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BRPI0810290A2 - "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." - Google Patents

"processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Info

Publication number
BRPI0810290A2
BRPI0810290A2 BRPI0810290-2A2A BRPI0810290A BRPI0810290A2 BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2 BR PI0810290 A BRPI0810290 A BR PI0810290A BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2
Authority
BR
Brazil
Prior art keywords
thermosetting composition
cure
composite
thermosetting
composition
Prior art date
Application number
BRPI0810290-2A2A
Other languages
English (en)
Inventor
Maurice Joel Marks
Courtney Lawrence Sherman
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0810290A2 publication Critical patent/BRPI0810290A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0810290-2A2A 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." BRPI0810290A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09
PCT/US2008/061163 WO2008140906A1 (en) 2007-05-09 2008-04-22 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Publications (1)

Publication Number Publication Date
BRPI0810290A2 true BRPI0810290A2 (pt) 2014-11-04

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0810290-2A2A BRPI0810290A2 (pt) 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Country Status (8)

Country Link
US (1) US20100144965A1 (pt)
EP (1) EP2147034B1 (pt)
JP (1) JP2010526907A (pt)
KR (1) KR20100017712A (pt)
CN (2) CN101679603A (pt)
BR (1) BRPI0810290A2 (pt)
TW (1) TWI372766B (pt)
WO (1) WO2008140906A1 (pt)

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EP2723796B1 (en) 2011-06-24 2015-07-22 Dow Global Technologies LLC Thermosetting composition and process for preparing fiber-reinforced composites
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US20150299457A1 (en) * 2011-12-20 2015-10-22 Dow Global Technologies Llc Epoxy resin composites
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
JP6320403B2 (ja) 2012-11-13 2018-05-09 ダウ グローバル テクノロジーズ エルエルシー 樹脂移送成形プロセスのためのポリエチレンテトラアミンおよびトリエチレンジアミン触媒を含有するエポキシ樹脂系
EP2920227B1 (en) * 2012-11-13 2017-02-08 Dow Global Technologies LLC Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
EP2935390A2 (en) 2012-12-21 2015-10-28 Dow Global Technologies LLC Thiol-cured elastomeric epoxy resins
JP6607785B2 (ja) 2012-12-21 2019-11-20 ダウ グローバル テクノロジーズ エルエルシー 相セグメント化非イソシアネート系弾性体
CN104968701B (zh) 2012-12-21 2017-06-16 陶氏环球技术有限责任公司 用于电缆接合的非异氰酸酯密封剂
RU2641908C2 (ru) 2013-09-16 2018-01-23 ДАУ ГЛОБАЛ ТЕКНОЛОДЖИЗ ЭлЭлСи Полиуретановый эластомер для применения в изоляции морского подводного трубопровода
MX394984B (es) 2013-12-18 2025-03-24 Dow Global Technologies Llc Proceso para la formacion de un polimero organico en una reaccion de un polieno, una resina epoxi y una mezcla de agentes de curado de tiol y de amina.
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
JP6641283B2 (ja) 2014-02-07 2020-02-05 ダウ グローバル テクノロジーズ エルエルシー 速硬化性で高ガラス転移温度のエポキシ樹脂系
US10414857B2 (en) 2014-03-18 2019-09-17 Dow Global Technologies Llc Epoxy resin system
US10066136B2 (en) 2014-04-22 2018-09-04 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
WO2016010944A1 (en) 2014-07-17 2016-01-21 Dow Global Technologies Llc Epoxy systems employing triethylaminetetraamine and tin catalysts
KR20170056572A (ko) * 2014-09-12 2017-05-23 드렉셀유니버시티 그래프트 트리글리세라이드가 사용되는 무수물 경화 열경화성 에폭시 폴리머의 강인화
US9822227B2 (en) * 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
US10308757B2 (en) 2014-11-11 2019-06-04 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
CN107001591B (zh) 2014-12-24 2020-03-13 陶氏环球技术有限责任公司 快速凝固的环氧树脂系统和使用所述环氧树脂系统涂布管道的方法
EP3313913B1 (en) 2015-06-25 2020-12-30 Dow Global Technologies LLC Novel epoxy resin system for making carbon fiber composites
EP3320013B1 (en) 2015-07-07 2020-04-29 Dow Global Technologies LLC Stable high glass transition temperature epoxy resin system for making composites
KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
EP3500612B1 (en) 2016-08-19 2025-04-23 Dow Global Technologies LLC Epoxy resin compositions containing an internal mold release agent
US11261289B2 (en) 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
US20200181361A1 (en) 2017-03-09 2020-06-11 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
WO2018169609A1 (en) 2017-03-17 2018-09-20 Dow Global Technologies Llc Epoxy-acrylic hybrid adhesive
JP2020524187A (ja) 2017-06-20 2020-08-13 ダウ グローバル テクノロジーズ エルエルシー 繊維強化複合材を製造するためのエポキシ樹脂系
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
US20220403099A1 (en) * 2019-11-14 2022-12-22 Dic Corporation Curable composition, cured product, fiber-reinforced composite material, and molded article, and method for manufacturing same

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Also Published As

Publication number Publication date
EP2147034B1 (en) 2014-12-17
JP2010526907A (ja) 2010-08-05
WO2008140906A1 (en) 2008-11-20
EP2147034A1 (en) 2010-01-27
CN101679603A (zh) 2010-03-24
US20100144965A1 (en) 2010-06-10
KR20100017712A (ko) 2010-02-16
TW200914482A (en) 2009-04-01
CN103059267A (zh) 2013-04-24
TWI372766B (en) 2012-09-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]