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AU2001292244A1 - Resist pattern, process for producing the same, and utilization thereof - Google Patents

Resist pattern, process for producing the same, and utilization thereof

Info

Publication number
AU2001292244A1
AU2001292244A1 AU2001292244A AU9224401A AU2001292244A1 AU 2001292244 A1 AU2001292244 A1 AU 2001292244A1 AU 2001292244 A AU2001292244 A AU 2001292244A AU 9224401 A AU9224401 A AU 9224401A AU 2001292244 A1 AU2001292244 A1 AU 2001292244A1
Authority
AU
Australia
Prior art keywords
utilization
producing
same
resist pattern
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001292244A
Inventor
Takahiro Hidaka
Michiko Natori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2001292244A1 publication Critical patent/AU2001292244A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU2001292244A 2000-09-27 2001-09-26 Resist pattern, process for producing the same, and utilization thereof Abandoned AU2001292244A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2000-293255 2000-09-27
JP2000293255 2000-09-27
JP2000320168 2000-10-20
JP2000-320168 2000-10-20
JP2001275523 2001-09-11
JP2001-275523 2001-09-11
PCT/JP2001/008356 WO2002027407A1 (en) 2000-09-27 2001-09-26 Resist pattern, process for producing the same, and utilization thereof

Publications (1)

Publication Number Publication Date
AU2001292244A1 true AU2001292244A1 (en) 2002-04-08

Family

ID=27344757

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001292244A Abandoned AU2001292244A1 (en) 2000-09-27 2001-09-26 Resist pattern, process for producing the same, and utilization thereof

Country Status (6)

Country Link
US (1) US7309559B2 (en)
JP (1) JP3503639B2 (en)
KR (1) KR100578987B1 (en)
AU (1) AU2001292244A1 (en)
TW (1) TW562997B (en)
WO (1) WO2002027407A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344970B2 (en) * 2002-04-11 2008-03-18 Shipley Company, L.L.C. Plating method
JP2006313173A (en) * 2003-07-03 2006-11-16 Hitachi Chem Co Ltd Photosensitive resin composition, laminated body thereof and method for producing same
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
JP2006243680A (en) * 2004-03-22 2006-09-14 Fuji Photo Film Co Ltd Pattern forming process
WO2006038279A1 (en) * 2004-10-04 2006-04-13 Hitachi Chemical Co., Ltd. Photosensitive element, method of forming resist pattern therewith, and process for producing printed wiring board
WO2006038691A1 (en) * 2004-10-07 2006-04-13 Hitachi Chemical Company, Ltd. Resin composition for optical material, resin film for optical material and optical waveguide using same
KR100935779B1 (en) 2005-05-23 2010-01-06 히다치 가세고교 가부시끼가이샤 The photosensitive resin composition, the photosensitive element, the formation method of a resist pattern, and the manufacturing method of a printed wiring board
KR100935780B1 (en) * 2005-05-30 2010-01-06 히다치 가세고교 가부시끼가이샤 Photosensitive resin composition The method of forming a photosensitive element, a resist pattern using this, and the manufacturing method of a printed wiring board
KR20080052686A (en) * 2005-10-04 2008-06-11 히다치 가세고교 가부시끼가이샤 Manufacturing method of photosensitive resin composition, photosensitive element, and printed wiring board
US8101339B2 (en) * 2005-10-25 2012-01-24 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
EP1783548B1 (en) 2005-11-08 2017-03-08 Rohm and Haas Electronic Materials LLC Method of forming a patterned layer on a substrate
TW200745749A (en) * 2006-02-21 2007-12-16 Hitachi Chemical Co Ltd Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel
US20100028816A1 (en) * 2006-08-30 2010-02-04 Ko Hermans Process for preparing a polymeric relief structure
US7756601B1 (en) * 2007-03-05 2010-07-13 R.P. Gatta, Inc. Intuitive controller for vertical lift assist device
WO2009147913A1 (en) * 2008-06-02 2009-12-10 日立化成工業株式会社 Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
US9081275B2 (en) * 2010-12-02 2015-07-14 Industrial Technology Research Institute Photosensitive composition and photoresist
JP5573961B2 (en) * 2010-12-16 2014-08-20 日立化成株式会社 Photosensitive element, resist pattern forming method, and printed wiring board manufacturing method
TWI503625B (en) * 2013-08-23 2015-10-11 Ind Tech Res Inst Photosensitive composition and photoresist
JPWO2016043162A1 (en) * 2014-09-18 2017-07-06 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for manufacturing substrate with resist pattern, and method for manufacturing printed wiring board
WO2016104585A1 (en) * 2014-12-25 2016-06-30 日立化成株式会社 Photosensitive resin composition, and photosensitive element using same, as well as method for forming resist pattern and method for producing printed circuit board
CN111279804B (en) * 2017-12-20 2023-10-24 住友电气工业株式会社 Method for manufacturing printed circuit board and laminated structure

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479185A (en) 1965-06-03 1969-11-18 Du Pont Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers
DE2027467C3 (en) 1970-06-04 1974-08-15 Kalle Ag, 6202 Wiesbaden-Biebrich Photopolymerizable copying compound
DE2727469A1 (en) 1977-06-18 1978-12-21 Hoechst Ag NEW HEXAHYDROPYRIMIDINE, METHOD FOR THE PRODUCTION THEREOF AND MEDICINAL PRODUCTS CONTAINING THESE COMPOUNDS
JPS5427104A (en) 1977-08-01 1979-03-01 Yokohama Rubber Co Ltd:The Run-flat tire for use in two-wheel car
DE2850585A1 (en) 1978-11-22 1980-06-04 Hoechst Ag PHOTOPOLYMERIZABLE MIXTURE
US4629680A (en) * 1984-01-30 1986-12-16 Fuji Photo Film Co., Ltd. Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution
DE3620254C2 (en) * 1985-06-18 1994-05-05 Canon Kk By blasting with effective energy curable resin mixture
US5238782A (en) * 1986-12-26 1993-08-24 Fuji Photo Film Co., Ltd. Photopolymerizable composition
JPH05102021A (en) 1991-10-11 1993-04-23 Hitachi Ltd Method for forming high aspect ratio fine pattern of organic film
JPH05204139A (en) * 1992-01-24 1993-08-13 Nippon Paint Co Ltd Photosensitive resin composition for flexographic printing material
JPH05341526A (en) 1992-06-12 1993-12-24 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same
JPH05341527A (en) 1992-06-12 1993-12-24 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same
JP3272045B2 (en) 1992-08-20 2002-04-08 日本合成化学工業株式会社 Manufacturing method of printed wiring board
JPH06282069A (en) 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd Photosensitive resin composition for thick-film circuit
JP3073358B2 (en) 1993-03-25 2000-08-07 旭化成工業株式会社 Thick film circuit board and method of manufacturing the same
JP3170940B2 (en) 1993-04-01 2001-05-28 松下電器産業株式会社 Method of forming fine pattern
JPH1031303A (en) * 1994-09-29 1998-02-03 Nippon Zeon Co Ltd Photosensitive composition and photosensitive rubber plate
US5863704A (en) * 1995-04-26 1999-01-26 Nippon Zeon Company, Ltd. Photosensitive composition and photosensitive rubber plate
JPH08328265A (en) 1995-05-31 1996-12-13 Matsushita Electric Ind Co Ltd Fine pattern formation method
JP3004595B2 (en) 1996-10-08 2000-01-31 日本合成化学工業株式会社 Photosensitive resin composition and dry film resist using the same
JPH1173874A (en) 1997-09-01 1999-03-16 Toray Ind Inc Manufacture of plasma display
JPH11102067A (en) 1997-09-26 1999-04-13 Nippon Synthetic Chem Ind Co Ltd:The Photoresist film
JP4004606B2 (en) 1997-11-14 2007-11-07 日本合成化学工業株式会社 Photoresist film
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
JP4779284B2 (en) * 2000-06-22 2011-09-28 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method
TWI285296B (en) * 2000-09-20 2007-08-11 Hitachi Chemical Co Ltd Photosensitive element, method for forming resist pattern, and method for mfg. printed wiring board
JP3849641B2 (en) * 2001-03-29 2006-11-22 日立化成工業株式会社 Manufacturing method of photosensitive film for circuit formation and printed wiring board

Also Published As

Publication number Publication date
WO2002027407A1 (en) 2002-04-04
JPWO2002027407A1 (en) 2004-02-05
US7309559B2 (en) 2007-12-18
US20040063025A1 (en) 2004-04-01
TW562997B (en) 2003-11-21
KR20030028765A (en) 2003-04-10
KR100578987B1 (en) 2006-05-12
JP3503639B2 (en) 2004-03-08

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