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AU2001273464A1 - Low dielectric constant materials with polymeric networks - Google Patents

Low dielectric constant materials with polymeric networks

Info

Publication number
AU2001273464A1
AU2001273464A1 AU2001273464A AU7346401A AU2001273464A1 AU 2001273464 A1 AU2001273464 A1 AU 2001273464A1 AU 2001273464 A AU2001273464 A AU 2001273464A AU 7346401 A AU7346401 A AU 7346401A AU 2001273464 A1 AU2001273464 A1 AU 2001273464A1
Authority
AU
Australia
Prior art keywords
dielectric constant
low dielectric
constant materials
polymeric networks
polymeric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273464A
Inventor
Emma Brouk
Boris Korolev
Kreisler Lau
Feng Quan Liu
David Nalewajek
Ruslan Zherebin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2001273464A1 publication Critical patent/AU2001273464A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Polyethers (AREA)
  • Organic Insulating Materials (AREA)
AU2001273464A 2000-07-19 2001-07-12 Low dielectric constant materials with polymeric networks Abandoned AU2001273464A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09619237 2000-07-19
US09/619,237 US6423811B1 (en) 2000-07-19 2000-07-19 Low dielectric constant materials with polymeric networks
PCT/US2001/022213 WO2002006366A1 (en) 2000-07-19 2001-07-12 Low dielectric constant materials with polymeric networks

Publications (1)

Publication Number Publication Date
AU2001273464A1 true AU2001273464A1 (en) 2002-01-30

Family

ID=24481046

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273464A Abandoned AU2001273464A1 (en) 2000-07-19 2001-07-12 Low dielectric constant materials with polymeric networks

Country Status (8)

Country Link
US (2) US6423811B1 (en)
EP (1) EP1303550A4 (en)
JP (1) JP2004504424A (en)
KR (1) KR20030022291A (en)
CN (1) CN1455789A (en)
AU (1) AU2001273464A1 (en)
TW (1) TW553967B (en)
WO (1) WO2002006366A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks
US20020022708A1 (en) * 2000-07-19 2002-02-21 Honeywell International Inc. Compositions and methods for thermosetting molecules in organic compositions
US6783589B2 (en) * 2001-01-19 2004-08-31 Chevron U.S.A. Inc. Diamondoid-containing materials in microelectronics
US7141188B2 (en) * 2001-05-30 2006-11-28 Honeywell International Inc. Organic compositions
US6740685B2 (en) * 2001-05-30 2004-05-25 Honeywell International Inc. Organic compositions
WO2003057749A1 (en) * 2001-12-31 2003-07-17 Honeywell International Inc. Organic compositions
US20030143332A1 (en) * 2002-01-31 2003-07-31 Sumitomo Chemical Company, Limited Coating solution for forming insulating film
JP2003268101A (en) 2002-03-15 2003-09-25 Sumitomo Chem Co Ltd Polyether resin and method for producing the same
US7060204B2 (en) * 2002-04-29 2006-06-13 Honeywell International Inc. Organic compositions
TW200416131A (en) * 2002-06-03 2004-09-01 Honeywell Int Inc Layered components, materials, methods of production and uses thereof
US7368483B2 (en) * 2002-12-31 2008-05-06 International Business Machines Corporation Porous composition of matter, and method of making same
JP2004307828A (en) * 2003-03-27 2004-11-04 Sumitomo Chem Co Ltd Coating liquid for forming insulating film, method for manufacturing insulating film, and insulating film
JP2006104375A (en) * 2004-10-07 2006-04-20 Sumitomo Chemical Co Ltd Insulating film forming coating solution, insulating film manufacturing method, and insulating film
US7732496B1 (en) 2004-11-03 2010-06-08 Ohio Aerospace Institute Highly porous and mechanically strong ceramic oxide aerogels
US7531209B2 (en) * 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
US7432133B2 (en) * 2005-10-24 2008-10-07 Freescale Semiconductor, Inc. Plastic packaged device with die interface layer
WO2007143025A2 (en) * 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
US7919188B2 (en) 2006-05-31 2011-04-05 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
US7883742B2 (en) * 2006-05-31 2011-02-08 Roskilde Semiconductor Llc Porous materials derived from polymer composites
WO2007143028A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Low dielectric constant materials prepared from soluble fullerene clusters
US7811499B2 (en) * 2006-06-26 2010-10-12 International Business Machines Corporation Method for high density data storage and read-back
KR100819760B1 (en) 2006-11-06 2008-04-07 (주)파인켐 Tetrakisphenyl organic light emitting compound and organic light emitting device using the same
US20080159114A1 (en) 2007-01-02 2008-07-03 Dipietro Richard Anthony High density data storage medium, method and device
US7558186B2 (en) * 2007-01-02 2009-07-07 International Business Machines Corporation High density data storage medium, method and device
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US8314201B2 (en) 2007-11-30 2012-11-20 The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration Highly porous ceramic oxide aerogels having improved flexibility
US8258251B2 (en) * 2007-11-30 2012-09-04 The United States Of America, As Represented By The Administrator Of The National Aeronautics And Space Administration Highly porous ceramic oxide aerogels having improved flexibility
US8502401B2 (en) 2008-08-12 2013-08-06 Delsper LP Polymeric compositions comprising per(phenylethynyl) arene derivatives
CA2853977C (en) 2011-11-18 2016-05-24 Greene, Tweed & Co. Crosslinking compounds for high glass transition temperature polymers
CN102848642B (en) * 2012-09-11 2016-01-13 广东生益科技股份有限公司 Two layers of method double side flexible copper coated board and preparation method thereof
JP6361657B2 (en) * 2013-06-24 2018-07-25 Jsr株式会社 Film forming composition, resist underlayer film, method for forming the same, and pattern forming method
WO2019126214A1 (en) 2017-12-18 2019-06-27 Tris Pharma, Inc. Pharmaceutical composition comprising ghb gastro-retentive raft forming systems having trigger pulse drug release
CA3097737A1 (en) * 2017-12-18 2019-06-27 Tris Pharma, Inc. Pharmaceutical compositions comprising a floating interpenetrating polymer network forming system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2906282B2 (en) 1990-09-20 1999-06-14 富士通株式会社 Glass-ceramic green sheet, multilayer substrate, and manufacturing method thereof
JPH04314394A (en) 1991-04-12 1992-11-05 Fujitsu Ltd Glass ceramic circuit board and its manufacturing method
JP2531906B2 (en) 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション Foam polymer
US5177176A (en) 1991-10-29 1993-01-05 E. I. Du Pont De Nemours And Company Soluble pseudo rod-like polyimides having low coefficient of thermal expansion
US5629353A (en) 1995-05-22 1997-05-13 The Regents Of The University Of California Highly cross-linked nanoporous polymers
US5744399A (en) 1995-11-13 1998-04-28 Lsi Logic Corporation Process for forming low dielectric constant layers using fullerenes
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks
US6451712B1 (en) 2000-12-18 2002-09-17 International Business Machines Corporation Method for forming a porous dielectric material layer in a semiconductor device and device formed

Also Published As

Publication number Publication date
TW553967B (en) 2003-09-21
EP1303550A1 (en) 2003-04-23
CN1455789A (en) 2003-11-12
JP2004504424A (en) 2004-02-12
WO2002006366A1 (en) 2002-01-24
US20020037941A1 (en) 2002-03-28
US6713590B2 (en) 2004-03-30
EP1303550A4 (en) 2003-07-30
US6423811B1 (en) 2002-07-23
KR20030022291A (en) 2003-03-15

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