CA1143024A - Hermetic electrical feedthrough assembly - Google Patents
Hermetic electrical feedthrough assemblyInfo
- Publication number
- CA1143024A CA1143024A CA000344568A CA344568A CA1143024A CA 1143024 A CA1143024 A CA 1143024A CA 000344568 A CA000344568 A CA 000344568A CA 344568 A CA344568 A CA 344568A CA 1143024 A CA1143024 A CA 1143024A
- Authority
- CA
- Canada
- Prior art keywords
- feedthrough
- gold
- niobium
- insulator
- sapphire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 23
- 239000010955 niobium Substances 0.000 claims abstract description 23
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 22
- 239000010980 sapphire Substances 0.000 claims abstract description 22
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 239000012212 insulator Substances 0.000 claims abstract description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 6
- 229910000756 V alloy Inorganic materials 0.000 claims abstract description 6
- 229910000946 Y alloy Inorganic materials 0.000 claims abstract description 6
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims abstract description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910000542 Sc alloy Inorganic materials 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 6
- 239000007943 implant Substances 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000011179 visual inspection Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 9
- 238000005219 brazing Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- XUKUURHRXDUEBC-KAYWLYCHSA-N Atorvastatin Chemical compound C=1C=CC=CC=1C1=C(C=2C=CC(F)=CC=2)N(CC[C@@H](O)C[C@@H](O)CC(O)=O)C(C(C)C)=C1C(=O)NC1=CC=CC=C1 XUKUURHRXDUEBC-KAYWLYCHSA-N 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001257 Nb alloy Inorganic materials 0.000 description 1
- NLMGWKBNMIMNAS-UHFFFAOYSA-N [Y].[V].[Au] Chemical compound [Y].[V].[Au] NLMGWKBNMIMNAS-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3752—Details of casing-lead connections
- A61N1/3754—Feedthroughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/186—Sealing members characterised by the disposition of the sealing members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/19—Sealing members characterised by the material
- H01M50/191—Inorganic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electrochemistry (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Radiology & Medical Imaging (AREA)
- Inorganic Chemistry (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Ceramic Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Materials For Medical Uses (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Disclosed is a hermetic electrical feedthrough consisting of a niobium electrical lead-in wire surrounded by a sapphire insulator which is carried by a niobium ferrule or the like. The lead-wire is brazed to the insulator and the insulator to the ferrule. The braze composition is se-lected from the group consisting of substantially pure gold and an alloy of gold, vanadium, yttrium and/or scandium. The optical transparency of the sapphire allows visual inspection of the sapphire-to-niobium bond for the presence of defects. The feedthrough is particularly adapted for use in encapsulated electrical devices for human implant.
Disclosed is a hermetic electrical feedthrough consisting of a niobium electrical lead-in wire surrounded by a sapphire insulator which is carried by a niobium ferrule or the like. The lead-wire is brazed to the insulator and the insulator to the ferrule. The braze composition is se-lected from the group consisting of substantially pure gold and an alloy of gold, vanadium, yttrium and/or scandium. The optical transparency of the sapphire allows visual inspection of the sapphire-to-niobium bond for the presence of defects. The feedthrough is particularly adapted for use in encapsulated electrical devices for human implant.
Description
This inven1ion relates to a hel~etic electrical feedthrough assembly which makes use of niobium and sapphire. The optical transparency of sapphire allows visual inspection of the sapphire-to-niobium bond for the presence of defects. I{ermetic seals in electrical feedthroughs consisting of the specific comblnations of materials disclosed herein and prepared according to this invention have been found to be more likely to resist delamination between the insulator and metal members of the feedthrough, ie., they are more resistant to stress induced cracking during fabrication or testing.
Sapphire is an alumimlm oxide which is grown with a single crystal lattice structure and can be easily cut and polished to optical clarity without creating cracks or defects. If cracks or defects do result during preparation of a sapphire insulator for a feedthrough or during fabrication oX the feedthrough assembly, they can be easily seen at low magnification.
The ease of visual inspection consequently allows for 100% final product in-spection. The specific combination of materials ie., sapphire and niobium, are resistant to defect formation during manufacture. Hence, greater yields are provided. Off-the-shelf watch jewels of sapphire are readily available for use in accordance with this invention.
It is a purpose of this invention to provide high yield electrical feedthroughs which can be optically inspected.
Additionally~ and more importantly, it is a purpose of this invent-ion to provide improved hermetic electrical feedthroughs which are particular-ly adapted for use in encapsulated electrical devices, such as electro-chemical cells, heartpacers and the like for human implant. Such devices require high assurety against the presence of defects and loss of hermeticity in the feedthroughs.
The improved feedthrough of the invention consists of a niobium ,~F
~ ~3~
lead wire extendi.ng through a sapphire insulator, preferably a disc-like insulator. The sapphire insulator is carried by a niobium ferrule or the like. The assembly is hrazed together by means of either a gold braze or a gold-vanadium-yttrium alloy braze. Some compositional variations are allow-ed in this alloy~as is discussed below. ~Vhen the gold braze is used, the surfaces of the sapphire in the brazed areas are first metallized with a discrete layer of titanium and a layer of gold, the gold overlaying the titanium.
Thus, in accordance with a broad aspect of tile invention, there is provided an electrical feedthrough comprising an electrical lead-wire con-sisting essentially of niobium; an insulator around a portion of the lead-wire, the insulator consisting essentially of sapphire; a ferrule consisting essentially of niobium positioned around at least a peripheral portion of the insulator, and brazes joining the lead-wire to the insulator and the insula-tor to the ferrule, the braze composition being selected from the group con-sisting of substantially pure gold and an alloy of gold, vanadium, yttrium and/or scandium and optionally including an amount of niobium.
The invention will now be further described in conjunction with the accompanying drawings, in which:
Figure 1 is the schematic cross-section of a first embodiment of a feedthrough according to the invention.
Figure 2 is a schematic cross-section of another embodiment of a feedthrough according to the invention.
Figure 3 is yet another schematic cross-section showing a third embodiment of a feedthrough according to the invention.
Figure 4 is a schematic cross-section of a fourth embodiment of the invention .
The electrical feedthroughs shown in Figures 1-4 represent several ~3~
variations of the invention. Ilowever, all of the embodiments include a more or less centrally positioned niobium lead-in wire or pin 10 extending through a sapphire lnsulator body 12. Body 12 is preferably generally disc shaped. Even more preferably, the sapphire body will be formed with a cup-like surface 12~a) as shown in Figures 1 and 2. The feedthrough assembly also includes a niobium ferrule or the like 14 which more or less peripherally contacts sapphire body 12 as is well known in the case of metal ferrule and glass insu]ator arrangements already known in this art. Ferrule 14 is utilized for mounting the feedthrough. For example, in a preferred use, this feedthrough will be mo~mted in a titanium encapsulating structure (not shown) which contains an electrical device for human implant. Normally, the ferrule will be welded to the titanium container.
The niobium used for the lead-wire and ferrule herein may also be a niobium alloy so long as its thermal expansion coefficient remains about + 10% of that of commercially pure niobium. An example of such an alloy is 99Nb-l~r (Wt.%). Herein, when these components are described as consisting essentially of niobium, such alloys are intended to be included along with pure niobium.
The members of the feedthrough are assembled together by brazing.
As is well known in the art, brazing of the feedthrough assembly may be accomplished by placing rings of the brazing material at the joints to be brazed and heating the assembly to the appropriate melting temperature of the braze material. Ilowever, in the instance of this invention, only two brazing materials are acceptable. The first and most preferred of these are alloys of gold, vanadium and yttrium and/or scandium and optionally including niobium. Assemblies using this alloy brazing material are shown in Figures 1, 2 and 3.
Brazing alloys of the foregoing type which may be utilized with ~3~2'~
this invention is disclosed in United States patent No. 4,180,700, issued Dec. 25, 1979, and assigned to the same assignee as is this application. As indicated therein, the alloys may include scandium and niobium. One exemp-lary alloy is vanadium-5.5%, yttrium-0.2%, balance gold, the percentages being expressed in terms of atomic percentages.
Another braze material which may be used, as mentioned above, is gold ie., commercially pure gold (99.9%). However, when the pure gold braze material is utilized, the sapphire must first be provided with a coating of titanium and a coating of gold over the titanium in the areas where the brazed joint is to be formed. These coatings are preferably formed by sputtering and may be very thin. Preferably the titanium will have a thick-ness on the order of about 10,000 angstroms and the gold will have a thickness on the order of about 2,000 angstroms. Such a metallized version is shown in Figure 4, the titanium and gold layers being schematically indicated at 18, the gold braze at 16 in Figure 4.
The different braze materials may be used in any of the feedthrough configurations disclosed herein. The various configurations differ in geometry, Figure 1 being the simplest. Figures 2 and 3 are self-fixturing due to the notched portions included in either the ferrule body 14, as shown in Figure 2, or in the insulator body 12, as shown in Figure 3.
The sapphire used herein may be the "clear" sapphire or the "doped"
sapphire ie., sapphire containing a few tenths of a percent of a dopant such as chromium, cobalt or nickel and taking on a characteristic color such as ruby, blue or emerald, respectively.
Having described the invention, the exclusive rights and privi-leges thereto are to be defined by the following claims in the light of the foregoing description:
.
Sapphire is an alumimlm oxide which is grown with a single crystal lattice structure and can be easily cut and polished to optical clarity without creating cracks or defects. If cracks or defects do result during preparation of a sapphire insulator for a feedthrough or during fabrication oX the feedthrough assembly, they can be easily seen at low magnification.
The ease of visual inspection consequently allows for 100% final product in-spection. The specific combination of materials ie., sapphire and niobium, are resistant to defect formation during manufacture. Hence, greater yields are provided. Off-the-shelf watch jewels of sapphire are readily available for use in accordance with this invention.
It is a purpose of this invention to provide high yield electrical feedthroughs which can be optically inspected.
Additionally~ and more importantly, it is a purpose of this invent-ion to provide improved hermetic electrical feedthroughs which are particular-ly adapted for use in encapsulated electrical devices, such as electro-chemical cells, heartpacers and the like for human implant. Such devices require high assurety against the presence of defects and loss of hermeticity in the feedthroughs.
The improved feedthrough of the invention consists of a niobium ,~F
~ ~3~
lead wire extendi.ng through a sapphire insulator, preferably a disc-like insulator. The sapphire insulator is carried by a niobium ferrule or the like. The assembly is hrazed together by means of either a gold braze or a gold-vanadium-yttrium alloy braze. Some compositional variations are allow-ed in this alloy~as is discussed below. ~Vhen the gold braze is used, the surfaces of the sapphire in the brazed areas are first metallized with a discrete layer of titanium and a layer of gold, the gold overlaying the titanium.
Thus, in accordance with a broad aspect of tile invention, there is provided an electrical feedthrough comprising an electrical lead-wire con-sisting essentially of niobium; an insulator around a portion of the lead-wire, the insulator consisting essentially of sapphire; a ferrule consisting essentially of niobium positioned around at least a peripheral portion of the insulator, and brazes joining the lead-wire to the insulator and the insula-tor to the ferrule, the braze composition being selected from the group con-sisting of substantially pure gold and an alloy of gold, vanadium, yttrium and/or scandium and optionally including an amount of niobium.
The invention will now be further described in conjunction with the accompanying drawings, in which:
Figure 1 is the schematic cross-section of a first embodiment of a feedthrough according to the invention.
Figure 2 is a schematic cross-section of another embodiment of a feedthrough according to the invention.
Figure 3 is yet another schematic cross-section showing a third embodiment of a feedthrough according to the invention.
Figure 4 is a schematic cross-section of a fourth embodiment of the invention .
The electrical feedthroughs shown in Figures 1-4 represent several ~3~
variations of the invention. Ilowever, all of the embodiments include a more or less centrally positioned niobium lead-in wire or pin 10 extending through a sapphire lnsulator body 12. Body 12 is preferably generally disc shaped. Even more preferably, the sapphire body will be formed with a cup-like surface 12~a) as shown in Figures 1 and 2. The feedthrough assembly also includes a niobium ferrule or the like 14 which more or less peripherally contacts sapphire body 12 as is well known in the case of metal ferrule and glass insu]ator arrangements already known in this art. Ferrule 14 is utilized for mounting the feedthrough. For example, in a preferred use, this feedthrough will be mo~mted in a titanium encapsulating structure (not shown) which contains an electrical device for human implant. Normally, the ferrule will be welded to the titanium container.
The niobium used for the lead-wire and ferrule herein may also be a niobium alloy so long as its thermal expansion coefficient remains about + 10% of that of commercially pure niobium. An example of such an alloy is 99Nb-l~r (Wt.%). Herein, when these components are described as consisting essentially of niobium, such alloys are intended to be included along with pure niobium.
The members of the feedthrough are assembled together by brazing.
As is well known in the art, brazing of the feedthrough assembly may be accomplished by placing rings of the brazing material at the joints to be brazed and heating the assembly to the appropriate melting temperature of the braze material. Ilowever, in the instance of this invention, only two brazing materials are acceptable. The first and most preferred of these are alloys of gold, vanadium and yttrium and/or scandium and optionally including niobium. Assemblies using this alloy brazing material are shown in Figures 1, 2 and 3.
Brazing alloys of the foregoing type which may be utilized with ~3~2'~
this invention is disclosed in United States patent No. 4,180,700, issued Dec. 25, 1979, and assigned to the same assignee as is this application. As indicated therein, the alloys may include scandium and niobium. One exemp-lary alloy is vanadium-5.5%, yttrium-0.2%, balance gold, the percentages being expressed in terms of atomic percentages.
Another braze material which may be used, as mentioned above, is gold ie., commercially pure gold (99.9%). However, when the pure gold braze material is utilized, the sapphire must first be provided with a coating of titanium and a coating of gold over the titanium in the areas where the brazed joint is to be formed. These coatings are preferably formed by sputtering and may be very thin. Preferably the titanium will have a thick-ness on the order of about 10,000 angstroms and the gold will have a thickness on the order of about 2,000 angstroms. Such a metallized version is shown in Figure 4, the titanium and gold layers being schematically indicated at 18, the gold braze at 16 in Figure 4.
The different braze materials may be used in any of the feedthrough configurations disclosed herein. The various configurations differ in geometry, Figure 1 being the simplest. Figures 2 and 3 are self-fixturing due to the notched portions included in either the ferrule body 14, as shown in Figure 2, or in the insulator body 12, as shown in Figure 3.
The sapphire used herein may be the "clear" sapphire or the "doped"
sapphire ie., sapphire containing a few tenths of a percent of a dopant such as chromium, cobalt or nickel and taking on a characteristic color such as ruby, blue or emerald, respectively.
Having described the invention, the exclusive rights and privi-leges thereto are to be defined by the following claims in the light of the foregoing description:
.
Claims (8)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An electrical feedthrough comprising an electrical lead-wire consisting essentially of niobium; an insulator around a portion of the lead-wire, the insulator consisting essentially of sapphire; a ferrule con-sisting essentially of niobium positioned around at least a peripheral portion of the insulator, and brazes joining the lead-wire to the insulator and the insulator to the ferrule, the braze composition being selected from the group consisting of substantially pure gold, an alloy of gold, vanadium and yttrium, an alloy of gold, vanadium and scandium and an alloy of gold, vanadium, yttrium and scandium.
2. The feedthrough of claim 1 in which the surfaces of the sapphire at the brazed areas are metallized.
3. The feedthrough of claim 2 in which the metallization consists of a layer of titanium and a layer of gold.
4. The feedthrough of claim 3 in which the gold layer overlays the titanium layer.
5. The feedthrough of claim 4 in which the titanium layer is about 10,000 angstroms thick and the gold is less thick.
6. The feedthrough of claim 5 in which the gold layer is about 2,000 angstroms thick.
7. The feedthrough of claim 1, 2 or 3 in which the alloy also includes an amount of niobium.
8. The feedthrough of claim 4,5 or 6 in which the alloy also includes an amount of niobium.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US715379A | 1979-01-29 | 1979-01-29 | |
| US7,153 | 1979-01-29 | ||
| US5198779A | 1979-06-25 | 1979-06-25 | |
| US51,987 | 1979-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1143024A true CA1143024A (en) | 1983-03-15 |
Family
ID=26676599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000344568A Expired CA1143024A (en) | 1979-01-29 | 1980-01-29 | Hermetic electrical feedthrough assembly |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0022863A1 (en) |
| CA (1) | CA1143024A (en) |
| CH (1) | CH649411A5 (en) |
| DE (1) | DE3030687T1 (en) |
| WO (1) | WO1980001620A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4678868A (en) * | 1979-06-25 | 1987-07-07 | Medtronic, Inc. | Hermetic electrical feedthrough assembly |
| DE3786210T2 (en) * | 1986-08-15 | 1993-09-23 | Medtronic Inc | HEART PACEMAKER WITH OXYGEN SENSOR. |
| EP0269007A1 (en) * | 1986-11-28 | 1988-06-01 | Siemens Aktiengesellschaft | Ceramic-metal feedthrough assembly, in particular for cardiac or neural stimulation, and method of manufacturing it |
| US5870272A (en) * | 1997-05-06 | 1999-02-09 | Medtronic Inc. | Capacitive filter feedthrough for implantable medical device |
| US6198952B1 (en) | 1998-10-30 | 2001-03-06 | Medtronic, Inc. | Multiple lens oxygen sensor for medical electrical lead |
| US6134459A (en) * | 1998-10-30 | 2000-10-17 | Medtronic, Inc. | Light focusing apparatus for medical electrical lead oxygen sensor |
| US5902326A (en) * | 1997-09-03 | 1999-05-11 | Medtronic, Inc. | Optical window for implantable medical devices |
| US6125290A (en) * | 1998-10-30 | 2000-09-26 | Medtronic, Inc. | Tissue overgrowth detector for implantable medical device |
| US6125291A (en) * | 1998-10-30 | 2000-09-26 | Medtronic, Inc. | Light barrier for medical electrical lead oxygen sensor |
| US6248080B1 (en) | 1997-09-03 | 2001-06-19 | Medtronic, Inc. | Intracranial monitoring and therapy delivery control device, system and method |
| US6144866A (en) * | 1998-10-30 | 2000-11-07 | Medtronic, Inc. | Multiple sensor assembly for medical electric lead |
| US6163723A (en) * | 1998-10-22 | 2000-12-19 | Medtronic, Inc. | Circuit and method for implantable dual sensor medical electrical lead |
| US6830249B2 (en) * | 2002-04-22 | 2004-12-14 | General Electric Company | Brazeable, multi-lead, low profile sealing fitting and method of installation |
| HUE039631T2 (en) * | 2011-02-18 | 2019-01-28 | Schott Ag | Glass, in particular glass solder or fusible glass |
| US12123497B2 (en) | 2016-05-23 | 2024-10-22 | Daniel Hiram DEEKS | Method and apparatus for the hermetic sealing of martensitic metals for precompression for cryogenic applications |
| US11143304B2 (en) * | 2016-05-23 | 2021-10-12 | Daniel Hiram DEEKS | Methods and apparatus for sealing of metals |
| DE102021110048A1 (en) | 2021-04-21 | 2022-10-27 | Schott Ag | Feedthrough through a housing component, especially for harsh, mechanically and thermally stressed environments |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3001269A (en) * | 1954-09-20 | 1961-09-26 | Gen Electric | Composite material, brazing alloys and process of manufacture |
| US3063144A (en) * | 1956-04-16 | 1962-11-13 | American Lava Corp | Metal-to-ceramic seals |
| US3371406A (en) * | 1965-11-26 | 1968-03-05 | Philips Corp | Hermetic electrical lead-in assembly |
| US3936320A (en) * | 1972-10-18 | 1976-02-03 | Nuclear Battery Corporation | Header |
| FR2217290B1 (en) * | 1972-12-01 | 1975-03-28 | Quartex Sa | |
| US3873944A (en) * | 1973-03-01 | 1975-03-25 | Varian Associates | Bonding of ferrite to metal for high-power microwave applications |
| US3906311A (en) * | 1974-02-27 | 1975-09-16 | Mallory & Co Inc P R | Metal-to-glass-to-ceramic seal |
| US3920888A (en) * | 1974-06-04 | 1975-11-18 | Nuclear Battery Corp | Electrical feed-through assembly suitable for electronic devices implantable in a human body |
| US4016527A (en) * | 1975-09-25 | 1977-04-05 | North American Philips Corporation | Hermetically sealed film resistor |
| US4078711A (en) * | 1977-04-14 | 1978-03-14 | Rockwell International Corporation | Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond |
| US4180700A (en) * | 1978-03-13 | 1979-12-25 | Medtronic, Inc. | Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs |
-
1980
- 1980-01-28 DE DE803030687T patent/DE3030687T1/en active Granted
- 1980-01-28 CH CH7375/80A patent/CH649411A5/en not_active IP Right Cessation
- 1980-01-28 WO PCT/US1980/000126 patent/WO1980001620A1/en active Application Filing
- 1980-01-29 CA CA000344568A patent/CA1143024A/en not_active Expired
- 1980-08-22 EP EP80900389A patent/EP0022863A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CH649411A5 (en) | 1985-05-15 |
| EP0022863A1 (en) | 1981-01-28 |
| DE3030687C2 (en) | 1991-06-13 |
| DE3030687T1 (en) | 1981-02-12 |
| WO1980001620A1 (en) | 1980-08-07 |
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