by conductors 12 to internal contact ter~inals 13, is coated in a plastic material 14. This material 14 is for example formed of polyurethane foam, or more generally of an anti-static and electrically-conductiYe elastomer. The terminals 13 have been previously covered with a perforable plastic material 15, as described in the aforementioned patent application. The assembly of parts 11 to 15 is then embedded or coated in a plastic meterial 16 which forms the actual card 10 of standardised dimensions. The material 14 produces around the circuit 11 and its associated parts 12 and 13 a conductive region to avoid localised accumulation of electrostatic charges by facilitating the flow and equipotential distribution of these charges.
The conductivity of the material 14 is chosen to be sufficient to avoid such accumulation, but nonetheless to be too low to cause a short-circuit between neighbouring ` 25 conductors or contact terminals for the Yoltages normally used in the transfer apparatus enabl;ng processing of data contained in the circuit 11. The resistivity of the material 14 is for example chosen to produce a resistance of the order of 1 to 10 kilohms between neighbouring terminals.
Figure 2 shows a memory card of the same form as that preceding, but with external contact terminals. In this figure and those that follow, the same reference numerals will be used to indicate corresponding parts. As in the ; 35 case of Figure 1, the circuit 11 with its contact terminals . ~ . , ...... . .. ~, , .
1 13 and their perforable covering 15 is first coated in the conductive material 14, but such that this material is flush with the level of the covering 15 of the terminals 13 and forms in plan a surface surrounding at the same time the S circuit 11 and its terminals 13. This first assembly is then partially embedded in the material 16 giving the card 10 its final form, while leaving the conductive material 14 free of an~ covering in the central part of the card in its upper part.
Figure 3 shows another embodiment of memory card in which an electrostatic screen is used to produce the conductive equipotential region around the electronic circuit of the card. The circuit 11 and its associated parts 12, 13 and 15 are placed within a conductive jacket 17 comprising one or several thin foils of a good electrical conductivity metal or of a metallised insulator, before being embedded in the material 16 to form the card to its final size.
The conductive jackethas of ~ourse openings 18 formed over the terminals 13 and perm~tting movable contacts of the transFer apparatus to a pass through and come into contact with the corresponding terminals of the card 10. The jacket 17 thus produces around the circuit 11 and its associated parts a conductive equipotential region acting as a Faraday cage and protecting it from external parasitic electrostatic potent;als.
In Figure 4 there is shown a memory card with surface contacts and formed in the same way as the precading example, the upper part of the jacket 17 extending flush in this case with the surface of the card 10.
Figure 5 shows a memory card with internal contacts in which the arrangements of Figures 1 and 3 are used together, that is to say in which the conductive material 14 is itself enclosed in a conductive jacket 17 before being embedded in the material 16, so as to augment thereby the protection against external electrostatic charges.
Figure 6 shows a memory card with external contacts having the double protective arrangement- of the preceding figure.
l Where the integrated circuit chip is mounted on a flexible insulating film, commonly called TAB (tape automated bonding), to which it is joined by conductors obtained by chem-ical etching of metallisation deposited on this ~i~m, another ihlplementation of the conductive jacket advantageously comprises retaining the metallisation of the film in a zone surrounding the chip and its conductors to form, on one of the faces o~
the circuit, part of the conductive jacket acting as electro-static screen. Figure 7 shows schematically a plan view of `this implementation. In this figure, the circuit ll is shown joined by its conductors 12 to the terminals 13 which lie at the edges of an opening 21 formed in a substrate consisting of a flexible film 20, for example of polyamide material, such as Kapton (trade mark) made by the firm du PDnt de Nemours.
The conductors 12 and the terminals 13 are formed, ;n known manner, by an initial metallisation of the film 20 and by the selective removal of this metallisation, for example by chemical attack, according to the configuration of the conductive tracks which it is desired to keep.
In using the present invention the initial metallisation of the film 20 is further retained in a zone 22 surrounding the terminals 13 and the opening 21 so that this auxilary metallisation 22 forms the first part of the electrostatic 6creen on the upper surface of the circuit ll. Preferably, the metallisation 22 is coupled by a conductive track 25 to a voltage reference point, such as the terminal 130 at zero volts. The second part of the electrostatic screen on the lower surface of the circuit ll can-be proYided either by an additional metallisation on the other side 23 of the film 20 in a zone corresponding to the zone 22, or by the application of a thin metallised plastic foil 24. The two upper and lower metallisations 22 and 23 or 24 are connected together by a conductive link 26 extending through the film 20 such that both are connected i2~
1 to the same potential, for e~ample zero volts. It will be understood that the assembly, having been metallised on both sides, is then embedded in the plastic material making the card into its final form as in the preceding examples.
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;
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, . .
Claims (11)
1. A portable memory card of the type comprising an electronic circuit in the form of an integrated circuit embedded in an insulating plastic material, the said circuit having conductors coupled to contact terminals enabling the card to be electrically connected with a data transfer appar-atus, characterised in that it further comprises means for producing a conductive equipotential region at least partly surrounding the said electronic circuit and within which parasitic electrostatic charges tend to distribute themselves equipotentially.
2. A memory card according to claim 1, characterised in that the said means for producing a conductive region comprises a coating of plastic material containing conductive material.
3. A memory card according to claim 2, characterised in that the resistivity of the said plastic material containing conductive material is chosen for a resistance of the order of 1 to 10 kilohms between neighbouring contact terminals.
4. A memory card according to claim 1, characterised in that the said means for producing a conductive region comprises a conductive jacket.
5. A memory card according to claims 2 , charact-erised in that the said means for producing a conductive region comprises a coating of plastic material containing conductive material disposed within a conductive jacket.
6. A memory card according to claim 2, characterised in that the plastic material containing conductive material is an antistatic elastomer.
7. A memory card according to claim 6, characterised in that the said elastomer is a polyurethane foam.
8. A memory card according to claim 4,wherein the electronic circuit is mounted in a flexible film to which it is joined by said conductors, characterised in that the said conductive jacket comprises a metallisation on at least one-of the surfaces of the film in a zone surrounding the circuit and its conductors.
9. A memory card according to claim 8, characterised in that the said conductive jacket further comprises an additional metallisation on the other surface of the film in a corresponding zone.
10. A memory card according to claim 8, characterised in that the said conductive jacket further comprises a conductive foil disposed on the non-metallised surface of the film.
11. A memory card according to claim 8, characterised in that the metallisation is connected to a voltage reference point.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8007644A FR2480008A1 (en) | 1980-04-04 | 1980-04-04 | IMPROVEMENTS TO MEMORY CARDS |
| FR80-07644 | 1980-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1146272A true CA1146272A (en) | 1983-05-10 |
Family
ID=9240543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000374666A Expired CA1146272A (en) | 1980-04-04 | 1981-04-03 | Memory cards |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0037760A1 (en) |
| JP (1) | JPS56157590A (en) |
| CA (1) | CA1146272A (en) |
| FR (1) | FR2480008A1 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3051195C2 (en) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Package for integrated circuit incorporated in identity cards |
| FR2505091A1 (en) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | DEVICE FOR PROTECTING ELECTRONIC CIRCUITS SUCH AS INTEGRATED CIRCUITS AGAINST ELECTROSTATIC LOADS |
| DE3118298A1 (en) * | 1981-05-08 | 1982-12-02 | Gao Ges Automation Org | ID CARD WITH STORED IC BLOCK |
| JPS5890449U (en) * | 1981-12-11 | 1983-06-18 | 黒谷 信子 | verification card |
| JPS5890450U (en) * | 1981-12-11 | 1983-06-18 | 黒谷 信子 | verification card |
| JPS58151299A (en) * | 1982-03-05 | 1983-09-08 | 相合 征一郎 | Collating card |
| JPS5922355A (en) * | 1982-07-29 | 1984-02-04 | Dainippon Printing Co Ltd | Integrated circuit card |
| CA1204213A (en) * | 1982-09-09 | 1986-05-06 | Masahiro Takeda | Memory card having static electricity protection |
| FR2548409B1 (en) * | 1983-06-29 | 1985-11-15 | Sligos | PROCESS FOR THE MANUFACTURE OF MEMORY CARDS, INSTALLATION AND MEMORY CARDS OBTAINED |
| JPS60109155U (en) * | 1983-12-28 | 1985-07-24 | ソニー株式会社 | memory card |
| JPS61286989A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Ind Co Ltd | Ic card |
| JPS61286990A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Ind Co Ltd | Ic card |
| JPH0444381Y2 (en) * | 1985-12-27 | 1992-10-20 | ||
| JPS62236793A (en) * | 1986-04-07 | 1987-10-16 | 松下電子工業株式会社 | Integrated circuit card |
| FR2609820B1 (en) * | 1987-01-20 | 1991-04-19 | Thomson Semiconducteurs | ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE |
| CA1278618C (en) * | 1987-07-20 | 1991-01-02 | George Erdos | Plastic encapsulated integrated circuit package with electrostatic shield |
| FR2633141B1 (en) * | 1988-06-17 | 1992-02-14 | Sgs Thomson Microelectronics | CHIP CARD WITH PROTECTION SCREEN |
| FR2636776A1 (en) * | 1988-09-16 | 1990-03-23 | Trt Telecom Radio Electr | DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT, PROTECTING AGAINST STATIC ELECTRICITY DISCHARGES, AND A FLEXIBLE CARD COMPRISING SAME |
| JP2669094B2 (en) * | 1990-02-13 | 1997-10-27 | 三菱電機株式会社 | IC card |
| FR2663445A1 (en) * | 1990-06-15 | 1991-12-20 | Matra Communication | ELECTRONIC CARD. |
| DE4436687C2 (en) * | 1994-10-13 | 1996-12-05 | Siemens Ag | X-ray device |
| DE19614914A1 (en) * | 1996-04-16 | 1997-10-23 | Telesensomatic Gmbh | Transponder arrangement with single- or multi-layer integrated circuit |
| JP3785083B2 (en) | 2001-11-07 | 2006-06-14 | 株式会社東芝 | Semiconductor device, electronic card and pad rearrangement substrate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3637994A (en) * | 1970-10-19 | 1972-01-25 | Trw Inc | Active electrical card device |
| US3702464A (en) * | 1971-05-04 | 1972-11-07 | Ibm | Information card |
| FR2337381A1 (en) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD |
| FR2470414A1 (en) * | 1979-11-27 | 1981-05-29 | Flonic Sa | ELECTRICAL CONNECTION SYSTEM AND MEMORY CARD APPLYING THE SYSTEM |
-
1980
- 1980-04-04 FR FR8007644A patent/FR2480008A1/en active Granted
-
1981
- 1981-03-19 EP EP81400427A patent/EP0037760A1/en not_active Ceased
- 1981-04-03 CA CA000374666A patent/CA1146272A/en not_active Expired
- 1981-04-03 JP JP4950681A patent/JPS56157590A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0037760A1 (en) | 1981-10-14 |
| FR2480008B1 (en) | 1984-10-26 |
| FR2480008A1 (en) | 1981-10-09 |
| JPS56157590A (en) | 1981-12-04 |
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