AU2003272975A1 - Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus - Google Patents
Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatusInfo
- Publication number
- AU2003272975A1 AU2003272975A1 AU2003272975A AU2003272975A AU2003272975A1 AU 2003272975 A1 AU2003272975 A1 AU 2003272975A1 AU 2003272975 A AU2003272975 A AU 2003272975A AU 2003272975 A AU2003272975 A AU 2003272975A AU 2003272975 A1 AU2003272975 A1 AU 2003272975A1
- Authority
- AU
- Australia
- Prior art keywords
- processing apparatus
- plasma processing
- dielectric plate
- plate used
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-297689 | 2002-10-10 | ||
JP2002297689A JP4266610B2 (en) | 2002-10-10 | 2002-10-10 | Plasma processing apparatus, dielectric plate and processing container used therefor |
PCT/JP2003/013051 WO2004034455A1 (en) | 2002-10-10 | 2003-10-10 | Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003272975A1 true AU2003272975A1 (en) | 2004-05-04 |
Family
ID=32089280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003272975A Abandoned AU2003272975A1 (en) | 2002-10-10 | 2003-10-10 | Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4266610B2 (en) |
KR (2) | KR100782623B1 (en) |
CN (1) | CN100561680C (en) |
AU (1) | AU2003272975A1 (en) |
WO (1) | WO2004034455A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100773721B1 (en) * | 2005-10-04 | 2007-11-09 | 주식회사 아이피에스 | Plasma processing equipment |
JP4997842B2 (en) * | 2005-10-18 | 2012-08-08 | 東京エレクトロン株式会社 | Processing equipment |
JP5157199B2 (en) | 2007-03-07 | 2013-03-06 | 東京エレクトロン株式会社 | Vacuum vessel, pressure vessel and sealing method thereof |
KR20110010643A (en) * | 2008-08-08 | 2011-02-01 | 도쿄엘렉트론가부시키가이샤 | Microwave Plasma Generator and Microwave Plasma Processing Apparatus |
CN101667524B (en) * | 2008-09-03 | 2011-09-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and plasma treatment device applying same |
JP2010251064A (en) * | 2009-04-14 | 2010-11-04 | Ulvac Japan Ltd | Plasma generator |
US8980047B2 (en) | 2010-07-02 | 2015-03-17 | Samsung Electronics Co., Ltd. | Microwave plasma processing apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2625756B2 (en) * | 1987-09-08 | 1997-07-02 | 住友金属工業株式会社 | Plasma process equipment |
DE4217900A1 (en) * | 1992-05-29 | 1993-12-02 | Leybold Ag | Arrangement of microwave-transparent pane in hollow waveguide - the pane being glued to part attached to the vacuum chamber |
JPH08106993A (en) * | 1994-10-03 | 1996-04-23 | Kokusai Electric Co Ltd | Plasma generator |
JP2002164330A (en) * | 2000-07-24 | 2002-06-07 | Canon Inc | Plasma treatment apparatus having transmission window covered with light shielding film |
JP2002270599A (en) * | 2001-03-13 | 2002-09-20 | Canon Inc | Plasma treating apparatus |
-
2002
- 2002-10-10 JP JP2002297689A patent/JP4266610B2/en not_active Expired - Lifetime
-
2003
- 2003-10-10 KR KR1020057006152A patent/KR100782623B1/en not_active Expired - Fee Related
- 2003-10-10 AU AU2003272975A patent/AU2003272975A1/en not_active Abandoned
- 2003-10-10 KR KR1020077013776A patent/KR100791660B1/en not_active Expired - Fee Related
- 2003-10-10 WO PCT/JP2003/013051 patent/WO2004034455A1/en active Application Filing
- 2003-10-10 CN CNB2003801010227A patent/CN100561680C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20050047136A (en) | 2005-05-19 |
KR100782623B1 (en) | 2007-12-06 |
CN1703771A (en) | 2005-11-30 |
CN100561680C (en) | 2009-11-18 |
KR20070086378A (en) | 2007-08-27 |
WO2004034455A1 (en) | 2004-04-22 |
JP2004134583A (en) | 2004-04-30 |
KR100791660B1 (en) | 2008-01-03 |
JP4266610B2 (en) | 2009-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |