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AU7881400A - Assembly process for delicate silicon structures - Google Patents

Assembly process for delicate silicon structures

Info

Publication number
AU7881400A
AU7881400A AU78814/00A AU7881400A AU7881400A AU 7881400 A AU7881400 A AU 7881400A AU 78814/00 A AU78814/00 A AU 78814/00A AU 7881400 A AU7881400 A AU 7881400A AU 7881400 A AU7881400 A AU 7881400A
Authority
AU
Australia
Prior art keywords
assembly process
silicon structures
delicate silicon
delicate
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU78814/00A
Inventor
Peter V. Loeppert
Michael Pedersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of AU7881400A publication Critical patent/AU7881400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
AU78814/00A 1999-08-24 2000-08-16 Assembly process for delicate silicon structures Abandoned AU7881400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37941499A 1999-08-24 1999-08-24
US09379414 1999-08-24
PCT/US2000/040661 WO2001014248A2 (en) 1999-08-24 2000-08-16 Assembly process for delicate silicon structures

Publications (1)

Publication Number Publication Date
AU7881400A true AU7881400A (en) 2001-03-19

Family

ID=23497168

Family Applications (1)

Application Number Title Priority Date Filing Date
AU78814/00A Abandoned AU7881400A (en) 1999-08-24 2000-08-16 Assembly process for delicate silicon structures

Country Status (2)

Country Link
AU (1) AU7881400A (en)
WO (1) WO2001014248A2 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7297471B1 (en) 2003-04-15 2007-11-20 Idc, Llc Method for manufacturing an array of interferometric modulators
US7550794B2 (en) 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6794119B2 (en) 2002-02-12 2004-09-21 Iridigm Display Corporation Method for fabricating a structure for a microelectromechanical systems (MEMS) device
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
TW594360B (en) 2003-04-21 2004-06-21 Prime View Int Corp Ltd A method for fabricating an interference display cell
US7221495B2 (en) 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
TWI231865B (en) 2003-08-26 2005-05-01 Prime View Int Co Ltd An interference display cell and fabrication method thereof
TW593126B (en) 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7012726B1 (en) * 2003-11-03 2006-03-14 Idc, Llc MEMS devices with unreleased thin film components
US7373026B2 (en) 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7492502B2 (en) 2004-09-27 2009-02-17 Idc, Llc Method of fabricating a free-standing microstructure
US7405861B2 (en) 2004-09-27 2008-07-29 Idc, Llc Method and device for protecting interferometric modulators from electrostatic discharge
US7369296B2 (en) 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7417783B2 (en) 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7429334B2 (en) 2004-09-27 2008-09-30 Idc, Llc Methods of fabricating interferometric modulators by selectively removing a material
US7349136B2 (en) 2004-09-27 2008-03-25 Idc, Llc Method and device for a display having transparent components integrated therein
US7553684B2 (en) 2004-09-27 2009-06-30 Idc, Llc Method of fabricating interferometric devices using lift-off processing techniques
US7161730B2 (en) 2004-09-27 2007-01-09 Idc, Llc System and method for providing thermal compensation for an interferometric modulator display
TW200628877A (en) 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
EP1910216A1 (en) 2005-07-22 2008-04-16 QUALCOMM Incorporated Support structure for mems device and methods therefor
US7630114B2 (en) 2005-10-28 2009-12-08 Idc, Llc Diffusion barrier layer for MEMS devices
DE102006002106B4 (en) * 2006-01-17 2016-03-03 Robert Bosch Gmbh Micromechanical sensor with perforation-optimized membrane as well as a suitable production process
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7547568B2 (en) 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
GB2435544B (en) 2006-02-24 2008-11-19 Oligon Ltd Mems device
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US7417784B2 (en) 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
US7527996B2 (en) 2006-04-19 2009-05-05 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7623287B2 (en) 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7369292B2 (en) 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7405863B2 (en) 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7566664B2 (en) 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
EP2406964B1 (en) 2009-03-09 2013-04-17 Nxp B.V. Microphone and accelerometer
FI124072B (en) 2009-05-29 2014-03-14 Valtion Teknillinen Micromechanical Fabry-Perot Adjustable Interferometer, Intermediate, and Method of Manufacture
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
US5389182A (en) * 1993-08-02 1995-02-14 Texas Instruments Incorporated Use of a saw frame with tape as a substrate carrier for wafer level backend processing
US5534466A (en) * 1995-06-01 1996-07-09 International Business Machines Corporation Method of making area direct transfer multilayer thin film structure
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process

Also Published As

Publication number Publication date
WO2001014248A2 (en) 2001-03-01
WO2001014248A3 (en) 2001-10-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase