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AU2001283725A1 - Method and device for continuous cold plasma deposition of metal coatings - Google Patents

Method and device for continuous cold plasma deposition of metal coatings

Info

Publication number
AU2001283725A1
AU2001283725A1 AU2001283725A AU8372501A AU2001283725A1 AU 2001283725 A1 AU2001283725 A1 AU 2001283725A1 AU 2001283725 A AU2001283725 A AU 2001283725A AU 8372501 A AU8372501 A AU 8372501A AU 2001283725 A1 AU2001283725 A1 AU 2001283725A1
Authority
AU
Australia
Prior art keywords
plasma deposition
cold plasma
metal coatings
continuous cold
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283725A
Inventor
Pierre Vanden Brande
Alain Weymeersch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cold Plasma Applications CPA Sprl
Original Assignee
CPA SPRL COLD PLASMA APPLIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8171943&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001283725(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by CPA SPRL COLD PLASMA APPLIC filed Critical CPA SPRL COLD PLASMA APPLIC
Publication of AU2001283725A1 publication Critical patent/AU2001283725A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3432—Target-material dispenser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
AU2001283725A 2000-08-23 2001-08-23 Method and device for continuous cold plasma deposition of metal coatings Abandoned AU2001283725A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00202942A EP1182272A1 (en) 2000-08-23 2000-08-23 Process and apparatus for continuous cold plasma deposition of metallic layers
EP00202942 2000-08-23
PCT/BE2001/000142 WO2002016664A1 (en) 2000-08-23 2001-08-23 Method and device for continuous cold plasma deposition of metal coatings

Publications (1)

Publication Number Publication Date
AU2001283725A1 true AU2001283725A1 (en) 2002-03-04

Family

ID=8171943

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283725A Abandoned AU2001283725A1 (en) 2000-08-23 2001-08-23 Method and device for continuous cold plasma deposition of metal coatings

Country Status (8)

Country Link
US (1) US7156960B2 (en)
EP (2) EP1182272A1 (en)
JP (1) JP2004507617A (en)
AU (1) AU2001283725A1 (en)
BR (1) BR0113560A (en)
CA (1) CA2420243A1 (en)
WO (1) WO2002016664A1 (en)
ZA (1) ZA200301531B (en)

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US10039927B2 (en) 2007-04-23 2018-08-07 Plasmology4, Inc. Cold plasma treatment devices and associated methods
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EP2048261A1 (en) * 2007-10-12 2009-04-15 ArcelorMittal France Industrial steam generator for depositing an alloy coating on a metal band
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JP5226809B2 (en) * 2008-12-26 2013-07-03 キヤノンアネルバ株式会社 Film forming apparatus and substrate manufacturing method using the same
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Also Published As

Publication number Publication date
ZA200301531B (en) 2004-02-25
EP1182272A1 (en) 2002-02-27
CA2420243A1 (en) 2002-02-28
WO2002016664A1 (en) 2002-02-28
US7156960B2 (en) 2007-01-02
JP2004507617A (en) 2004-03-11
BR0113560A (en) 2003-07-08
EP1313889A1 (en) 2003-05-28
US20040026234A1 (en) 2004-02-12

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