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AU5999669A - Improved plated through hole printed circuit boards - Google Patents

Improved plated through hole printed circuit boards

Info

Publication number
AU5999669A
AU5999669A AU59996/69A AU5999669A AU5999669A AU 5999669 A AU5999669 A AU 5999669A AU 59996/69 A AU59996/69 A AU 59996/69A AU 5999669 A AU5999669 A AU 5999669A AU 5999669 A AU5999669 A AU 5999669A
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
hole printed
improved plated
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU59996/69A
Inventor
JOHN FRANCIS McCORMACK JOHN DUFF WILLIAMSON JOSEPH TOUCHETTE and RUDOLPH ZEPLISKY FREDERICK WILLIAM SCHNELLE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TECHNOGRAPH Ltd
Original Assignee
TECHNOGRAPH Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TECHNOGRAPH Ltd filed Critical TECHNOGRAPH Ltd
Priority to AU59996/69A priority Critical patent/AU5999669A/en
Publication of AU5999669A publication Critical patent/AU5999669A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
AU59996/69A 1969-08-25 1969-08-25 Improved plated through hole printed circuit boards Expired AU5999669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU59996/69A AU5999669A (en) 1969-08-25 1969-08-25 Improved plated through hole printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU59996/69A AU5999669A (en) 1969-08-25 1969-08-25 Improved plated through hole printed circuit boards

Publications (1)

Publication Number Publication Date
AU5999669A true AU5999669A (en) 1971-03-04

Family

ID=3745156

Family Applications (1)

Application Number Title Priority Date Filing Date
AU59996/69A Expired AU5999669A (en) 1969-08-25 1969-08-25 Improved plated through hole printed circuit boards

Country Status (1)

Country Link
AU (1) AU5999669A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984001259A1 (en) * 1982-09-17 1984-03-29 Ericsson Telefon Ab L M A method of producing electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984001259A1 (en) * 1982-09-17 1984-03-29 Ericsson Telefon Ab L M A method of producing electronic components

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