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AU2003272975A1 - Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus - Google Patents

Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus

Info

Publication number
AU2003272975A1
AU2003272975A1 AU2003272975A AU2003272975A AU2003272975A1 AU 2003272975 A1 AU2003272975 A1 AU 2003272975A1 AU 2003272975 A AU2003272975 A AU 2003272975A AU 2003272975 A AU2003272975 A AU 2003272975A AU 2003272975 A1 AU2003272975 A1 AU 2003272975A1
Authority
AU
Australia
Prior art keywords
processing apparatus
plasma processing
dielectric plate
plate used
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003272975A
Inventor
Osamu Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003272975A1 publication Critical patent/AU2003272975A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
AU2003272975A 2002-10-10 2003-10-10 Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus Abandoned AU2003272975A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-297689 2002-10-10
JP2002297689A JP4266610B2 (en) 2002-10-10 2002-10-10 Plasma processing apparatus, dielectric plate and processing container used therefor
PCT/JP2003/013051 WO2004034455A1 (en) 2002-10-10 2003-10-10 Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus

Publications (1)

Publication Number Publication Date
AU2003272975A1 true AU2003272975A1 (en) 2004-05-04

Family

ID=32089280

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003272975A Abandoned AU2003272975A1 (en) 2002-10-10 2003-10-10 Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus

Country Status (5)

Country Link
JP (1) JP4266610B2 (en)
KR (2) KR100782623B1 (en)
CN (1) CN100561680C (en)
AU (1) AU2003272975A1 (en)
WO (1) WO2004034455A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100773721B1 (en) * 2005-10-04 2007-11-09 주식회사 아이피에스 Plasma processing equipment
JP4997842B2 (en) * 2005-10-18 2012-08-08 東京エレクトロン株式会社 Processing equipment
JP5157199B2 (en) 2007-03-07 2013-03-06 東京エレクトロン株式会社 Vacuum vessel, pressure vessel and sealing method thereof
KR20110010643A (en) * 2008-08-08 2011-02-01 도쿄엘렉트론가부시키가이샤 Microwave Plasma Generator and Microwave Plasma Processing Apparatus
CN101667524B (en) * 2008-09-03 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 Reaction chamber and plasma treatment device applying same
JP2010251064A (en) * 2009-04-14 2010-11-04 Ulvac Japan Ltd Plasma generator
US8980047B2 (en) 2010-07-02 2015-03-17 Samsung Electronics Co., Ltd. Microwave plasma processing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2625756B2 (en) * 1987-09-08 1997-07-02 住友金属工業株式会社 Plasma process equipment
DE4217900A1 (en) * 1992-05-29 1993-12-02 Leybold Ag Arrangement of microwave-transparent pane in hollow waveguide - the pane being glued to part attached to the vacuum chamber
JPH08106993A (en) * 1994-10-03 1996-04-23 Kokusai Electric Co Ltd Plasma generator
JP2002164330A (en) * 2000-07-24 2002-06-07 Canon Inc Plasma treatment apparatus having transmission window covered with light shielding film
JP2002270599A (en) * 2001-03-13 2002-09-20 Canon Inc Plasma treating apparatus

Also Published As

Publication number Publication date
KR20050047136A (en) 2005-05-19
KR100782623B1 (en) 2007-12-06
CN1703771A (en) 2005-11-30
CN100561680C (en) 2009-11-18
KR20070086378A (en) 2007-08-27
WO2004034455A1 (en) 2004-04-22
JP2004134583A (en) 2004-04-30
KR100791660B1 (en) 2008-01-03
JP4266610B2 (en) 2009-05-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase