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AU2002216373A1 - Solder foil and semiconductor device and electronic device - Google Patents

Solder foil and semiconductor device and electronic device

Info

Publication number
AU2002216373A1
AU2002216373A1 AU2002216373A AU1637302A AU2002216373A1 AU 2002216373 A1 AU2002216373 A1 AU 2002216373A1 AU 2002216373 A AU2002216373 A AU 2002216373A AU 1637302 A AU1637302 A AU 1637302A AU 2002216373 A1 AU2002216373 A1 AU 2002216373A1
Authority
AU
Australia
Prior art keywords
solder foil
electronic device
semiconductor device
semiconductor
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002216373A
Inventor
Hanae Hata
Toshiharu Ishida
Kazuma Miura
Tetsuya Nakatsuka
Masahide Okamoto
Tasao Soga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of AU2002216373A1 publication Critical patent/AU2002216373A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15717—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2002216373A 2000-12-21 2001-12-19 Solder foil and semiconductor device and electronic device Abandoned AU2002216373A1 (en)

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KR (1) KR100548114B1 (en)
CN (2) CN100578778C (en)
AU (1) AU2002216373A1 (en)
TW (1) TW592871B (en)
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Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800977B2 (en) 2001-04-11 2006-07-26 株式会社日立製作所 Products using Zn-Al solder
JP4416373B2 (en) * 2002-03-08 2010-02-17 株式会社日立製作所 Electronics
KR100499134B1 (en) * 2002-10-28 2005-07-04 삼성전자주식회사 Compression bonding method
JP3999759B2 (en) * 2004-04-02 2007-10-31 富士通株式会社 Substrate and electronic equipment
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
JP4350753B2 (en) * 2004-08-10 2009-10-21 株式会社Ｎｅｏｍａｘマテリアル Heat sink member and manufacturing method thereof
JP4524454B2 (en) * 2004-11-19 2010-08-18 ルネサスエレクトロニクス株式会社 Electronic device and manufacturing method thereof
JP4456503B2 (en) * 2004-12-24 2010-04-28 富士通メディアデバイス株式会社 Manufacturing method of electronic parts
JP4569423B2 (en) * 2005-08-31 2010-10-27 株式会社日立製作所 Manufacturing method of semiconductor device
US20070141378A1 (en) * 2005-12-21 2007-06-21 International Business Machines Corporation Low melting temperature alloy structure for enchanced thermal interface
WO2007125861A1 (en) * 2006-04-26 2007-11-08 Senju Metal Industry Co., Ltd. Solder paste
US7910945B2 (en) * 2006-06-30 2011-03-22 Cree, Inc. Nickel tin bonding system with barrier layer for semiconductor wafers and devices
US8643195B2 (en) * 2006-06-30 2014-02-04 Cree, Inc. Nickel tin bonding system for semiconductor wafers and devices
US7855459B2 (en) * 2006-09-22 2010-12-21 Cree, Inc. Modified gold-tin system with increased melting temperature for wafer bonding
CA2676218C (en) * 2007-01-22 2016-01-19 University Of Maryland High temperature solder materials
DE102007005853A1 (en) * 2007-02-01 2008-08-07 Braun Gmbh Hair removal device
EP2157842B1 (en) * 2007-05-17 2018-03-14 Fujikura, Ltd. Laminated wiring board and method for manufacturing the same
CN101803009B (en) * 2007-09-11 2012-07-04 陶氏康宁公司 Composite, thermal interface material containing the composite, and methods for their preparation and use
KR20090042556A (en) * 2007-10-26 2009-04-30 삼성전기주식회사 Printed Circuit Board and Manufacturing Method
JP5058766B2 (en) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 Electronic equipment soldered using lead-free bonding materials
US8247267B2 (en) 2008-03-11 2012-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level IC assembly method
JP2009283741A (en) * 2008-05-23 2009-12-03 Fuji Electric Device Technology Co Ltd Semiconductor device
US8243391B2 (en) * 2008-09-26 2012-08-14 Hitachi Global Storage Technologies, Netherlands B.V. Slider and suspension composite fiber solder joints
US8202765B2 (en) * 2009-01-22 2012-06-19 International Business Machines Corporation Achieving mechanical and thermal stability in a multi-chip package
JP2011014705A (en) * 2009-07-01 2011-01-20 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP5465942B2 (en) * 2009-07-16 2014-04-09 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
JP2011044624A (en) * 2009-08-24 2011-03-03 Hitachi Ltd Semiconductor device, and on-vehicle ac generator
US20110079630A1 (en) * 2009-10-07 2011-04-07 Babcock & Wilcox Technical Services Y-12, Llc System for reducing metallic whisker formation
JP5463845B2 (en) 2009-10-15 2014-04-09 三菱電機株式会社 Power semiconductor device and manufacturing method thereof
JP2011138968A (en) * 2009-12-28 2011-07-14 Senju Metal Ind Co Ltd Method for soldering surface-mount component, and surface-mount component
DE102010003330A1 (en) * 2010-03-26 2011-09-29 Robert Bosch Gmbh Thermally conductive arrangement between two components and method for producing a heat-conducting arrangement
JP5459127B2 (en) * 2010-07-20 2014-04-02 千住金属工業株式会社 Manufacturing method of functional parts and functional parts
US8399969B2 (en) * 2010-07-27 2013-03-19 Visera Technologies Company Limited Chip package and fabricating method thereof
JP5700504B2 (en) * 2010-08-05 2015-04-15 株式会社デンソー Semiconductor device bonding materials
JP5821991B2 (en) * 2010-08-31 2015-11-24 日立金属株式会社 Semiconductor module and bonding material
US8633600B2 (en) * 2010-09-21 2014-01-21 Infineon Technologies Ag Device and method for manufacturing a device
EP2630267B1 (en) * 2010-10-20 2020-07-22 Robert Bosch GmbH Starting material for a sintered join
CN102069314A (en) * 2010-11-26 2011-05-25 深圳市晨日科技有限公司 Solidifying soldering paste used for large-power LED and preparation method thereof
JP2012174927A (en) * 2011-02-22 2012-09-10 Fujitsu Ltd Semiconductor device and manufacturing method of the same
CN102244022A (en) * 2011-04-26 2011-11-16 哈尔滨工业大学 Manufacturing method of single intermetallic compound micro-interconnecting structure of flip chip
KR101609036B1 (en) * 2011-05-27 2016-04-04 신닛테츠스미킨 카부시키카이샤 Interconnector for solar cells, and solar cell module
KR20140063662A (en) * 2011-08-02 2014-05-27 알파 메탈즈, 인코포레이티드 Solder compositions
JP2013038330A (en) * 2011-08-10 2013-02-21 Toshiba Corp Semiconductor device manufacturing method and semiconductor device
DE102011082537A1 (en) * 2011-09-12 2013-03-14 Robert Bosch Gmbh Printed circuit board and electrical components for use in an aggressive environment and method for producing such a printed circuit board
US8426255B2 (en) * 2011-09-14 2013-04-23 Chipmos Technologies, Inc. Chip package structure and method for manufacturing the same
TWI544583B (en) * 2012-04-18 2016-08-01 鴻海精密工業股份有限公司 Chip assembly and chip assembling method
JP6038564B2 (en) * 2012-09-20 2016-12-07 Ｄｏｗａエレクトロニクス株式会社 Semiconductor laminate bonding substrate and manufacturing method thereof
KR20160003078A (en) 2013-05-03 2016-01-08 허니웰 인터내셔날 인코포레이티드 Lead frame construct for lead-free solder connections
KR102156373B1 (en) 2013-05-10 2020-09-16 엘지이노텍 주식회사 Solder paste
JP6421582B2 (en) * 2013-12-19 2018-11-14 株式会社デンソー Semiconductor device
JP2015123485A (en) * 2013-12-27 2015-07-06 三菱電機株式会社 Bonding method and power semiconductor device
JP6299442B2 (en) * 2014-06-03 2018-03-28 三菱マテリアル株式会社 Power module
KR101671062B1 (en) * 2014-08-18 2016-10-31 주식회사 경동원 Lead-free solder composition and manufacturing method of lead-free solder composition
CN104811889B (en) * 2015-03-26 2021-08-10 华天科技（西安）有限公司 Assembling method of MEMS microphone packaging device
US20160360622A1 (en) * 2015-06-02 2016-12-08 Microchip Technology Incorporated Integrated Circuit With Sensor Printed In Situ
WO2017047293A1 (en) * 2015-09-15 2017-03-23 株式会社村田製作所 Bonding member, method for producing bonding member, and bonding method
CN107850400B (en) 2015-09-28 2019-10-25 株式会社村田制作所 The manufacturing method of heat pipe, heat dissipation element, heat pipe
WO2017077824A1 (en) * 2015-11-05 2017-05-11 株式会社村田製作所 Joining member and manufacturing method for joining member
EP3407686A4 (en) * 2016-01-19 2019-08-21 Tokusen Kogyo Co., Ltd Stretchable wiring sheet and stretchable touch sensor sheet
GB2569466B (en) * 2016-10-24 2021-06-30 Jaguar Land Rover Ltd Apparatus and method relating to electrochemical migration
US10461021B2 (en) 2017-02-28 2019-10-29 Deere & Company Electronic assembly with enhanced thermal dissipation
DE102017206932A1 (en) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil for producing a Diffusionslötverbindung and method for producing a Lotformteils
CN108637030B (en) * 2018-05-08 2024-03-12 安徽科技学院 Liquid extrusion forming device for brittle solder strip
KR102061203B1 (en) * 2018-11-08 2019-12-31 덕산하이메탈 주식회사 Solder paste and foil with low melting point and heat resistance
JP7102525B2 (en) * 2018-11-29 2022-07-19 コステックシス カンパニー リミテッド How to manufacture a package for a power amplifier with a built-in input / output circuit
WO2020179759A1 (en) * 2019-03-04 2020-09-10 株式会社タムラ製作所 Molding solder and method for preparing same, and soldering method
JP6936351B2 (en) * 2019-03-04 2021-09-15 株式会社タムラ製作所 Molded solder manufacturing method
US20220281035A1 (en) * 2019-08-05 2022-09-08 Nihon Superior Co., Ltd. Solder-metal mesh composite material and method for producing same
JP7200899B2 (en) * 2019-09-30 2023-01-10 三菱電機株式会社 Semiconductor device and method for manufacturing semiconductor device
WO2021078410A1 (en) * 2019-10-23 2021-04-29 Alpha Assembly Solutions Inc. Engineered materials for electronics assembly
CN111725085B (en) * 2020-06-16 2022-04-22 杰群电子科技（东莞）有限公司 A kind of packaging method of semiconductor device and semiconductor device
JPWO2022091988A1 (en) * 2020-10-29 2022-05-05
DE102021119288A1 (en) 2021-07-26 2023-01-26 Infineon Technologies Ag Electronic system having an intermetallic compound structure with a central intermetallic mesh structure and mesh-free outer structures
CN114131237A (en) * 2021-12-14 2022-03-04 浙江亚通焊材有限公司 Foam soldering tin and preparation method thereof
BE1031732B1 (en) * 2023-06-22 2025-02-03 C Mac Electromag Bvba SEMICONDUCTOR COVER WITH SOLDER MATERIAL GASKET

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361973A (en) 1976-11-16 1978-06-02 Fuji Electric Co Ltd Production of semiconductor element
JP2756184B2 (en) * 1990-11-27 1998-05-25 株式会社日立製作所 Surface mounting structure of electronic components
JPH05136286A (en) 1991-11-08 1993-06-01 Hitachi Ltd Semiconductor device
JP2810285B2 (en) 1993-01-20 1998-10-15 株式会社日立製作所 Semiconductor device and manufacturing method thereof
JPH07235565A (en) * 1994-02-23 1995-09-05 Toshiba Corp Electronic circuit device
AT400692B (en) * 1994-04-13 1996-02-26 Plansee Ag HART LOT
JP3054056B2 (en) * 1995-04-24 2000-06-19 株式会社日立製作所 Soldering method
JPH0983128A (en) 1995-09-08 1997-03-28 Toshiba Corp Junction structure of semiconductor module
DE69710089T2 (en) * 1996-08-16 2002-08-22 Hugh P. Craig PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS
JP3226213B2 (en) 1996-10-17 2001-11-05 松下電器産業株式会社 Solder material and electronic component using the same
JP3446798B2 (en) 1996-11-29 2003-09-16 日本特殊陶業株式会社 Wiring board with bonding bump
DE69701277T2 (en) * 1996-12-03 2000-08-31 Lucent Technologies Inc., Murray Hill Fine-particle soft solder containing dispersed particle article
JP3752064B2 (en) * 1997-05-23 2006-03-08 内橋エステック株式会社 Solder material and electronic component using the same
JP3002965B2 (en) 1997-12-29 2000-01-24 株式会社三井ハイテック Connection member for surface mounting of electronic components
JP2000223831A (en) * 1999-02-03 2000-08-11 Yuken Kogyo Kk Paste solder for surface mounting by BGA and surface mounting method
TWI230104B (en) * 2000-06-12 2005-04-01 Hitachi Ltd Electronic device
JP3800977B2 (en) * 2001-04-11 2006-07-26 株式会社日立製作所 Products using Zn-Al solder
JP3757881B2 (en) * 2002-03-08 2006-03-22 株式会社日立製作所 Solder
JP4416373B2 (en) * 2002-03-08 2010-02-17 株式会社日立製作所 Electronics

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KR20030070075A (en) 2003-08-27
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TW592871B (en) 2004-06-21
US20060061974A1 (en) 2006-03-23

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