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AU2001268010A1 - Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors - Google Patents

Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors

Info

Publication number
AU2001268010A1
AU2001268010A1 AU2001268010A AU6801001A AU2001268010A1 AU 2001268010 A1 AU2001268010 A1 AU 2001268010A1 AU 2001268010 A AU2001268010 A AU 2001268010A AU 6801001 A AU6801001 A AU 6801001A AU 2001268010 A1 AU2001268010 A1 AU 2001268010A1
Authority
AU
Australia
Prior art keywords
correction
substrate
providing
viscous medium
errors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001268010A
Inventor
William Holm
Nils Jacobsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic AB
Original Assignee
MyData Automation AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MyData Automation AB filed Critical MyData Automation AB
Publication of AU2001268010A1 publication Critical patent/AU2001268010A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.
AU2001268010A 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors Abandoned AU2001268010A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0002618A SE518642C2 (en) 2000-07-11 2000-07-11 Method, device for providing a substrate with viscous medium, device for correcting application errors and the use of projecting means for correcting application errors
SE0002618 2000-07-11
PCT/SE2001/001566 WO2002005607A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors

Publications (1)

Publication Number Publication Date
AU2001268010A1 true AU2001268010A1 (en) 2002-01-21

Family

ID=20280454

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001268010A Abandoned AU2001268010A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors

Country Status (10)

Country Link
US (2) US7201802B2 (en)
EP (1) EP1308072B1 (en)
JP (1) JP4917236B2 (en)
KR (1) KR100796875B1 (en)
CN (1) CN1269389C (en)
AT (1) ATE488982T1 (en)
AU (1) AU2001268010A1 (en)
DE (1) DE60143485D1 (en)
SE (1) SE518642C2 (en)
WO (1) WO2002005607A1 (en)

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SE518640C2 (en) * 2000-07-11 2002-11-05 Mydata Automation Ab Method, apparatus for applying a viscous medium to a substrate, apparatus for applying additional viscous medium and the use of screen printing
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WO2007007865A1 (en) 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
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US8739699B2 (en) * 2010-12-08 2014-06-03 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
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US8746139B2 (en) 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8474377B2 (en) 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
EP2790473A1 (en) * 2013-04-09 2014-10-15 ASM Assembly Systems GmbH & Co. KG Optimizing parameters for printing solder paste onto a PCB
KR101508593B1 (en) 2013-12-03 2015-04-07 주식회사 고영테크놀러지 Solder rework method, solder rework apparatus using the same and board inspection method employing the same
JP2015109397A (en) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 Electronic component mounting method and electronic component mounting system
DE102014202170A1 (en) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Apparatus and method for printing on substrates
WO2015182877A1 (en) * 2014-05-30 2015-12-03 주식회사 파미 Three-dimensional measuring device with built-in dispenser
JP2017535066A (en) * 2014-09-09 2017-11-24 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ Method and apparatus for applying solder paste flux
US10576566B2 (en) * 2016-06-06 2020-03-03 International Business Machines Corporation Solder paste misprint cleaning
US11794466B2 (en) * 2019-04-26 2023-10-24 Fuji Corporation Printing parameter acquisition device and printing parameter acquisition method
JP7467176B2 (en) * 2020-03-16 2024-04-15 日本発條株式会社 Adhesive application method and application device
GB2615602A (en) * 2022-02-15 2023-08-16 Asmpt Gmbh Co Kg Automated reprinting of workpieces
CN116804611B (en) * 2023-08-22 2024-01-26 宁德时代新能源科技股份有限公司 Automatic evaluation method and system for testing equipment

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Also Published As

Publication number Publication date
SE0002618D0 (en) 2000-07-11
US20020014602A1 (en) 2002-02-07
SE518642C2 (en) 2002-11-05
EP1308072A1 (en) 2003-05-07
US7931933B2 (en) 2011-04-26
KR100796875B1 (en) 2008-01-22
ATE488982T1 (en) 2010-12-15
EP1308072B1 (en) 2010-11-17
US7201802B2 (en) 2007-04-10
JP4917236B2 (en) 2012-04-18
JP2004502538A (en) 2004-01-29
DE60143485D1 (en) 2010-12-30
WO2002005607A1 (en) 2002-01-17
CN1269389C (en) 2006-08-09
US20060275538A1 (en) 2006-12-07
SE0002618L (en) 2002-03-06
KR20030016389A (en) 2003-02-26
CN1442030A (en) 2003-09-10

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