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BR9306230A - Dispositivo para encerrar flexivelmente um conjunto circuito eletrônico - Google Patents

Dispositivo para encerrar flexivelmente um conjunto circuito eletrônico

Info

Publication number
BR9306230A
BR9306230A BR9306230A BR9306230A BR9306230A BR 9306230 A BR9306230 A BR 9306230A BR 9306230 A BR9306230 A BR 9306230A BR 9306230 A BR9306230 A BR 9306230A BR 9306230 A BR9306230 A BR 9306230A
Authority
BR
Brazil
Prior art keywords
terminate
flexibly
electronic circuit
circuit assembly
assembly
Prior art date
Application number
BR9306230A
Other languages
English (en)
Inventor
Karl-Erik Leeb
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of BR9306230A publication Critical patent/BR9306230A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Details Of Aerials (AREA)
BR9306230A 1993-02-11 1993-02-11 Dispositivo para encerrar flexivelmente um conjunto circuito eletrônico BR9306230A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE1993/000107 WO1994018815A1 (en) 1993-02-11 1993-02-11 A flexible device for encapsulating electronic components

Publications (1)

Publication Number Publication Date
BR9306230A true BR9306230A (pt) 1998-06-30

Family

ID=20388552

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9306230A BR9306230A (pt) 1993-02-11 1993-02-11 Dispositivo para encerrar flexivelmente um conjunto circuito eletrônico

Country Status (7)

Country Link
US (1) US5527989A (pt)
EP (1) EP0635193B1 (pt)
JP (1) JPH07506223A (pt)
AU (1) AU675642B2 (pt)
BR (1) BR9306230A (pt)
DE (1) DE69309262T2 (pt)
WO (1) WO1994018815A1 (pt)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538674B2 (ja) † 1995-03-02 2004-06-14 タイコ・エレクトロニクス・レイケム・ナムローゼ・フェンノートシャップ 素子を環境から保護するための密封パッケージング
US6812413B1 (en) 1995-06-12 2004-11-02 Circuits And Systems, Inc. Electronic weighing apparatus utilizing surface acoustic waves
US6448513B1 (en) * 2001-02-02 2002-09-10 Circuits & Systems Inc. Electronic weighing apparatus utilizing surface acoustic waves
DE29514398U1 (de) * 1995-09-07 1995-10-19 Siemens AG, 80333 München Abschirmung für Flachbaugruppen
DE19535324C1 (de) * 1995-09-22 1997-01-23 Siemens Ag Chipkarte
US5689878A (en) * 1996-04-17 1997-11-25 Lucent Technologies Inc. Method for protecting electronic circuit components
DE19634523B4 (de) * 1996-08-27 2005-02-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Anordnung von elektrischen und/oder optoelektronischen Bauteilen in einer gasdichten Verpackung und eine entsprechende Anordnung
US5869788A (en) * 1997-05-30 1999-02-09 Circuits And Systems, Inc. Weighing scale with EMI/RFI shielding
US5867371A (en) * 1997-09-29 1999-02-02 Ericsson Inc. Cover member for sealed circuit board assembly
US6094361A (en) * 1997-12-12 2000-07-25 Nortel Networks Corporation Assemblies of printed circuit boards and flexible containers therefor
US6028775A (en) * 1997-12-12 2000-02-22 Nortel Networks Corporation Assemblies of electronic devices and flexible containers thereof
US6147879A (en) * 1997-12-12 2000-11-14 Nortel Networks Limited Assemblies of electrical devices and flexible containers therefor
GB2335884A (en) * 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
US6219258B1 (en) * 1999-01-29 2001-04-17 Ericsson Inc. Electronic enclosure with improved environmental protection
JP3529347B2 (ja) * 2000-10-25 2004-05-24 Ｎｅｃ液晶テクノロジー株式会社 回路基板の保護構造及びその製造方法並びに液晶表示装置
GB0110366D0 (en) * 2001-04-27 2001-06-20 Tyco Electronics Raychem Nv Optical fibre sealing
JP2003086925A (ja) * 2001-09-12 2003-03-20 Matsushita Electric Ind Co Ltd 防湿構造付プリント基板、及びその製造方法
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
GB0211517D0 (en) 2002-05-20 2002-06-26 Tyco Electronics Raychem Nv Optical fibre sealing
DE10247676A1 (de) * 2002-10-12 2004-07-15 Hella Kg Hueck & Co. Elektrisches oder elektronisches Gerät mit einer Leiterplatte
JP4066929B2 (ja) * 2003-10-08 2008-03-26 株式会社日立製作所 電子装置及びその製造方法
DE10351118A1 (de) * 2003-11-03 2005-06-16 Abb Patent Gmbh Elekroinstallationsgerät des Außenbereichs
US20060278551A1 (en) * 2005-06-10 2006-12-14 Mark Iv Industries Corp. Shielded retail packaging for transponder
US20070012481A1 (en) * 2005-07-18 2007-01-18 Helmut Prager Circuit board/envelope compound structure
US20080085390A1 (en) 2006-10-04 2008-04-10 Ryan Thomas Neill Encapsulation of electrically energized articles
JP2009163293A (ja) * 2007-12-28 2009-07-23 Fujitsu Ltd 電子機器
US8079132B2 (en) * 2008-03-11 2011-12-20 Henry Clayman Method for shielding RFID tagged discarded items in retail, manufacturing and wholesale industries
US7928326B2 (en) * 2009-02-27 2011-04-19 Hewlett-Packard Development Company, L.P. Thermoformed EMI shield
TWI372558B (en) * 2009-04-08 2012-09-11 Flexible thin image-sensing module with anti-emi function and flexible thin pcb module with anti-emi function
US9150006B2 (en) 2011-06-23 2015-10-06 Eastman Chemical Company Lamination process optimization utilizing neopentyl glycol-modified polyesters
DE102011086707A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Schaltungsanordnung für elektronische und/oder elektrische Bauteile
EP2645831A1 (de) * 2012-03-30 2013-10-02 Siemens Aktiengesellschaft Gehäuse für ein elektrisches Gerät, Verfahren zur Herstellung eines solchen Gehäuses, elektrisches Gerät mit einem solchen Gehäuse und Verwendung eines solchen Gehäuses für ein elektrisches Gerät
US9386714B2 (en) * 2012-12-05 2016-07-05 Nokia Technologies Oy Apparatus for housing an electronic component, a method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2856449A (en) * 1954-09-03 1958-10-14 Myron A Coler Apparatus for storage of electrical apparatus
US3572499A (en) * 1967-01-19 1971-03-30 Custom Materials Inc Conductive packaging material and container for explosives
BE793054A (fr) * 1972-05-31 1973-04-16 Schutzapparate Paris & Co Appareil electrique avec elements a fonction active, tels qu'unrelais
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
US4218578A (en) * 1978-08-04 1980-08-19 Burr-Brown Research Corp. RF Shield for an electronic component
US4455448A (en) * 1981-12-02 1984-06-19 Watkins-Johnson Company Housing for microwave electronic devices
DE3248147A1 (de) * 1982-12-27 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Metallisierte formteile aus kunststoff fuer technische gehaeuse zur abschirmung gegenueber elektromagnetischen stoerfeldern
US4567317A (en) * 1983-07-07 1986-01-28 Computer Products, Inc. EMI/RFI Protected enclosure
US4686141A (en) * 1984-05-11 1987-08-11 Brunswick Corporation Pellicular laminate means for shielding structures from electromagnetic radiation
US4647714A (en) * 1984-12-28 1987-03-03 Sohwa Laminate Printing Co., Ltd. Composite sheet material for magnetic and electronic shielding and product obtained therefrom
DE3631531A1 (de) * 1985-10-02 1987-04-02 Zeis Hans Juergen Abschirmung fuer elektronische baugruppen
US4767673A (en) * 1985-10-28 1988-08-30 Toyo Aluminium Kabushiki Kaisha Laminates and formings made from the same
JPH0180783U (pt) * 1987-11-18 1989-05-30
US4915222A (en) * 1988-08-01 1990-04-10 Unisys Corporation Electromagnetically and electrostatically protected see-through packaging unit for printed circuit boards
SE462944B (sv) * 1989-01-31 1990-09-17 Ericsson Telefon Ab L M Elektriskt skaermande anordning foer ett kretskort jaemte foerfarande foer tillverkning av anordningen
US5066937A (en) * 1990-06-24 1991-11-19 Barkley & Dexter Laboratories Search coil assembly with laminate frame members and method for making same
US5136119A (en) * 1991-09-18 1992-08-04 The United States Of America As Represented By The Secretaty Of The Navy Lightweight portable EMI shielding container
US5401901A (en) * 1991-09-19 1995-03-28 W. L. Gore & Associates, Inc. Weather-resistant electromagnetic interference shielding for electronic equipment enclosures
US5360941A (en) * 1991-10-28 1994-11-01 Cubic Automatic Revenue Collection Group Magnetically permeable electrostatic shield
JPH0645781A (ja) * 1992-07-22 1994-02-18 Uniden Corp 電磁波遮蔽構造体

Also Published As

Publication number Publication date
WO1994018815A1 (en) 1994-08-18
EP0635193B1 (en) 1997-03-26
DE69309262D1 (de) 1997-04-30
EP0635193A1 (en) 1995-01-25
JPH07506223A (ja) 1995-07-06
DE69309262T2 (de) 1997-08-07
US5527989A (en) 1996-06-18
AU3909993A (en) 1994-08-29
AU675642B2 (en) 1997-02-13

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Legal Events

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FB36 Technical and formal requirements: requirement - article 36 of industrial property law
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B24C Patent annual fee: request for for restoration

Free format text: REFERENTE A 11A,12A,13A,14A,15A,16A E 17A ANUIDADES

B24H Lapse because of non-payment of annual fees (definitively: art 78 iv lpi)
B24F Patent annual fee: publication cancelled

Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2277 DE 26/08/2014 POR TER SIDO INDEVIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

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B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2606 DE 15-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.