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AU4503000A - Chip carrier socket - Google Patents

Chip carrier socket

Info

Publication number
AU4503000A
AU4503000A AU45030/00A AU4503000A AU4503000A AU 4503000 A AU4503000 A AU 4503000A AU 45030/00 A AU45030/00 A AU 45030/00A AU 4503000 A AU4503000 A AU 4503000A AU 4503000 A AU4503000 A AU 4503000A
Authority
AU
Australia
Prior art keywords
chip carrier
carrier socket
socket
chip
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU45030/00A
Inventor
William J. Hayes
Gary Held
Lee E. Palmer
Craig Reske
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wells Cti Inc
Original Assignee
Wells Cti Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wells Cti Inc filed Critical Wells Cti Inc
Publication of AU4503000A publication Critical patent/AU4503000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU45030/00A 1999-05-04 2000-05-04 Chip carrier socket Abandoned AU4503000A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US13269699P 1999-05-04 1999-05-04
US60132696 1999-05-04
US14931699P 1999-08-17 1999-08-17
US60149316 1999-08-17
US16534399P 1999-11-12 1999-11-12
US60165343 1999-11-12
PCT/US2000/012108 WO2000067540A1 (en) 1999-05-04 2000-05-04 Chip carrier socket

Publications (1)

Publication Number Publication Date
AU4503000A true AU4503000A (en) 2000-11-17

Family

ID=27384329

Family Applications (1)

Application Number Title Priority Date Filing Date
AU45030/00A Abandoned AU4503000A (en) 1999-05-04 2000-05-04 Chip carrier socket

Country Status (2)

Country Link
AU (1) AU4503000A (en)
WO (1) WO2000067540A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
CN104198916A (en) * 2014-09-01 2014-12-10 苏州市吴中区胥口广博模具加工厂 Four-station mixed testing device without light and interference source
CN108326774B (en) * 2018-01-08 2024-08-02 清华大学 Chip fixing device
CN111951877B (en) * 2019-05-16 2024-06-25 第一检测有限公司 Detection device
WO2021100449A1 (en) * 2019-11-21 2021-05-27 株式会社ヨコオ Socket and tool
US11237207B2 (en) * 2019-11-25 2022-02-01 Sensata Technologies, Inc. Semiconductor test socket with a floating plate and latch for holding the semiconductor device
KR102213075B1 (en) * 2020-01-07 2021-02-08 (주)마이크로컨텍솔루션 Test socket
KR102763222B1 (en) * 2022-09-23 2025-02-07 주식회사 아이에스시 Pusher for electrical test

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317550A (en) * 1986-07-10 1988-01-25 Yamaichi Electric Mfg Co Ltd Ic loading and contacting type socket
US5064476A (en) * 1990-09-17 1991-11-12 Recine Sr Leonard J Thermoelectric cooler and fabrication method
US5247250A (en) * 1992-03-27 1993-09-21 Minnesota Mining And Manufacturing Company Integrated circuit test socket
US5586891A (en) * 1994-05-04 1996-12-24 Electronic Designs Inc. Electrical socket for high-frequency applications
JPH08213128A (en) * 1995-02-08 1996-08-20 Texas Instr Japan Ltd Socket

Also Published As

Publication number Publication date
WO2000067540A1 (en) 2000-11-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase