AU4847799A - High electron mobility transistor - Google Patents
High electron mobility transistorInfo
- Publication number
- AU4847799A AU4847799A AU48477/99A AU4847799A AU4847799A AU 4847799 A AU4847799 A AU 4847799A AU 48477/99 A AU48477/99 A AU 48477/99A AU 4847799 A AU4847799 A AU 4847799A AU 4847799 A AU4847799 A AU 4847799A
- Authority
- AU
- Australia
- Prior art keywords
- electron mobility
- high electron
- mobility transistor
- transistor
- mobility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
- H10D30/4732—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
- H10D30/4738—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material having multiple donor layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12758898A | 1998-07-31 | 1998-07-31 | |
US09127588 | 1998-07-31 | ||
PCT/US1999/014805 WO2000007248A1 (en) | 1998-07-31 | 1999-06-29 | High electron mobility transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
AU4847799A true AU4847799A (en) | 2000-02-21 |
Family
ID=22430879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU48477/99A Abandoned AU4847799A (en) | 1998-07-31 | 1999-06-29 | High electron mobility transistor |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU4847799A (en) |
WO (1) | WO2000007248A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6489639B1 (en) * | 2000-05-24 | 2002-12-03 | Raytheon Company | High electron mobility transistor |
US6888179B2 (en) | 2003-04-17 | 2005-05-03 | Bae Systems Information And Electronic Systems Integration Inc | GaAs substrate with Sb buffering for high in devices |
CN101636843B (en) * | 2006-10-04 | 2012-06-13 | 塞莱斯系统集成公司 | Single voltage supply pseudqmorphic high electron mobility transistor (phemt) power device and process for manufacturing the same |
US10586848B2 (en) * | 2016-02-22 | 2020-03-10 | Intel Corporation | Apparatus and methods to create an active channel having indium rich side and bottom surfaces |
CN115579392B (en) * | 2022-12-09 | 2023-02-14 | 泉州市三安集成电路有限公司 | P-HEMT semiconductor structure and manufacturing method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963949A (en) * | 1988-09-30 | 1990-10-16 | The United States Of America As Represented Of The United States Department Of Energy | Substrate structures for InP-based devices |
JP3086748B2 (en) * | 1991-07-26 | 2000-09-11 | 株式会社東芝 | High electron mobility transistor |
JP3116731B2 (en) * | 1994-07-25 | 2000-12-11 | 株式会社日立製作所 | Lattice-mismatched stacked crystal structure and semiconductor device using the same |
-
1999
- 1999-06-29 WO PCT/US1999/014805 patent/WO2000007248A1/en active Application Filing
- 1999-06-29 AU AU48477/99A patent/AU4847799A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2000007248A1 (en) | 2000-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |