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AU587937B2 - Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer - Google Patents

Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer

Info

Publication number
AU587937B2
AU587937B2 AU16557/88A AU1655788A AU587937B2 AU 587937 B2 AU587937 B2 AU 587937B2 AU 16557/88 A AU16557/88 A AU 16557/88A AU 1655788 A AU1655788 A AU 1655788A AU 587937 B2 AU587937 B2 AU 587937B2
Authority
AU
Australia
Prior art keywords
layer
cooling
forming
thermally conductive
system used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU16557/88A
Other versions
AU1655788A (en
Inventor
Masahiro Suzuki
Yoshiaki Udagawa
Haruhiko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62125732A external-priority patent/JP2578429B2/en
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of AU1655788A publication Critical patent/AU1655788A/en
Application granted granted Critical
Publication of AU587937B2 publication Critical patent/AU587937B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU16557/88A 1987-05-25 1988-05-24 Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer Ceased AU587937B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62125732A JP2578429B2 (en) 1987-05-25 1987-05-25 Cooling body manufacturing method
JP62-125732 1987-05-25
JP62-096288 1987-06-23
JP9628887 1987-06-23

Publications (2)

Publication Number Publication Date
AU1655788A AU1655788A (en) 1988-12-01
AU587937B2 true AU587937B2 (en) 1989-08-31

Family

ID=26437513

Family Applications (1)

Application Number Title Priority Date Filing Date
AU16557/88A Ceased AU587937B2 (en) 1987-05-25 1988-05-24 Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer

Country Status (3)

Country Link
KR (1) KR910008985B1 (en)
AU (1) AU587937B2 (en)
CA (1) CA1295753C (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02231218A (en) * 1989-03-03 1990-09-13 Sanden Corp Cooling device for controller

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3794485A (en) * 1984-01-26 1985-08-01 Fujitsu Limited Cooling system for electronic circuit device
AU3794385A (en) * 1984-01-26 1985-08-01 Fujitsu Limited Liquid-cooling module system for electronic components
AU5501586A (en) * 1985-03-28 1986-10-02 Fujitsu Limited Cooling system for electronic circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3794485A (en) * 1984-01-26 1985-08-01 Fujitsu Limited Cooling system for electronic circuit device
AU3794385A (en) * 1984-01-26 1985-08-01 Fujitsu Limited Liquid-cooling module system for electronic components
AU5501586A (en) * 1985-03-28 1986-10-02 Fujitsu Limited Cooling system for electronic circuits

Also Published As

Publication number Publication date
KR910008985B1 (en) 1991-10-26
CA1295753C (en) 1992-02-11
KR880014847A (en) 1988-12-24
AU1655788A (en) 1988-12-01

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