AU5407698A - A printed circuit board and a method for manufacturing the printed circuit board - Google Patents
A printed circuit board and a method for manufacturing the printed circuit boardInfo
- Publication number
- AU5407698A AU5407698A AU54076/98A AU5407698A AU5407698A AU 5407698 A AU5407698 A AU 5407698A AU 54076/98 A AU54076/98 A AU 54076/98A AU 5407698 A AU5407698 A AU 5407698A AU 5407698 A AU5407698 A AU 5407698A
- Authority
- AU
- Australia
- Prior art keywords
- circuit board
- printed circuit
- manufacturing
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IE960825 | 1996-11-22 | ||
| IE960825 | 1996-11-22 | ||
| PCT/IE1997/000078 WO1998023137A1 (en) | 1996-11-22 | 1997-11-20 | A printed circuit board and a method for manufacturing the printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU5407698A true AU5407698A (en) | 1998-06-10 |
Family
ID=11041313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU54076/98A Abandoned AU5407698A (en) | 1996-11-22 | 1997-11-20 | A printed circuit board and a method for manufacturing the printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU5407698A (en) |
| WO (1) | WO1998023137A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMO20030200A1 (en) * | 2003-07-10 | 2005-01-11 | Nuova Laelvi S R L | PROCEDURE FOR ASSEMBLING A PRINTED CIRCUIT |
| JP7521388B2 (en) * | 2020-11-25 | 2024-07-24 | 三菱マテリアル株式会社 | Heat sink integrated insulating circuit board and method for manufacturing the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4086114A (en) * | 1975-05-27 | 1978-04-25 | International Business Machines Corporation | Aluminum surface treatment to enhance adhesion in a given direction |
| JPS6450592A (en) * | 1987-08-21 | 1989-02-27 | Shinko Chem | Super-heat dissipation type composite circuit board |
| JPH01166956A (en) * | 1987-12-24 | 1989-06-30 | Shin Kobe Electric Mach Co Ltd | Manufacturing method for metal-based metal foil-clad laminates |
| JPH0239930A (en) * | 1988-07-29 | 1990-02-08 | Shin Kobe Electric Mach Co Ltd | Metal foil-plated laminate with metal core and its manufacture |
| JPH0258887A (en) * | 1988-08-25 | 1990-02-28 | Mitsubishi Plastics Ind Ltd | Aluminum based copper-clad lamination board |
| JPH0441236A (en) * | 1990-06-07 | 1992-02-12 | Hitachi Chem Co Ltd | Treatment of copper or copper alloy plate and metal base board and metal base wiring board using same metal plate |
| DE59206797D1 (en) * | 1991-04-10 | 1996-08-29 | Dyconex Ag | Metal foil with a textured surface |
| JPH0645715A (en) * | 1992-07-22 | 1994-02-18 | Mitsui Toatsu Chem Inc | Wiring substrate |
-
1997
- 1997-11-20 AU AU54076/98A patent/AU5407698A/en not_active Abandoned
- 1997-11-20 WO PCT/IE1997/000078 patent/WO1998023137A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998023137A1 (en) | 1998-05-28 |
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