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AU8472898A - Method and apparatus for inspecting a workpiece - Google Patents

Method and apparatus for inspecting a workpiece

Info

Publication number
AU8472898A
AU8472898A AU84728/98A AU8472898A AU8472898A AU 8472898 A AU8472898 A AU 8472898A AU 84728/98 A AU84728/98 A AU 84728/98A AU 8472898 A AU8472898 A AU 8472898A AU 8472898 A AU8472898 A AU 8472898A
Authority
AU
Australia
Prior art keywords
inspecting
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU84728/98A
Inventor
Rajiv Roy
Weerakiat Wahawisan
Michael C. Zemek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Technologies and Instruments Inc
Original Assignee
SEMICONDUCTOR TECH and INSTR Inc
Semiconductor Technologies and Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/890,814 external-priority patent/US6118540A/en
Application filed by SEMICONDUCTOR TECH and INSTR Inc, Semiconductor Technologies and Instruments Inc filed Critical SEMICONDUCTOR TECH and INSTR Inc
Publication of AU8472898A publication Critical patent/AU8472898A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AU84728/98A 1997-06-30 1998-06-26 Method and apparatus for inspecting a workpiece Abandoned AU8472898A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5123997P 1997-06-30 1997-06-30
US60051239 1997-06-30
US08/890,814 US6118540A (en) 1997-07-11 1997-07-11 Method and apparatus for inspecting a workpiece
US08890814 1997-07-11
PCT/US1998/013303 WO1999000661A1 (en) 1997-06-30 1998-06-26 Method and apparatus for inspecting a workpiece

Publications (1)

Publication Number Publication Date
AU8472898A true AU8472898A (en) 1999-01-19

Family

ID=26729198

Family Applications (1)

Application Number Title Priority Date Filing Date
AU84728/98A Abandoned AU8472898A (en) 1997-06-30 1998-06-26 Method and apparatus for inspecting a workpiece

Country Status (2)

Country Link
AU (1) AU8472898A (en)
WO (1) WO1999000661A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089607B1 (en) * 1998-02-27 2006-11-22 Matsushita Electric Industrial Co., Ltd. Component recognizing method and apparatus
DE60015966T2 (en) * 1999-04-13 2005-12-01 Icos Vision Systems N.V. MEASURING THE LAYERS OR COPLANARITY OF CONTACT ELEMENTS OF AN ELECTRONIC COMPONENT WITH FLAT LIGHTING AND TWO CAMERAS
US6291816B1 (en) * 1999-06-08 2001-09-18 Robotic Vision Systems, Inc. System and method for measuring object features with coordinated two and three dimensional imaging
DE19934619A1 (en) * 1999-07-23 2001-01-25 Merten Kg Pulsotronic Component inspection device has optical deflection device that feeds image produced from direction different from first image to video camera
US7012684B1 (en) 1999-09-07 2006-03-14 Applied Materials, Inc. Method and apparatus to provide for automated process verification and hierarchical substrate examination
US6707544B1 (en) * 1999-09-07 2004-03-16 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput
US6707545B1 (en) 1999-09-07 2004-03-16 Applied Materials, Inc. Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems
US6813032B1 (en) 1999-09-07 2004-11-02 Applied Materials, Inc. Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques
US6693708B1 (en) 1999-09-07 2004-02-17 Applied Materials, Inc. Method and apparatus for substrate surface inspection using spectral profiling techniques
US6721045B1 (en) 1999-09-07 2004-04-13 Applied Materials, Inc. Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
US6630995B1 (en) 1999-09-07 2003-10-07 Applied Materials, Inc. Method and apparatus for embedded substrate and system status monitoring
US7181058B2 (en) 1999-12-13 2007-02-20 Gsi Group, Inc. Method and system for inspecting electronic components mounted on printed circuit boards
WO2001088473A1 (en) * 2000-05-17 2001-11-22 Siemens Aktiengesellschaft Inspection of a three-dimensional surface structure and the calibration of its resolution (solder paste deposit) using a camera, an optical sensor and an independent calibration mark
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
US20020196336A1 (en) 2001-06-19 2002-12-26 Applied Materials, Inc. Method and apparatus for substrate imaging
FI112279B (en) 2001-11-21 2003-11-14 Mapvision Oy Ltd Method for determining offset points
US8050486B2 (en) * 2006-05-16 2011-11-01 The Boeing Company System and method for identifying a feature of a workpiece
US9052294B2 (en) 2006-05-31 2015-06-09 The Boeing Company Method and system for two-dimensional and three-dimensional inspection of a workpiece
KR101108672B1 (en) * 2009-05-12 2012-01-25 (주)제이티 Semiconductor device vision inspection device and method
DE102012104745B4 (en) * 2012-06-01 2015-03-19 SmartRay GmbH Test method and suitable test head
JP6359541B2 (en) * 2013-08-07 2018-07-18 株式会社Ｆｕｊｉ Electronic component mounting machine and transfer confirmation method
SG2013084975A (en) * 2013-11-11 2015-06-29 Saedge Vision Solutions Pte Ltd An apparatus and method for inspecting asemiconductor package
EP3775488B1 (en) 2018-04-06 2022-11-23 Repsol, S.A. Method for estimating either flowback or the reservoir fluid production rate from either one individual inlet or the contribution from several inlets separated by intervals in a wellbore located in an oil and/or gas reservoir

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPH0797019B2 (en) * 1986-06-12 1995-10-18 松下電器産業株式会社 Illumination method and device for component recognition
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
JPH03203399A (en) * 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd Parts mounting device

Also Published As

Publication number Publication date
WO1999000661A1 (en) 1999-01-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase