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BR9806743A - Thermosetting resin compositions - Google Patents

Thermosetting resin compositions

Info

Publication number
BR9806743A
BR9806743A BR9806743-5A BR9806743A BR9806743A BR 9806743 A BR9806743 A BR 9806743A BR 9806743 A BR9806743 A BR 9806743A BR 9806743 A BR9806743 A BR 9806743A
Authority
BR
Brazil
Prior art keywords
thermosetting resin
resin compositions
csp
allows
circuit board
Prior art date
Application number
BR9806743-5A
Other languages
Portuguese (pt)
Inventor
Kazutoshi Iida
Jon Wigham
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Publication of BR9806743A publication Critical patent/BR9806743A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

<B>COMPOSIçõES DE RESINA DE TERMOCURA<D>. A presente invenção proporciona uma composição de resina de termocura útil como uma resina de dimensionamento de subenchimento que permite que um dispositivo semicondutor, tal como um conjunto de CSP/BGA o qual inclui um circuito integrado semicondutor montado em um substrato portador, seja conectado seguramente a uma placa de circuito mediante cura a calor em curto tempo e com boa produtividade, a qual demonstra excelentes propriedades de choque térmico (ou propriedades de ciclo térmico), e permite que o conjunto de CSP/BGA seja facilmente removido da placa de circuito no caso de falha do dispositivo semicondutor ou da conexão.<B> THERMOCURE RESIN COMPOSITIONS <D>. The present invention provides a thermosetting resin composition useful as an underfill sizing resin that allows a semiconductor device, such as a CSP / BGA assembly which includes a semiconductor integrated circuit mounted on a carrier substrate, to be securely connected to a circuit board by heat curing in a short time and with good productivity, which shows excellent thermal shock properties (or thermal cycle properties), and allows the CSP / BGA assembly to be easily removed from the circuit board in the case failure of the semiconductor device or connection.

BR9806743-5A 1997-01-17 1998-01-16 Thermosetting resin compositions BR9806743A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00657197A JP3613367B2 (en) 1997-01-17 1997-01-17 Thermosetting resin composition
PCT/US1998/000858 WO1998031738A1 (en) 1997-01-17 1998-01-16 Thermosetting resin compositions

Publications (1)

Publication Number Publication Date
BR9806743A true BR9806743A (en) 2000-02-29

Family

ID=11642033

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9806743-5A BR9806743A (en) 1997-01-17 1998-01-16 Thermosetting resin compositions

Country Status (9)

Country Link
EP (1) EP0953008A4 (en)
JP (1) JP3613367B2 (en)
KR (1) KR100554323B1 (en)
CN (1) CN1243526A (en)
BR (1) BR9806743A (en)
ID (1) ID22238A (en)
MY (1) MY118700A (en)
TW (1) TW561178B (en)
WO (1) WO1998031738A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612805B1 (en) * 1999-02-18 2006-08-18 가부시끼가이샤 쓰리본드 Epoxy resin composition
EP1195083B1 (en) * 1999-07-08 2006-01-11 Sunstar Giken Kabushiki Kaisha Underfilling material for semiconductor package
US6255500B1 (en) 2000-01-21 2001-07-03 Loctite Corporation Process for the epoxidation of diene esters
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
JP4609617B2 (en) * 2000-08-01 2011-01-12 日本電気株式会社 Semiconductor device mounting method and mounting structure
US6627683B1 (en) 2000-09-05 2003-09-30 Henkel Loctite Corporation Reworkable thermosetting resin compositions and compounds useful therein
US7108920B1 (en) 2000-09-15 2006-09-19 Henkel Corporation Reworkable compositions incorporating episulfide resins
US6936664B2 (en) 2000-10-04 2005-08-30 Henkel Corporation Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
WO2002058108A2 (en) 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
TW574739B (en) * 2001-02-14 2004-02-01 Nitto Denko Corp Thermosetting resin composition and semiconductor device using the same
JP5280597B2 (en) * 2001-03-30 2013-09-04 サンスター技研株式会社 One-component thermosetting epoxy resin composition and underfill material for semiconductor mounting
JP3566680B2 (en) 2001-09-11 2004-09-15 富士通株式会社 Method for manufacturing semiconductor device
US6916890B1 (en) 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US7242082B2 (en) 2002-02-07 2007-07-10 Irvine Sensors Corp. Stackable layer containing ball grid array package
JP2007521631A (en) * 2003-08-08 2007-08-02 アービン センサーズ コーポレーション Stackable layer and method for manufacturing the same
JP5175431B2 (en) * 2005-09-16 2013-04-03 日本電気株式会社 Semiconductor device repair method
JP2007258207A (en) * 2006-03-20 2007-10-04 Three M Innovative Properties Co Mounting method of bumped chip or package
EP2026973B1 (en) 2006-04-28 2011-04-06 Telecom Italia S.p.A. Ink-jet printhead die and manufacturing method thereof
WO2007142654A1 (en) * 2006-06-09 2007-12-13 Advanced Applied Adhesives Reworkable compositions and methods for use thereof
US7714426B1 (en) 2007-07-07 2010-05-11 Keith Gann Ball grid array package format layers and structure
KR20110027714A (en) 2008-06-05 2011-03-16 스미토모 베이클라이트 가부시키가이샤 Manufacturing Method of Semiconductor Device and Semiconductor Device
US8450859B2 (en) 2008-10-27 2013-05-28 Panasonic Corporation Semiconductor device mounted structure and its manufacturing method
CN103172306A (en) * 2013-04-08 2013-06-26 天津大学 Hydroelastic model material and preparation method thereof
KR102340799B1 (en) * 2018-09-20 2021-12-16 주식회사 엘지화학 Thermosetting resin composition for coating metal thin film, resin coated metal thin film, and metal clad laminate using the same
KR102092649B1 (en) * 2018-11-07 2020-03-24 (주)티에이치엔 Manufacturing method of packaging electronic device equipped with thermal radiation and dissipation function
DE102020127468A1 (en) 2020-10-19 2022-04-21 Werner H. Salewski Multifunctional epoxy systems
DE102022120396A1 (en) 2022-08-12 2024-02-15 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Use of a hardenable and resoluble mass for producing a component, and mass therefor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463199A (en) * 1977-10-31 1979-05-21 Mitsui Petrochem Ind Ltd Curable composition for elastomers
SU990781A1 (en) * 1979-12-06 1983-01-23 Предприятие П/Я В-8657 Alcohol- and gasoline-resistant marking paint
SU1100295A1 (en) * 1982-12-24 1984-06-30 Предприятие П/Я В-2756 Adehesive
US4794314A (en) * 1987-08-28 1988-12-27 Johnson Service Company Environmental position actuator apparatus having load responsive limit control apparatus
DD266361A1 (en) * 1987-12-03 1989-03-29 Leuna Werke Veb DIVING CONCRETE MEASURES FOR ELECTRICAL AND ELECTRONIC COMPONENTS
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
JP2679849B2 (en) * 1989-07-26 1997-11-19 松下電器産業株式会社 Electronic component mounting method and adhesive used in this method
JP3543902B2 (en) * 1997-01-17 2004-07-21 ヘンケル ロックタイト コーポレイション Semiconductor device mounting structure and mounting method

Also Published As

Publication number Publication date
TW561178B (en) 2003-11-11
WO1998031738A1 (en) 1998-07-23
KR100554323B1 (en) 2006-02-24
EP0953008A4 (en) 2000-05-03
JP3613367B2 (en) 2005-01-26
MY118700A (en) 2005-01-31
KR20000070203A (en) 2000-11-25
CN1243526A (en) 2000-02-02
JPH10204259A (en) 1998-08-04
EP0953008A1 (en) 1999-11-03
ID22238A (en) 1999-09-23

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Legal Events

Date Code Title Description
B07A Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFERIDO O PRESENTE PEDIDO DE PATENTE COMO INVENCAO - DE ACORDO COM O ART. 8O DA LPI.