AU5662099A - Microwave dielectric material - Google Patents
Microwave dielectric materialInfo
- Publication number
- AU5662099A AU5662099A AU56620/99A AU5662099A AU5662099A AU 5662099 A AU5662099 A AU 5662099A AU 56620/99 A AU56620/99 A AU 56620/99A AU 5662099 A AU5662099 A AU 5662099A AU 5662099 A AU5662099 A AU 5662099A
- Authority
- AU
- Australia
- Prior art keywords
- dielectric material
- microwave dielectric
- microwave
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Waveguide Aerials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9802769A SE513022C2 (en) | 1998-08-19 | 1998-08-19 | Dielectric material for microwaves |
SE9802769 | 1998-08-19 | ||
PCT/SE1999/001328 WO2000011747A1 (en) | 1998-08-19 | 1999-07-30 | Microwave dielectric material |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5662099A true AU5662099A (en) | 2000-03-14 |
Family
ID=20412284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU56620/99A Abandoned AU5662099A (en) | 1998-08-19 | 1999-07-30 | Microwave dielectric material |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1110270A1 (en) |
KR (1) | KR20010072326A (en) |
CN (1) | CN1178783C (en) |
AU (1) | AU5662099A (en) |
CA (1) | CA2340988A1 (en) |
SE (1) | SE513022C2 (en) |
WO (1) | WO2000011747A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3617388B2 (en) * | 1999-10-20 | 2005-02-02 | 日本電気株式会社 | Printed wiring board and manufacturing method thereof |
US8199056B2 (en) | 2005-10-13 | 2012-06-12 | Nokia Corporation | Antenna arrangement |
US8344955B2 (en) | 2010-01-08 | 2013-01-01 | Nokia Corporation | Integrated antenna with e-flex technology |
US8716603B2 (en) * | 2010-11-24 | 2014-05-06 | Nokia Corporation | Printed wiring board with dielectric material sections having different dissipation factors |
CN103458610B (en) * | 2012-06-04 | 2017-12-29 | 联想(北京)有限公司 | The substrate and printed circuit board of printed circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4886699A (en) * | 1987-10-26 | 1989-12-12 | Rogers Corporation | Glass fiber reinforced fluoropolymeric circuit laminate |
US4914445A (en) * | 1988-12-23 | 1990-04-03 | Shoemaker Kevin O | Microstrip antennas and multiple radiator array antennas |
US5733639A (en) * | 1995-06-30 | 1998-03-31 | Poly Circuits/M-Wave | Circuit board assembly with foam substrate and method of making same |
-
1998
- 1998-08-19 SE SE9802769A patent/SE513022C2/en unknown
-
1999
- 1999-07-30 AU AU56620/99A patent/AU5662099A/en not_active Abandoned
- 1999-07-30 EP EP99943549A patent/EP1110270A1/en not_active Withdrawn
- 1999-07-30 KR KR1020017001642A patent/KR20010072326A/en not_active Application Discontinuation
- 1999-07-30 CN CNB998095354A patent/CN1178783C/en not_active Expired - Lifetime
- 1999-07-30 CA CA002340988A patent/CA2340988A1/en not_active Abandoned
- 1999-07-30 WO PCT/SE1999/001328 patent/WO2000011747A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CA2340988A1 (en) | 2000-03-02 |
SE9802769L (en) | 2000-02-20 |
SE9802769D0 (en) | 1998-08-19 |
EP1110270A1 (en) | 2001-06-27 |
KR20010072326A (en) | 2001-07-31 |
CN1312962A (en) | 2001-09-12 |
SE513022C2 (en) | 2000-06-19 |
CN1178783C (en) | 2004-12-08 |
WO2000011747A1 (en) | 2000-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |