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BR8500360A - Conjunto de quadro de circuito impresso - Google Patents

Conjunto de quadro de circuito impresso

Info

Publication number
BR8500360A
BR8500360A BR8500360A BR8500360A BR8500360A BR 8500360 A BR8500360 A BR 8500360A BR 8500360 A BR8500360 A BR 8500360A BR 8500360 A BR8500360 A BR 8500360A BR 8500360 A BR8500360 A BR 8500360A
Authority
BR
Brazil
Prior art keywords
printed circuit
frame set
circuit frame
printed
frame
Prior art date
Application number
BR8500360A
Other languages
English (en)
Inventor
Haruhiko Yamamoto
Kouji Katsuyama
Mitsuhiko Nakata
Shunichi Kikuchi
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59013006A external-priority patent/JPS60160151A/ja
Priority claimed from JP59013005A external-priority patent/JPS60160150A/ja
Priority claimed from JP59013007A external-priority patent/JPS60160152A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of BR8500360A publication Critical patent/BR8500360A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BR8500360A 1984-01-26 1985-01-25 Conjunto de quadro de circuito impresso BR8500360A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59013006A JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式
JP59013005A JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置
JP59013007A JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置

Publications (1)

Publication Number Publication Date
BR8500360A true BR8500360A (pt) 1985-09-10

Family

ID=27280079

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8500360A BR8500360A (pt) 1984-01-26 1985-01-25 Conjunto de quadro de circuito impresso

Country Status (8)

Country Link
US (1) US5050037A (pt)
EP (1) EP0151546B1 (pt)
KR (1) KR900002214B1 (pt)
AU (1) AU552537B2 (pt)
BR (1) BR8500360A (pt)
CA (1) CA1227886A (pt)
DE (1) DE3586661T2 (pt)
ES (1) ES539843A0 (pt)

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KR890007419A (ko) * 1987-10-21 1989-06-19 미다가쓰시게 반도체모듈 및 그 냉각장치
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
JPH0812890B2 (ja) * 1988-05-24 1996-02-07 富士通株式会社 モジュール封止方法
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US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
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JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
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US5206791A (en) * 1992-02-07 1993-04-27 Digital Equipment Corporation Bellows heat pipe apparatus for cooling systems
JP2745948B2 (ja) * 1992-04-06 1998-04-28 日本電気株式会社 集積回路の冷却構造
US5754399A (en) * 1992-09-30 1998-05-19 International Business Machines Corporation Direct coupled CPU package
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US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
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US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
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US5815370A (en) * 1997-05-16 1998-09-29 Allied Signal Inc Fluidic feedback-controlled liquid cooling module
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US6132184A (en) * 1998-11-05 2000-10-17 Ford Motor Company Reservoir apparatus for an electronically controlled electric pump
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
EP1637741A1 (de) * 2004-09-17 2006-03-22 Pumpenfabrik Ernst Vogel Gesellschaft m.b.H. Flüssigkeitsgekühltes Pumpensteuergerät und Flüssigkeitspumpenanordnung
US20060067052A1 (en) * 2004-09-30 2006-03-30 Llapitan David J Liquid cooling system
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
US8459337B2 (en) * 2005-02-18 2013-06-11 Papst Licensing Gmbh & Co. Kg Apparatus including a heat exchanger and equalizing vessel
US7243705B2 (en) * 2005-03-01 2007-07-17 Intel Corporation Integrated circuit coolant microchannel with compliant cover
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US7605581B2 (en) 2005-06-16 2009-10-20 Delta Design, Inc. Apparatus and method for controlling die force in a semiconductor device testing assembly
EP1916884B1 (en) * 2006-10-27 2011-04-06 Agie Charmilles SA Circuit board unit and method for production thereof
US7492594B2 (en) * 2007-05-03 2009-02-17 Hamilton Sundstrand Corporation Electronic circuit modules cooling
KR100996197B1 (ko) * 2007-09-14 2010-11-24 가부시키가이샤 아드반테스트 개선된 열 제어 경계면
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
US8081473B2 (en) * 2008-08-04 2011-12-20 International Business Machines Corporation Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
US8004841B2 (en) * 2008-05-06 2011-08-23 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
US9342121B2 (en) * 2008-05-06 2016-05-17 International Business Machines Corporatoin Cooling system for electronic components
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US20120325436A1 (en) 2011-06-27 2012-12-27 Shedd Timothy A High efficiency thermal management system
KR101457937B1 (ko) * 2012-04-24 2014-11-07 이청종 서버용 유냉식 냉각장치 및 그 구동 방법
JP2013247354A (ja) * 2012-05-23 2013-12-09 Samsung Electro-Mechanics Co Ltd 電力モジュール用放熱システム
US9894802B2 (en) 2014-05-29 2018-02-13 Ge-Hitachi Nuclear Energy Americas Llc Passive system of powering and cooling with liquid metal and method thereof
JP6409556B2 (ja) * 2014-12-19 2018-10-24 富士通株式会社 冷却機構付き基板及び電子機器
US10433458B1 (en) 2018-05-08 2019-10-01 Hewlett Packard Enterprise Development Lp Conducting plastic cold plates
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US11903175B2 (en) 2019-01-24 2024-02-13 Magna International Inc. Power converter with integrated multi-layer cooling
US11158566B2 (en) 2019-05-24 2021-10-26 Google Llc Integrated circuit with a ring-shaped hot spot area and multidirectional cooling
WO2020249218A1 (en) * 2019-06-13 2020-12-17 Huawei Technologies Co., Ltd. A cooling device for securing a first module and a second module in a space
US11382241B2 (en) * 2019-09-25 2022-07-05 Baidu Usa Llc Cooling devices for edge computing and heterogeneous computing electronics hardware
CN113329585A (zh) * 2019-11-13 2021-08-31 辽东学院 一种电子信息设备安全保护装置
US11776875B2 (en) 2020-11-13 2023-10-03 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including a vapor chamber as the heat spreading substrate of a power device embedded in a PCB and methods of forming the same

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Also Published As

Publication number Publication date
AU3794385A (en) 1985-08-01
DE3586661D1 (de) 1992-10-29
DE3586661T2 (de) 1993-02-04
CA1227886A (en) 1987-10-06
KR850006302A (ko) 1985-10-02
KR900002214B1 (ko) 1990-04-04
AU552537B2 (en) 1986-06-05
EP0151546B1 (en) 1992-09-23
EP0151546A2 (en) 1985-08-14
ES8602339A1 (es) 1985-11-16
US5050037A (en) 1991-09-17
EP0151546A3 (en) 1987-03-18
ES539843A0 (es) 1985-11-16

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Legal Events

Date Code Title Description
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 25/01/2000