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AU2003252389A1 - Method and device for scribing fragile material substrate - Google Patents

Method and device for scribing fragile material substrate

Info

Publication number
AU2003252389A1
AU2003252389A1 AU2003252389A AU2003252389A AU2003252389A1 AU 2003252389 A1 AU2003252389 A1 AU 2003252389A1 AU 2003252389 A AU2003252389 A AU 2003252389A AU 2003252389 A AU2003252389 A AU 2003252389A AU 2003252389 A1 AU2003252389 A1 AU 2003252389A1
Authority
AU
Australia
Prior art keywords
material substrate
fragile material
scribing
scribing fragile
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003252389A
Inventor
Masahiro Fujii
Shuichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of AU2003252389A1 publication Critical patent/AU2003252389A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/003—Cooling means for welding or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
AU2003252389A 2002-08-09 2003-08-04 Method and device for scribing fragile material substrate Abandoned AU2003252389A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-234049 2002-08-09
JP2002234049 2002-08-09
PCT/JP2003/009899 WO2004014625A1 (en) 2002-08-09 2003-08-04 Method and device for scribing fragile material substrate

Publications (1)

Publication Number Publication Date
AU2003252389A1 true AU2003252389A1 (en) 2004-02-25

Family

ID=31711886

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003252389A Abandoned AU2003252389A1 (en) 2002-08-09 2003-08-04 Method and device for scribing fragile material substrate

Country Status (6)

Country Link
JP (1) JP4080484B2 (en)
KR (1) KR100649894B1 (en)
CN (1) CN1298523C (en)
AU (1) AU2003252389A1 (en)
TW (1) TWI277612B (en)
WO (1) WO2004014625A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619024B2 (en) * 2004-03-19 2011-01-26 芝浦メカトロニクス株式会社 Brittle material cleaving system and method
JP2008503355A (en) * 2004-06-21 2008-02-07 アプライド フォトニクス，インク． Substrate material cutting, dividing or dividing apparatus, system and method
KR100821937B1 (en) 2004-10-25 2008-04-15 미쓰보시 다이야몬도 고교 가부시키가이샤 Crack Forming Method and Crack Forming Device
KR100740456B1 (en) * 2006-08-31 2007-07-18 로체 시스템즈(주) Method and apparatus for cutting nonmetallic plate by precooling
WO2008133800A1 (en) * 2007-04-30 2008-11-06 Corning Incorporated Apparatus, system, and method for scoring a moving glass ribbon
JP5011048B2 (en) * 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 Processing method of brittle material substrate
JP2013500224A (en) * 2009-07-22 2013-01-07 コーニング インコーポレイテッド Heating and quenching scoring process
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2011162392A1 (en) * 2010-06-25 2011-12-29 旭硝子株式会社 Cutting method and cutting apparatus
TWI513670B (en) 2010-08-31 2015-12-21 Corning Inc Methods of separating strengthened glass substrates
TWI400137B (en) * 2010-12-17 2013-07-01 Ind Tech Res Inst Device for removing defects on edges of glass sheets and method therefor
CN102643017B (en) * 2011-03-14 2014-09-10 京东方科技集团股份有限公司 Non-contact type breaking method and equipment and method and equipment for cutting and breaking
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN106573819A (en) * 2014-08-20 2017-04-19 康宁股份有限公司 Method and apparatus for yielding high edge strength in cutting of flexible thin glass
CN110480192B (en) * 2019-08-28 2021-06-11 业成科技（成都）有限公司 Method for cutting brittle material
JP7459536B2 (en) * 2020-02-04 2024-04-02 日本電気硝子株式会社 Glass plate and method for producing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384789A (en) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd Light working method
JP2000233936A (en) * 1999-02-10 2000-08-29 Mitsuboshi Diamond Kogyo Kk Glass cutting device
JP2001064029A (en) * 1999-08-27 2001-03-13 Toyo Commun Equip Co Ltd Multilayered glass substrate and its cutting method
KR100673073B1 (en) * 2000-10-21 2007-01-22 삼성전자주식회사 Method and apparatus for cutting nonmetallic substrate using laser beam

Also Published As

Publication number Publication date
JP4080484B2 (en) 2008-04-23
TWI277612B (en) 2007-04-01
JPWO2004014625A1 (en) 2005-12-02
WO2004014625A1 (en) 2004-02-19
TW200403193A (en) 2004-03-01
CN1638931A (en) 2005-07-13
CN1298523C (en) 2007-02-07
KR100649894B1 (en) 2006-11-27
KR20050018636A (en) 2005-02-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase