AU2001265371A1 - Silicone coatings containing silicone mist suppressant compositions - Google Patents
Silicone coatings containing silicone mist suppressant compositionsInfo
- Publication number
- AU2001265371A1 AU2001265371A1 AU2001265371A AU2001265371A AU2001265371A1 AU 2001265371 A1 AU2001265371 A1 AU 2001265371A1 AU 2001265371 A AU2001265371 A AU 2001265371A AU 2001265371 A AU2001265371 A AU 2001265371A AU 2001265371 A1 AU2001265371 A1 AU 2001265371A1
- Authority
- AU
- Australia
- Prior art keywords
- silicon
- component
- bonded
- alkenyl groups
- hydrogen atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title description 78
- 229920001296 polysiloxane Polymers 0.000 title description 50
- 239000003595 mist Substances 0.000 title description 48
- 239000004447 silicone coating Substances 0.000 title description 35
- -1 hydrocarbon radicals Chemical class 0.000 description 105
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 61
- 150000001875 compounds Chemical class 0.000 description 37
- 238000000576 coating method Methods 0.000 description 33
- 229920001577 copolymer Polymers 0.000 description 33
- 239000003054 catalyst Substances 0.000 description 32
- 239000011248 coating agent Substances 0.000 description 28
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 28
- 229920000642 polymer Polymers 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 239000003112 inhibitor Substances 0.000 description 22
- 125000003342 alkenyl group Chemical group 0.000 description 20
- 239000002245 particle Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- 238000006116 polymerization reaction Methods 0.000 description 18
- 125000005520 diaryliodonium group Chemical group 0.000 description 17
- 125000005409 triarylsulfonium group Chemical class 0.000 description 17
- 229910052697 platinum Inorganic materials 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 150000003961 organosilicon compounds Chemical class 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 239000004615 ingredient Substances 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 8
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 239000004655 radiation curable silicone release coating Substances 0.000 description 7
- 125000006043 5-hexenyl group Chemical group 0.000 description 6
- 239000004606 Fillers/Extenders Substances 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000443 aerosol Substances 0.000 description 4
- 125000005620 boronic acid group Chemical class 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000499 gel Substances 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000003380 quartz crystal microbalance Methods 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical group OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229960004592 isopropanol Drugs 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229960000834 vinyl ether Drugs 0.000 description 3
- GKNWQHIXXANPTN-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethanesulfonic acid Chemical class OS(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- DKFHWNGVMWFBJE-UHFFFAOYSA-N 1-ethynylcyclohexene Chemical compound C#CC1=CCCCC1 DKFHWNGVMWFBJE-UHFFFAOYSA-N 0.000 description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical class CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 2
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 2
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 2
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 2
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 2
- KYOGSVAQRNIVQL-UHFFFAOYSA-N 3-methylhex-3-en-1-yne Chemical compound CCC=C(C)C#C KYOGSVAQRNIVQL-UHFFFAOYSA-N 0.000 description 2
- LAKYCCVWZNCNIO-UHFFFAOYSA-N 3-methylidenepent-1-yne Chemical compound CCC(=C)C#C LAKYCCVWZNCNIO-UHFFFAOYSA-N 0.000 description 2
- GRGVQLWQXHFRHO-UHFFFAOYSA-N 3-methylpent-3-en-1-yne Chemical compound CC=C(C)C#C GRGVQLWQXHFRHO-UHFFFAOYSA-N 0.000 description 2
- XJBGJIHHXFXOFJ-UHFFFAOYSA-N 5-methyl-3-methylidenehex-1-yne Chemical compound CC(C)CC(=C)C#C XJBGJIHHXFXOFJ-UHFFFAOYSA-N 0.000 description 2
- ONMOULMPIIOVTQ-UHFFFAOYSA-N 98-47-5 Chemical class OS(=O)(=O)C1=CC=CC([N+]([O-])=O)=C1 ONMOULMPIIOVTQ-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical class OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 229910004219 SiNi Inorganic materials 0.000 description 2
- 229910020485 SiO4/2 Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical class OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GVTGUOINIMHIRT-WAYWQWQTSA-N bis(1-methoxypropan-2-yl) (z)-but-2-enedioate Chemical compound COCC(C)OC(=O)\C=C/C(=O)OC(C)COC GVTGUOINIMHIRT-WAYWQWQTSA-N 0.000 description 2
- BGFNTZUTTUOBSW-FPLPWBNLSA-N bis(2-methoxypropan-2-yl) (z)-but-2-enedioate Chemical compound COC(C)(C)OC(=O)\C=C/C(=O)OC(C)(C)OC BGFNTZUTTUOBSW-FPLPWBNLSA-N 0.000 description 2
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 2
- 235000008429 bread Nutrition 0.000 description 2
- RSLWZZXJRRZAOD-UHFFFAOYSA-N but-1-en-3-yn-2-ylbenzene Chemical compound C#CC(=C)C1=CC=CC=C1 RSLWZZXJRRZAOD-UHFFFAOYSA-N 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 2
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 2
- RWGWWFFEIPJXAN-UHFFFAOYSA-N dimethyl-bis(3-methylbut-1-ynoxy)silane Chemical compound CC(C)C#CO[Si](C)(C)OC#CC(C)C RWGWWFFEIPJXAN-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 150000004687 hexahydrates Chemical group 0.000 description 2
- 150000002432 hydroperoxides Chemical class 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical class OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 2
- YFSUTJLHUFNCNZ-UHFFFAOYSA-N perfluorooctane-1-sulfonic acid Chemical class OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-N 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 150000003138 primary alcohols Chemical class 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 150000003333 secondary alcohols Chemical class 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical class CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical class OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 2
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 2
- 150000004072 triols Chemical class 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- WAPNOHKVXSQRPX-UHFFFAOYSA-N 1-phenylethanol Chemical compound CC(O)C1=CC=CC=C1 WAPNOHKVXSQRPX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- XPNGNIFUDRPBFJ-UHFFFAOYSA-N alpha-methylbenzylalcohol Natural products CC1=CC=CC=C1CO XPNGNIFUDRPBFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000035559 beat frequency Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- JSAYQGVHWNBMNG-UHFFFAOYSA-N bis(2-methylbut-3-yn-2-yloxy)-prop-1-enylsilane Chemical compound CC=C[SiH](OC(C#C)(C)C)OC(C#C)(C)C JSAYQGVHWNBMNG-UHFFFAOYSA-N 0.000 description 1
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- TXPNNKBJENPPPI-UHFFFAOYSA-N ethenyl-methyl-bis(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C=C)OC(C)(C)C#C TXPNNKBJENPPPI-UHFFFAOYSA-N 0.000 description 1
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Description
Coatings Containing Silicone Mist Suppressant Compositions
During the process of coating silicone on to paper for release coating applications, the formation of silicone mist (i.e. aerosol) is undesirable. Small mist particles, on the order of 1 to 10 microns are considered to be capable of being inhaled and can be deposited deep within the lungs. Silicone mist can also cause hygiene problems by coating everything in the vicinity of the coating head with a layer of silicone.
Solventless silicone coatings have been disclosed in the art. For example, Chung et al. in U.S. Patent No. 5,036,117 discloses a curable composition comprising (A) an organosilicon compound having an average of at least two curing radicals per molecule thereof selected from the group consisting of the hydroxy radical and olefinic hydrocarbon radicals, (B) an organohydrogensilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule thereof, the amounts of Components (A) and (B) being sufficient to provide a ratio of the number of silicon-bonded hydrogen atoms to the number of silicon-bonded curing radicals of from 1/100 to 100/1, (C) a platinum group metal-containing catalyst in sufficient amount to accelerate a curing reaction among said silicon-bonded curing radicals and said silicon-bonded hydrogen atoms, (D) an inhibitor compound for said accelerated curing reaction in a total amount sufficient to retard the curing reaction at room temperature but insufficient to prevent said reaction at elevated temperature, and (E) a bath life extender compound in a total amount sufficient to further retard the curing reaction at room temperature.
Jones et al. in U.S. Patent No. 5,125,998 discloses a process comprising the steps of (I) first mixing (A) an inhibitor compound and (B) a platinum group metal-containing catalyst, (II) thereafter adding the mixture of (I) to (C) an organosilicon compound having an average of at least two curing radicals per molecule thereof selected from the group consisting of the hydroxy radical and olefinic hydrocarbon radicals, (III) thereafter adding to the mixture of (II) (D) an organohydrogensilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule thereof, the amounts of components (C) and (D) being sufficient to provide a ratio of the number of silicon-bonded hydrogen atoms to the number of silicon-bonded curing radicals of from 1/100 to 100/1; (IN) applying the mixture from (III) to a solid substrate to form a coating; (V) exposing the coating to an energy source selected from the group consisting of (i) heat, and
(ii) actinic radiation in an amount sufficient to cure the coating; whereby the amount of component (A) present in the total composition of components (A), (B), (C), and (D), is
sufficient to retard any curing reaction at room temperature but insufficient to prevent any reaction at elevated temperatures; and whereby the amount of component (B) is sufficient to accelerate any curing reaction among the silicon-bonded curing radicals and the silicon-bonded hydrogen atoms at elevated temperatures. Thayer et al. in U.S. Patent No. 5,281 ,656 discloses coating compositions comprising (A) an alkenyldiorganosiloxy-terminated polydiorganosiloxane, (B) an alkenyldiorganosiloxy- terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymer, (C) a hydrogendiorganosiloxy-terminated polydiorganosiloxane, (D) a platinum-containing catalyst, and (D) an inhibitor. Thayer et al. further discloses the amounts of Components (A), (B) and (C) that are used in the compositions, expressed in terms of the ratio of the number of silicon-bonded hydrogen atoms of Component (C) to the number of silicon-bonded alkenyl radicals of Components (A) and (B), are sufficient to provide a value of from 1/2 to 20/1 for said ratio and, preferably, from 1/2 to 2/1, and even more preferably, about 1/1.
Silicone compositions which are useful in suppressing silicone mist have also been described in the art. For example, Chung et al. in U.S. Patent No. 5,625,023 discloses silicone mist suppressant compositions prepared by reacting an organosilicon compound, an oxyalkylene containing compound, and a catalyst. Chung et al. further discloses that these compositions, when added to silicone coatings, reduce the amount of silicone mist in high speed coating processes. These silicone mist suppressant compositions were only partially compatible with silicone and produced a cloudy mixture when added to coating formulations. This partial incompatibility was believed to be critical to the mist-suppression performance of these materials. However, the use of these suppressant also introduced new issues with the coverage and anchorage of the silicone release coating.
This invention relates to silicone coating composition comprising a solventless silicone coating composition and a liquid silicone mist suppressant composition obtained by a method comprising reacting at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups with a large excess of at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups in the presence of a platinum group metal-containing catalyst. This invention also relates to a method of reducing mist in a solventless silicone coating which comprises adding to a solventless silicone coating a liquid silicone mist suppressant composition obtained by a method comprising reacting at least one organohydrogensilicon
compound containing at least two silicon-bonded hydrogen groups with a large excess of at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups in the presence of a platinum group metal-containing catalyst.
This invention also relates to the use of the silicone suppressant compositions in processes for preparing a laminate of a substrate and an adhesive wherein the adhesive will release from the substrate.
It is an object of this invention to provide a silicone composition which is capable of mist suppression in silicone coatings employed in high speed coating processes.
In a first embodiment, this invention relates to a silicone coating composition comprising (A) a solventless silicone coating composition and (B) a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (mPa.s) (1 millipascal-second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1 :4.6. Component (A), the solventless silicone coating can be any of the well-known solventless hydrosilylation reaction based compositions known in the art. These solventless silicone coating compositions typically comprise (i) an organosilicon compound containing at least two silicon- bonded alkenyl groups per molecule, (ii) an organohydrogensilicon compound containing at least two silicon-bonded hydrogen atoms per molecule, (iii) a platinum group metal-containing catalyst, and (iv) an inhibitor.
The alkenyl groups of Component (i) are exemplified by vinyl, allyl, 3-butenyl, 4-pentenyl, 5-hexenyl, 6-heptenyl, 7-octenyl, 8-nonenyl, 9-decenyl, 10-undecenyl, 4,7-octadienyl, 5,8-nonadienyl, 5,9-decadienyl, 6,11-dodecadienyl and 4,8-nonadienyl.
Component (i) is exemplified by triorganosiloxy-terminated polydiorganosiloxane- polyorganoalkenylsiloxane copolymers, alkenyldiorganosiloxy-terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, triorganosiloxy-terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, alkenyldiorganosiloxy-terminated
polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, triorganosiloxy-terminated polyorganoalkenylsiloxane polymers, and alkenyldiorganosiloxy-terminated polydiorganosiloxane polymers, each having a degree of polymerization of from 20 to 500, preferably from 50 to 300 and a viscosity at 25°C of from 50 to 2,000 millipascal-seconds, and preferably from 80 to 1,000 millipascal-seconds. The organo substituent is exemplified by a monovalent hydrocarbon group having from 1 to 20 carbon atoms exemplified by alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, octyl, and decyl, cycloaliphatic groups such as cyclohexyl, aryl groups such as phenyl, tolyl, and xylyl, and aralkyl groups such as benzyl and phenylethyl. It is preferred that the organo substituent is methyl. The several organo substituents can be identical or different, as desired. The alkenyl substituent is exemplified by vinyl, allyl, 3- butenyl, 4-pentenyl, 5-hexenyl, cyclohexenyl, 6-heptenyl, 7-octenyl, 8-nonenyl, 9-decenyl, 10- undecenyl, 4,7-octadienyl, 5,8-nonadienyl, 5,9-decadienyl, 6,11-dodecadienyl, and 4,8- nonadienyl, with vinyl and 5-hexenyl being preferred.
Component (i) is preferably selected from trimethylsiloxy-terminated polydimethylsiloxane-polymethylvinylsiloxane copolymers, vinyldimethylsiloxy-terminated polydimethylsiloxane-polymemylvinylsiloxane copolymers, trimethylsiloxy-terminated polydimethylsiloxane-polymethylhexenylsiloxane copolymers, hexenyldimethylsiloxy- terminated polydimethylsiloxane-polymethylhexenylsiloxane copolymers, trimethylsiloxy- terminated polymethylvinylsiloxane polymers, trimethylsiloxy-terminated polymethylhexenylsiloxane polymers, vinyldimethylsiloxy-terminated polydimethylsiloxane polymers, or hexenyldimethylsiloxy- terminated polydimethylsiloxane polymers, each having a degree of polymerization of from 50 to 300 and a viscosity at 25°C of from 80 to 1,000 millipascal-seconds. Component (i) can also be a combination of two or more of the above described alkenyl siloxanes. The organohydrogensilicon compound of Component (ii) is preferably free of aliphatic unsaturation and contains two, three, or more silicon atoms linked by divalent radicals, an average of from one to two silicon-bonded monovalent radicals per silicon atom and an average of at least two or more silicon-bonded hydrogen atoms per compound. The organohydrogensilicon compound is preferably an organohydrogensiloxane containing an average of three or more silicon-bonded hydrogen atoms such as, for example, 5, 10, 20, 40, 70, 100, and more. The organohydrogensiloxane compounds suitable as Component (ii) can be linear, branched, cyclic, resins, and combinations thereof.
Component (ii) is exemplified by diorganohydrogensiloxy-terminated polyorganohydrogensiloxane polymers, diorganohydrogensiloxy-terminated polydiorganosiloxane-polyorganohydrogensiloxane copolymers, triorganosiloxy-terminated polydiorganosiloxane-polyorganohydrogensiloxane copolymers, triorganosiloxy-terminated polyorganohydrogensiloxane polymers, each having a degree of polymerization of from 2 to 1,000, and preferably from 5 to 100 and a viscosity at 25°C of from 1 to 10,000 millipascal- seconds, and preferably from 5 to 100 millipascal-seconds. The organo substituent on these siloxanes is exemplified by a monovalent hydrocarbon group having from 1 to 20 carbon atoms exemplified by alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, octyl, and decyl, cycloaliphatic groups such as cyclohexyl, aryl groups such as phenyl, tolyl, and xylyl, and aralkyl groups such as benzyl and phenylethyl. It is preferred that the organo substituent is methyl. The several organo substituents can be identical or different, as desired.
Thus Component (ii) is preferably selected from dimethylhydrogensiloxy-terminated polymethylhydrogensiloxane polymers, dimethylhydrogensiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymers, trimethylsiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymers, or trimethylsiloxy-terminated polymethylhydrogensiloxane polymers, each having a degree of polymerization of from 5 to 100 and a viscosity at 25°C of from 5 to 100 millipascal-seconds. Component (ii) can also be a combination of two or more of the above described organohydrogensiloxanes. The amount of Components (i) and (ii) that is used in the compositions of this invention, expressed in terms of the ratio of the number of silicon-bonded hydrogen atoms of Component (ii) to the number of silicon-bonded alkenyl groups of Component (i), should be sufficient to provide a ratio of from 0.5:1 to 4.5:1, preferably a ratio of from 0.5:1 to 3:1.
Component (iii) can be can be any platinum group metal-containing catalyst component. By platinum group it is meant herein ruthenium, rhodium, palladium, osmium, iridium and platinum and complexes thereof. Preferably Component (iii) is a platinum-containing catalyst. The platinum-containing catalyst can be platinum metal, platinum metal deposited on a carrier such as silica gel or powdered charcoal, or a compound or complex of a platinum group metal. Preferred platinum-containing catalysts include chloroplatinic acid, either in hexahydrate form or anhydrous form, and or a platinum-containing catalyst which is obtained by a method comprising reacting chloroplatinic acid with an aliphatically unsaturated organosilicon compound such as divinyltetramethyldisiloxane. Component (iii) is present in an amount
sufficient to provide at least-10 weight parts, preferably 30 to 500 weight parts of platinum for every one million weight parts of Components (i)+(ii), and it is highly preferred that it is present in an amount sufficient to provide 30 to 250 weight parts of platinum for every one million parts by weight of Components (i)+(ii). Component (iv), the inhibitor, can be any material that is known to be, or can be, used to inhibit the catalytic activity of platinum group metal-containing catalysts. By the term "inhibitor" it is meant herein a material that retards the room temperature curing of a mixture of Components (i), (ii), and (iii), and any optional components without preventing the elevated curing of the mixture. Examples of suitable inhibitors include ethylenically or aromatically unsaturated amides, acetylenic compounds, silylated acetylenic compounds, ethylenically unsaturated isocyanates, olefinic siloxanes, unsaturated hydrocarbon diesters, conjugated ene- ynes, hydroperoxides, nitriles, and diaziridines.
Preferred inhibitors are exemplified by acetylenic alcohols exemplified by 1-ethynyl-l-cyclohexanol, 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 2-ethynyl-isopropanol, 2-ethynyl-butane-2-ol, and 3,5-dimethyl-l-hexyn-3-ol, silylated acetylenic alcohols exemplified by trimethyl(3,5-dimethyl-l-hexyn-3-oxy)silane, dimethyl-bis- (3 -methyl- l-butyn-oxy)silane, methylvinylbis(3-methyl-l-butyn-3-oxy)silane, and ((1,1- dimethyl-2-propynyl)oxy)trimethylsilane, unsaturated carboxylic esters exemplified by diallyl maleate, dimethyl maleate, diethyl fumarate, diallyl fumarate, and bis-(methoxyisopropyl) maleate, conjugated ene-ynes exemplified by 2-isobutyl-l-butene-3-yne, 3,5-dimethyl-3-hexene- 1-yne, 3-methyl-3-pentene-l-yne, 3-methyl-3-hexene-l-yne, 1-ethynylcyclohexene, 3-ethyl-3-butene-l-yne, and 3-phenyl-3-butene-l-yne, vinylcyclosiloxanes such as l,3,5,7-tetramethyl-l,3,5,7-tetravinylcyclotetrasiloxane, and a mixture of a conjugated ene-yne as described above and a vinylcyclosiloxane as described above.
The amount of inhibitor to be used in the solventless silicone coatings of this invention is not critical. It is preferred that from 0.1 to 10 parts by weight of inhibitor be used per 100 parts by weight of components (i)+(ii).
The solventless silicone coating compositions can further comprise (v) a bath life extender compound in a total amount sufficient to further retard the curing reaction at room temperature. Examples of suitable bath life extender compounds include compounds which contain one or more primary or secondary alcohol groups, carboxylic acids (including
compounds which yield carboxylic acids when exposed to water at room temperature), cyclic ethers, and water. Included in this group are the primary and secondary alcohols; diols and triols, such as ethylene glycol, propylene glycol and glycerine; partial ethers of diols and triols, such as 2- methoxyethanol, 2-methoxypropanol, and 2-methoxyisopropanol; tetrahydrofuran; water and 5 aqueous solutions of mineral acids, alkalis, and salts. Primary and secondary alcohols, preferably having fewer than 10 carbon atoms are the most preferred for the compositions of this invention. Examples thereof include methanol, 1-butanol, 2-butanol, tetradecanol and other alkanols, such as ethanol, and normal-, and iso-propanol, iso-butanol, and the normal-, secondary-, and iso- pentanols, -hexanols, -heptanols, and -octanols; benzyl alcohol, phenol, and other aromatic
10 alcohols such as methylphenyl carbinol, and 2-phenylethyl alcohol; allyl alcohol, and cyclohexanol. It is highly preferred that the bath life extender is benzyl alcohol or water.
The amount of bath life extender (v) that is to be used can be as high as 10 parts or more by weight. Preferably, the amount of bath life extender to be used falls within the range of 0.01 to 5 parts, and most preferably 0.01 to 1 part by weight, per 100 weight parts of Components
15 (i)+(ii).
The solventless silicone coating compositions of Component (A) can further comprise (vi) a release additive. Any of the well-known release additives in the art may be employed. The release additive is preferably a siloxane resin consisting essentially of RSiOι/2 units and SiO4/2 units wherein R is independently an alkenyl group as delineated hereinabove or an organo
20 substituent and wherein the molar ratio of RSiOι/2 units to SiO4/2 is from 0.6:1 to 4:1, preferably from 0.6:1 to 1.9:1, and most preferably from 1.2:1 to 1.6:1. The organo substituent on the siloxane resin is exemplified by a monovalent hydrocarbon group having from 1 to 20 carbon atoms exemplified by alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, octyl, and decyl, cycloaliphatic groups such as cyclohexyl, aryl groups such as phenyl, tolyl, and xylyl, and aralkyl
25 groups such as benzyl and phenylethyl. It is preferred that the organo substituent is methyl. The several organo substituents can be identical or different, as desired. The siloxane resin can further be diluted with an organoalkenylsiloxane such as those described above (for example, vinyl or hexenyl containing polydiorganosiloxane polymers or copolymers. The high release additive preferably comprises 40 to 70 weight parts of the vinyl functional MQ resin and 30 to
30 60 weight parts of the organoalkenylsiloxane polymer. From 1 to 99 weight parts of the high release additive may be employed in the solventless silicone release coating (A) of this
invention, and preferably 1 to 10 weight parts of high release additive is employed, per 100 weight parts of Components (i)+(ii).
The solventless silicone coating composition (A) can further comprise any optional components commonly used in platinum group metal catalyzed organosilicon compositions, such as reinforcing and extending fillers, hydrocarbons and halohydrocarbons free of aliphatic unsaturation, colorants, stabilizers, adhesion modifiers, and adhesive-release modifiers.
Components (i)-(iv), and any optional components can be mixed together using any suitable mixing means, such as a spatula, a drum roller, a mechanical stirrer, a three roll mill, a sigma blade mixer, a bread dough mixer, and a two roll mill. The solventless silicone release coating of Component (A) can be prepared by homogeneously mixing Components (i), (ii), (iii), (iv), and any optional components in any order. The order of mixing Components (i)-(iv) and any optional components is not critical however it is preferred that Component (iii), the platinum group metal-containing catalyst, be brought together in the presence of Components (i), (ii), (iv), and any optional components. It is highly preferred to mix Components (i), (ii), (iv), and any optional components in a preliminary mixing step followed by addition of catalyst (iii).
Components (i)-(iv) and any optional components can be mixed at room temperature (20-25°C) or can be heated to temperatures above room temperature such as at temperatures of up to 200°C, however it is preferred that if ingredients (i)-(iv) and any optional components are heated, they are heated to a temperature of from 50°C to 120°C. Component (A) can also be any of the radiation curable silicone coating compositions known in the art such as UN (ultraviolet) or EB (electron beam) curable silicone coatings. These radiation curable silicone coating composition generally comprise (i) an organosilicon compound having at least two groups selected from epoxy groups, vinyl ether groups, acrylamide groups, or acrylate groups; and (ii) an initiator. Preferably the organosilicon compound (i) is selected from the group consisting of epoxy-containing polyorganosiloxanes and epoxy-containing organopolysiloxanes .
The vinylether-containing organopolysiloxanes are exemplified by trimethylsiloxy- terminated polydimethylsiloxane-polymethylvinylethersiloxane copolymers, vinyletherdimethylsiloxy-terminated polydimethylsiloxane-polymethylvinylethersiloxane copolymers, trimethylsiloxy-terminated polymethylvinylethersiloxane polymers, and vinyletherdimethylsiloxy-terminated polydimethylsiloxane polymers wherein the vinylether group is selected from the group consisting of -Q(OQ)cOCH=CH2 and
-QSi(OQOCH=CH2)3.mRm wherein Q is an alkylene group, C has a value of 0 to 10, m has a value of 0 to 2, and R is a monovalent hydrocarbon group and wherein the vinylether-containing organopolysiloxane has a degree of polymerization of from 3 to 700, and preferably from 5 to 300 and a viscosity at 25°C of from 5 to 25,000 millipascal-seconds, and preferably from 5 to 5 1,500 millipascal-seconds. Component (i) in the radiation curable silicone coating can also be a combination of two or more of the above-described vinylether-containing organopolysiloxanes. In the above formula, Q is independently an alkylene group exemplified by methylene, ethylene, propylene, butylene, phenylene, trimethylene, 2-methyltrimethylene, pentamethylene, hexamethylene, 3-ethylhexamethylene, octamethylene, decamethylene, dodecamethylene,
10 tetradecamethylene, and octadecamethylene, cyclohexylene, phenylene, and benzylene, and R is exemplified by alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, octyl, and decyl, cycloaliphatic groups such as cyclohexyl, aryl groups such as phenyl, tolyl, and xylyl, and aralkyl groups such as benzyl and phenylethyl. Preferably c and m have a value of 0.
The epoxy-containing organopolysiloxane can be any organopolysiloxane which contains
15 at least two epoxy groups. The epoxy-containing organopolysiloxanes are exemplified by trimethylsiloxy-terminated polydimethylsiloxane-polymethylepoxysiloxane copolymers, epoxydimethylsiloxy-terminated polydimethylsiloxane-polymethylepoxysiloxane copolymers, trimethylsiloxy-terminated polymethylepoxysiloxane polymers, and epoxydimethylsiloxy- terminated polydimethylsiloxane polymers wherein the epoxy group is exemplified by 1,2-
20 epoxyethyl, 2,3-epoxypropyl, 3,4-epoxybutyl, 5,6-epoxyhexyl, 9,10-epoxydecyl, glycidoxymethyl, alpha-glycidoxyethyl, beta-glycidoxyethyl, alpha-glycidoxypropyl, beta- glycidoxypropyl, gamma-glycidoxypropyl, 2-(3,4-epoxycyclohexyl)ethyl, 3 -(3 ,4- epoxycyclohexyl)propyl, and 3,4-epoxycyclohexylbutyl wherein the epoxy-containing organopolysiloxane has a degree of polymerization of from 3 to
25 700, and preferably from 5 to 300 and a viscosity at 25°C of from 5 to 25,000 millipascal- seconds, and preferably from 5 to 1,500 millipascal-seconds. Component (i) in the radiation curable silicone coating can also be a combination of two or more of the above-described epoxy- containing organopolysiloxanes.
It is preferred that from 95 to 99.5 weight percent of the radiation curable organosilicon
30 compound (i) be used in the radiation curable coating compositions of the invention, and it is highly preferred that from 97 to 99 weight percent of this compound be employed, said weight percent being based on the total weight of the radiation curable silicone coating composition.
Compounds suitable as the initiator (ii) include photoinitiators and sensitizers. Sensitizers have been described in great detail in the art in numerous publications and include materials such as the well-known material benzophenone. The photoinitiators are exemplified by onium salts, diaryliodonium salts of sulfonic acids, triarylsulfonium salts of sulfonic acids, diaryliodonium salts of boronic acids, and triarylsulfonium salts of boronic acids.
Preferred onium salts are bis-diaryl iodonium salts such as bis(dodecyl phenyl) iodonium hexafluoroarsenate and bis(dodecylphenyl) iodonium hexafluoroantimonate, and dialkylphenyl iodonium hexafluoroantimonate.
Preferred diaryliodonium salts of sulfonic acid are selected from diaryliodonium salts of perfluoroalkylsulfonic acids and diaryliodonium salts of aryl sulfonic acids. Preferred diaryliodonium salts of perfluoroalkylsulfonic acids include diaryliodonium salts of perfluorobutanesulfonic acid, diaryliodonium salts of perfluoroethanesulfonic acid, diaryliodonium salts of perfluoro-octanesulfonic acid, and diaryliodonium salts of trifluoromethane sulfonic acid. Preferred diaryliodonium salts of aryl sulfonic acids include diaryliodonium salts of para-toluene sulfonic acid, diaryliodonium salts of dodecylbenzene sulfonic acid, diaryliodonium salts of benzene sulfonic acid, and diaryliodonium salts of 3- nitrobenzene sulfonic acid.
Preferred triarylsulfonium salts of sulfonic acid are selected from triarylsulfonium salts of perfluoroalkylsulfonic acids or triarylsulfonium salts of aryl sulfonic acids. Preferred triarylsulfonium salts of perfluoroalkylsulfonic acids include triarylsulfonium salts of perfluorobutanesulfonic acid, triarylsulfonium salts of perfluoroethanesulfonic acid, triarylsulfonium salts of perfluoro-octanesulfonic acid, and triarylsulfonium salts of trifluoromethane sulfonic acid. Preferred triarylsulfonium salts of aryl sulfonic acids include triarylsulfonium salts of para-toluene sulfonic acid, triarylsulfonium salts of dodecylbenzene sulfonic acid, triarylsulfonium salts of benzene sulfonic acid, and triarylsulfonium salts of 3- nitrobenzene sulfonic acid.
Preferred diaryliodonium salts of boronic acids include diaryliodonium salts of perhaloarylboronic acids and preferred triarylsulfonium salts of boronic acids are the triarylsulfonium salts of perhaloarylboronic acid. The initiators (ii) may be present in any proportions which effect curing in the compositions of this invention. Preferably the amount of initiator is from 0.1 to 10 weight percent based on the total weight of the composition, and it is highly preferred to use between 1
and 5 weight percent based on the total weight of the radiation curable silicone coating composition.
The radiation curable silicone coatings can further contain optional ingredients such as photosensitizers, fillers, high release additives, reactive diluents such as organic vinyl ethers, photochromic materials, dyes, colorants, preservatives, fragrances, and other radiation curable compounds may be included in the composition. Preferably no more than 25 parts by weight of the composition is occupied by optional ingredients.
Component (B) is a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (1 millipascal second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon- bonded alkenyl groups of Component (b) is less than or equal to 1 :4.6.
The organohydrogensilicon compound (a) is preferably free of aliphatic unsaturation and contains two or more silicon atoms linked by divalent radicals, an average of from one to two silicon-bonded monovalent radicals per silicon atom and an average of at least three or more silicon-bonded hydrogen atoms per compound. The organohydrogensilicon compound is preferably an organohydrogensiloxane containing an average of three or more silicon-bonded hydrogen atoms such as, for example, 5, 10, 20, 40, 70, 100, and more. The organohydrogensiloxane compounds suitable as Component (a) can be linear, branched, cyclic, resins, and combinations thereof. Component (a) is exemplified by diorganohydrogensiloxy-terminated polyorganohydrogensiloxane polymers, diorganohydrogensiloxy-terminated polydiorganosiloxane-polyorganohydrogensiloxane copolymers, triorganosiloxy-terminated polydiorganosiloxane-polyorganohydrogensiloxane copolymers, triorganosiloxy-terminated polyorganohydrogensiloxane polymers, and diorganohydrogensiloxy-terminated polydiorganosiloxane polymers, each having a degree of polymerization of from 2 to 10,000, preferably from 2 to 1,000 and a viscosity at 25°C of from 0.5 to 500,000 millipascal-seconds, and preferably from 0.5 to 10,000 millipascal-seconds. The organo substituent on these
siloxanes is exemplified by a monovalent hydrocarbon group having from 1 to 20 carbon atoms exemplified by alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, octyl, and decyl, cycloaliphatic groups such as cyclohexyl, aryl groups such as phenyl, tolyl, and xylyl, and aralkyl groups such as benzyl and phenylethyl. It is preferred that the organo substituent is methyl. The several organo substituents can be identical or different, as desired.
Component (a) can also be dimethylhydrogensiloxy-terminated polymethylhydrogensiloxane-polymethyl(organo)siloxane copolymers, dimethylhydrogensiloxy- terminated polydimethylsiloxane-polymethylhydrogensiloxane-polymethyl(organo)siloxane terpolymers, trimethylsiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane- polymethyl(organo)siloxane terpolymers, trimethylsiloxy-terminated polymethylhydrogensiloxane-polymethyl(organo)siloxane copolymers and dimethylhydrogensiloxy-terminated polymethyl(organo)siloxane copolymers, each having a degree of polymerization of from 2 to 10,000, preferably from 2 to 1,000 and a viscosity at 25°C of from 0.5 to 500,000 millipascal-seconds, and preferably from 0.5 to 10,000 millipascal- seconds. The "organo" substituent on these siloxanes are exemplified by alkylaryl groups, polyoxyalkylene groups, epoxy groups, vinyl ether groups, acrylamide compounds, acrylate compounds, isocyanate compounds, and alkyl groups having from 2 to 40 carbon atoms. The alkylaryl groups are exemplified by styryl and alpha-methyl styryl. The polyoxyalkylene groups exemplified by polyoxyethylene groups, polyoxypropylene groups, polyoxyethylene- polyoxypropylene groups and polyoxyethylene-polyoxybutylene groups. The alkyl groups are exemplified by ethyl, propyl, butyl, pentyl, hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, -C20H41, -C22H45, -C24H49, -C26H53, -C28H57, -C30H61, -C32H65, -C34H69, -
C36H73> "C38H77> a^d - 40H81-
However, Component (a) is preferably selected from dimethylhydrogensiloxy-terminated polydimethylsiloxane polymers, dimethylhydrogensiloxy-terminated polymethylhydrogensiloxane polymers, dimethylhydrogensiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymers, trimethylsiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymers, or trimethylsiloxy-terminated polymethylhydrogensiloxane polymers, each having a degree of polymerization of from 2 to 1,000 and a viscosity at 25°C of from 0.5 to 10,000 millipascal-seconds. Component (a) can also be a combination of two or more of the above described organohydrogensiloxanes.
The alkenyl groups of Component (b) are exemplified by vinyl, allyl, 3-butenyl,
4-pentenyl, 5-hexenyl, 6-heptenyl, 7-octenyl, 8-nonenyl, 9-decenyl, 10-undecenyl, 4J-octadienyl, 5,8-nonadienyl, 5,9-decadienyl, 6,11-dodecadienyl and 4,8-nonadienyl.
Component (b) is an organoalkenylsiloxane which is exemplified by triorganosiloxy- terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, alkenyldiorganosiloxy-terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, triorganosiloxy-terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, alkenyldiorganosiloxy-terminated polydiorganosiloxane-polyorganoalkenylsiloxane copolymers, and triorganosiloxy-terminated polyorganoalkenylsiloxane polymers, each having a degree of polymerization of from 3 to 300, preferably 3 to 100, and a viscosity at 25 °C of from 1 to 1,000 millipascal-seconds, and preferably from 1 to 200 millipascal-seconds. The organo substituent is as defined above including preferred embodiments thereof. The alkenyl substituent is exemplified by vinyl, allyl, 3-butenyl, 4-pentenyl, 5-hexenyl, cyclohexenyl, 6-heptenyl, 7- octenyl, 8-nonenyl, 9-decenyl, 10-undecenyl, 4,7-octadienyl, 5,8-nonadienyl, 5,9-decadienyl, 6,11-dodecadienyl, and 4,8-nonadienyl, with vinyl and 5-hexenyl being preferred. Thus Component (b) is preferably selected from trimethylsiloxy-terminated polymethylvinylsiloxane polymers, trimethylsiloxy-terminated polydimethylsiloxane- polymethylvinylsiloxane copolymers, vinyldimethylsiloxy-terminated polydimethylsiloxane- polymethylvinylsiloxane copolymers, trimethylsiloxy-terminated polymethylvinylsiloxane polymers, trimethylsiloxy-terminated polymethylhexenylsiloxane polymers, trimethylsiloxy- terminated polydimethylsiloxane-polymethylhexenylsiloxane copolymers, or hexenyldimethylsiloxy-terminated polydimethylsiloxane-polymethylhexenylsiloxane copolymers, each having a degree of polymerization of from 3 to 100 and a viscosity at 25 °C of from 1 to 200 millipascal-seconds. Component (B) can also be a combination of two or more of the above described alkenyl siloxanes. The amount of Components (a) and (b) that is used in the compositions of this invention, expressed in terms of the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b), should be sufficient to provide a ratio of less than or equal to 1 :4.6, and preferably from 1 :4.6 to 1:500. The ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) (i.e. SiH:SiNi ratio) depends on factors such as the type, amount, viscosity, and degree of polymerization of Component (a) and the type, amount, viscosity, and degree of polymerization of Component (b). Some typical SiH:SiNi ratios include
about 1 :4J to about 1 :5.5, and about 1 :6 to about 1 :75. However, for the silicone mist suppressant compositions of this invention, the SiH:Ni ratio is preferably from 1:4.7 to 1:100.
Component (c) can be any platinum group metal-containing catalyst component. By platinum group it is meant herein ruthenium, rhodium, palladium, osmium, iridium and platinum and complexes thereof. Preferably Component (c) is a platinum-containing catalyst. The platinum-containing catalyst can be platinum metal, platinum metal deposited on a carrier such as silica gel or powdered charcoal, or a compound or complex of a platinum group metal. Preferred platinum-containing catalysts include chloroplatinic acid, either in hexahydrate form or anhydrous form, and or a platinum-containing catalyst which is obtained by a method comprising reacting chloroplatinic acid with an aliphatically unsaturated organosilicon compound such as divmyltetramethyldisiloxane. Preferably the catalyst (c) is added in an amount sufficient to provide 1 to 250 weight parts for every one million weight parts of (a)+(b), and it is highly preferred that the amount is at 5 to 150 weight parts of platinum for every one million parts by weight of (a)+(b). The method of obtaining the silicone mist suppressant composition can further comprise adding (d) an inhibitor during or after mixing components (a), (b), and (c). Component (d), the inhibitor, can be any material that is known to be, or can be, used to inhibit the catalytic activity of platinum group metal-containing catalysts. By the term "inhibitor" it is meant herein a material that retards the room temperature curing of a mixture of Components (a), (b), and (c), and any optional component when incorporated therein in small amounts, such as less than 10 parts by weight of the composition, without preventing the elevated curing of the mixture. Examples of suitable inhibitors include ethylenically or aromatically unsaturated amides, acetylenic compounds, silylated acetylenic compounds, ethylenically unsaturated isocyanates, olefinic siloxanes, unsaturated hydrocarbon diesters, conjugated ene-ynes, hydroperoxides, nitriles, and diaziridines.
Preferred inhibitors are exemplified by acetylenic alcohols exemplified by 1-ethynyl-l-cyclohexanol, 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 2-ethynyl-isopropanol, 2-ethynyl-butane-2-ol, and 3,5-dimethyl-l-hexyn-3-ol, silylated acetylenic alcohols exemplified by trimethyl(3,5-dimethyl-l-hexyn-3-oxy)silane, dimethyl-bis- (3 -methyl- l-butyn-oxy)silane, methyl vinylbis(3 -methyl- l-butyn-3-oxy)silane, and ((1,1- dimethyl-2-propynyl)oxy)trimethylsilane, unsaturated carboxylic esters exemplified by diallyl maleate, dimethyl maleate, diethyl fumarate, diallyl fumarate, and bis-(methoxyisopropyl)
maleate, conjugated ene-ynes exemplified by 2-isobutyl-l-butene-3-yne, 3,5-dimethyl-3-hexene- 1-yne, 3-methyl-3-pentene-l-yne, 3-methyl-3-hexene-l-yne, 1-ethynylcyclohexene, 3-ethyl-3-butene-l-yne, and 3-phenyl-3-butene-l-yne, vinylcyclosiloxanes such as l,3,5,7-tetramethyl-l,3,5,7-tetravinylcyclotetrasiloxane, and a mixture of a conjugated ene-yne as described above and a vinylcyclosiloxane as described above.
The amount of inhibitor to be used in the silicone mist suppressant compositions of this invention is not critical. It is preferred that from 0.01 tolO parts by weight of inhibitor be used per 100 parts by weight of component (a+b). The ingredients and any optional ingredients can be mixed at any temperature, however it is preferred that ingredients (a)-(c) and any optional ingredients are mixed at room temperature, or heated to a temperature of from 25°C to 150°C.
Components (a)-(c), and any optional components can be mixed together using any suitable mixing means, such as a spatula, a drum roller, a mechanical stirrer, a three roll mill, a sigma blade mixer, a bread dough mixer, and a two roll mill. Components (a)-(c) can be prepared by homogeneously mixing (a), (b), (c), and any optional components in any order. The order of mixing (a) to (c) and any optional components is not critical however it is preferred that catalyst (c) be brought together in the presence of Components (a) and (b), and any optional components. It is highly preferred to mix Components (a) and (b) and any optional components in a preliminary mixing step followed by addition of catalyst (c). Mixing of Components (a), (b), and any optional compounds, and catalyst (c) results in the formation of a reaction product. The silicone mist suppressant composition, Component (B), is present in the silicone coating composition in amount sufficient to reduce the mist (aerosol) of the coating during highspeed processes, which can readily be determined by one skilled in the art through routine experimentation. It is preferably added to the solventless silicone coating composition in an amount of 0.1 to 95 weight parts, and it is highly preferred that the silicone mist suppressant composition is added in an amount of 0.1 to 10 weight parts, said weight parts being based on 100 weight parts of the solventless silicone coating composition.
Component (B), the silicone mist suppressant is a complex mixture of highly branched organoalkenylsiloxane polymers. A large excess of Component (b) is necessary to completely react the silicon-bonded hydrogen groups of Component (a) without reaching a gel point. The product of this reaction is therefore different from silicone elastomer and gel compositions
which react alkenyl siloxanes and organohydrogensiloxane with the purpose of reaching a gel point. The materials of the present invention must remain as fluids and must not reach a gel point. Depending on the structure of the starting materials, the viscosity of the final product preferably is from 300 to 15,000 millipascal-seconds. In a second embodiment, this invention relates to a silicone coating composition comprising (A) an organosilicon compound containing at least two silicon-bonded alkenyl groups per molecule and (B) a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds(mPa.s) (1 millipascal-second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon- bonded alkenyl groups of Component (b) is less than or equal to 1:4.6. This silicone coating composition can optionally comprise (C) an inhibitor. The organosilicon compound of Component (A), the liquid silicone mist suppressant of Component (B), and inhibitor (C) are as described above including preferred embodiments thereof. The silicone mist suppressant composition is generally present in an amount of 0.1 to 2,000 weight parts, and it is highly preferred that the silicone mist suppressant composition is present in an amount of 0.1 to 10 weight parts, said weight parts being based on 100 weight parts of Component (A). The amount of inhibitor (C) to be used in the silicone coating compositions of this embodiment is preferably from 0.01 to 1 part by weight of inhibitor per 100 parts by weight of Components (A+B).
In a third embodiment, this invention relates to a method of reducing mist in a silicone coating composition comprising adding to a solventless silicone coating composition a liquid silicone mist suppressant composition having a viscosity.of from 150 to 50,000 millipascal- seconds (1 millipascal second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon- bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded
hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1 :4.6. The solventless silicone coating composition and the liquid silicone mist suppressant composition are as described above including preferred embodiments and amounts thereof. In a fourth embodiment, this invention relates to a method of making a cured coating, the method comprising the steps of: (I) adding a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (1 millipascal second = 1 centipoise) obtained by a method comprising (I) mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1 :4.6 to a solventless silicone coating composition; (II) coating the mixture from (I) on the surface of a substrate; and (III) exposing the coating and the substrate to an energy source selected from (i) heat or (ii) actinic radiation in an amount sufficient to cure the coating. This method can further comprise applying a pressure sensitive adhesive on the coating after step (III). The solventless silicone coating composition and the liquid silicone mist suppressant composition are as described above including preferred embodiments and amounts thereof.
By actinic radiation it is meant ultraviolet light; electron beam radiation; and alpha-, beta-, gamma- and x- rays. By heat it is meant infrared radiation, hot air, microwave radiation, etc. Of course actinic radiation is frequently accompanied by heat and the use of a combination of the two falls within the scope and spirit of the present method. In the preferred method of this invention, the coating process can be accomplished by any suitable manner known in the art, such as by spreading, brushing, extruding, spraying, gravure, kiss-roll and air-knife.
In a preferred embodiment of the instant method the solid substrate is a flexible sheet material such as paper, polyolefin film and polyolefin-coated paper or foil. Other suitable solid substrates that can be coated by the process of this invention include other cellulosic materials such as wood, cardboard and cotton; metallic materials such as aluminum, copper, steel and silver; siliceous materials such as glass and stone; and synthetic polymer materials such as polyolefϊns, polyamides, polyesters and polyacrylates. As to form the solid substrate can be
substantially sheet-like, such as a peelable release liner for pressure sensitive adhesive; a fabric or a foil; or substantially three- dimensional in form.
After the silicone coating composition has been coated onto a substrate it is heated and/or irradiated with actinic radiation, as noted herein, to cure the liquid coating and to adhere it to the substrate.
In a preferred embodiment of the method of this invention, a flexible sheet material, such as paper, metal foil or tapestock, is coated with a thin coating of the silicone coating composition, preferably in a continuous manner and the thus-coated material is then heated and/or irradiated to rapidly cure the coating, to provide a sheetlike material bearing on at least one surface thereof an adhesive-releasing coating. The adhesive-releasing coating is subsequently brought into contact with a pressure sensitive adhesive, preferably in an in-line manner, to form an article having a peelable, i.e. releasable, adhesive/coating interface. Examples of such an article include, adhesive labels having a peelable backing, adhesive tape in roll form and adhesive packaged in a strippable container. The pressure sensitive adhesive can be non-silicone-based, such as the well-known acrylic or rubber types or silicone-based, such as the peroxide-or platinum-curable polydiorganosiloxane-based adhesives.
The method of this invention is also applicable to adhesive materials, other than pressure sensitive adhesives. Examples of said adhesive materials include foods, graphite composites, asphalt and gum polymers. The silicone mist suppressant compositions of this invention when added to silicone coatings are effective in reducing the amount of mist generated by the release coating during high speed coating processes such as for example when a silicone coating is coated onto a substrate such as paper, and the coating is then subsequently cured onto the substrate using heat to provide a sheetlike material bearing on at least one surface thereof an adhesive releasing coating.
The following examples are disclosed to further teach, but not limit, the invention, which is properly delineated by the appended claims. All amounts (parts and percentages) are by weight unless otherwise indicated.
The silicone mist particles produced by the "mist generator" described hereinbelow were drawn, in some of the Examples, to a QCM Cascade Impactor (TM), (Model PC-2 Ten Stage QCM Cascade Impactor, California Measurements, Inc., Sierra Madre, Calif.) and analyzed. A complete analysis of aerosol mass concentration and size distribution was obtained from a
sample of air taken for a short period of time (10 seconds to 1 minute). Collected samples of the sized particles were retained undisturbed (if the particles are solid) and were used directly to obtain composition, size and shape (for solid particles only) information using auxiliary scanning electron microscopy (SEM) and other analytical techniques. The instrument separates aerosol particles into 10 sizes from 0.05 to 25 micrometers. It does this by drawing the aerosol-laden air sample through a series of 10 stages, each stage containing an inertial impactor jet of decreasing size (various size of orifices) where the particles are accelerated. Directly below each jet was a piezoelectric quartz crystal that was used as an impactor to collect the separated particles. As the jet of air exits from the nozzle it was forced to turn sharply to flow around the crystal. Larger particles in the stream, because of their inertia, continue to travel toward the crystal plate and impact on it. Smaller particles follow the flow of air around the crystal to the next stage, which was a repeat of the proceeding stage, except it was equipped with smaller nozzle designed to impact smaller particles. The 10 stages thus collect particles of smaller and smaller sizes. Each crystal was the frequency-controlling element of a quartz-crystal microbalance (QCM), whose output frequency decreases when particles are collected on the surface. Placed in close proximity to the sensing crystal, but shielded from the collected particles, was an identical reference crystal controlling the frequency of another circuit set about 2 kHz higher than that of the sensing crystal. The set of crystals in a stage were closely matched in frequency. The beat frequency between the two oscillators was the signal indicative of the mass collected. The particle size distribution was obtained by monitoring the frequency change of QCM in each of the 10 stages.
A tip of stainless steel tube (1/4' in diameter) remoted from the QCM Cascade Impactor (TM) was placed very closely to the nip point of the mist generator. To start the measurement the Cascade Impactor was initialized by pushing the initialization button on the front panel of the control unit. The mist generator was set at a speed (either 1,000, 1,500 or 2,000 ft/min) and allowed to run for 10 seconds before taking the sample and then open the sampling knob of the Impactor for a predetermined period time (10 to 30 seconds). After sampling the Impactor was left to idle for additional 50 seconds to let the particles settle in the stages. The amount of collected particles at each stage was calculated by pushing the "final" button on the front panel. The result of the total amount of mist and particle size distribution is printed out to both the CRT of the PC connected via the serial port and the thermal printer on the controller. The data was
taken from at least average of three individual runs at a speed. When the individual data scattered too much two more measurements were made and then the two extreme values (1 highest and 1 lowest) were discarded before the results were averaged.
Tests were also conducted on a 12" forward roll coater. On a five roll, 12 inch diameter production scale forward roll coater the QCM cascade impactor was installed to measure the amount of mist produced at 1,500 ft/min line speed. The tip of stainless steel tube (1/4 inch id.) for sample collection was located at 1 inch away from the nip point of the applicator and nipping rollers of the coater. The coater was run for 10 seconds at 1,500 ft/min and then the mist sample was taken for additional 10 seconds. Two to three data points were taken at a condition and then the average was taken as a result. The average variations were less than 15% of the mean values.
EXAMPLES 1-3 In Examples 1-3 hereinbelow, a methylhydrogensiloxane (A) and an organoalkenylsiloxane (B) were thoroughly mixed at 25°C. Then, a catalyst (C) was added with thorough mixing at 25°C. The mixture was then brought to the desired reaction temperature' and mixed at that temperature for a time sufficient for the viscosity to stabilize (reaction A). Upon completion of the reaction, an inhibitor was added to inhibit the activity of the catalyst and stabilize the product. Table 1 summarizes the reagents used, reaction conditions, and viscosity of the final products. In Table 1 hereinbelow:
(A) denotes a trimethylsiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymer having a total average degree of polymerization of about 24 with about 8 mol% methylhydrogen moiety on the siloxane chain and a viscosity of about 20 millipascal-seconds. (B-l) denotes a dimethylvinylsiloxy-terminated polydimethylsiloxane- polymethylvinylsiloxane copolymer having a total average degree of polymerization of about 150 with about 2 mol% methylvinyl moiety on the siloxane chain and a viscosity of about 375 millipascal-seconds. (B-2) denotes a dimethylhexenylsiloxy-terminated polydimethylsiloxane- polymethylhexenylsiloxane copolymer having a total average degree of polymerization of about 150 with about 2J mol% methylvinyl moiety on the siloxane chain and a viscosity of about 390 millipascal-seconds.
(C) denotes a soluble platinum complex containing 0.67 wt.% platinum, formed from chloroplatinic acid and divmyltetramethyldisiloxane.
(D) denotes bis(2-methoxy-l-methylethyl) maleate.
Table 2 summarizes the mist-suppression performance of these materials.
(a) Coating line speed which corresponds to the rpm setting on the mist generator. The mist generator was a laboratory 2-roll coater capable of running at a line speed over 2,000 feet/minute. The 2-roll coater was equipped with two 6 inch diameter rollers (bottom roll: rubber coated and top roll: chrome coated), two blades, one on each roll, and a bottom pan for containing the liquid supply. The rubber coated bottom roll was driven by variable speed motor which can cover over 2,000 ft/min. of line speed. The top roll was a nipping roll which is engaged with bottom roll by applying pressure. Since the measurement of mist is very sensitive to the environment the whole system was located in a hood and the hood fan speed was kept low to minimize the influence of turbulence of the hood to the measurement. A vacuum cleaner was attached to each roll surface by using a coat hanger type accessory to sweep the mist away once it passed the measuring point. The coating liquid was supplied either from the button pan or a dam on the top blade against the top metal roller. The bottom pan feeding method was employed for all data reported herein. To obtain consistent results, the pressure settings of top blade and top roller were kept at 10 and 50 psi, respectively and the bottom blade was used as a doctoring blade to regulate the amount of incoming fluid. The coater was made by Euclid Tool and Machines, Bay City, Michigan. (b) Measured using a Model 3225 Aerosizer DSP instrument, manufactured by TSI
Corporation. The Aerosizer instrument is capable of measuring the total number of mist particles and particle size distribution in a sample of air drawn through the instrument at approximately 3 liters per minute for a set sample time. The sample time for all mist measurements in this document was 30 seconds. In the Examples, the silicone mist suppressant prepared above was added to a silicone coating in the amount denoted in Table 2 below. The silicone coating was prepared by mixing the following ingredients: 95.5 parts of a dimethylvinylsiloxy -terminated polydimethylsiloxane having an average degree of polymerization of about 130 and a viscosity of about 300 millipascal-seconds, 4.5 parts of a trimethylsiloxy-terminated polydimethylsiloxane-polymethylhydrogensiloxane copolymer having a total average degree of polymerization of about 40 with about 70 mol% methylhydrogen moiety on the siloxane chain; and 0.1 parts of bis(2-methoxy-l-methylethyl) maleate.
(c) A control coating was run at the identical line speed and was identical to the silicone coating described above except it contained no silicone mist suppressant.
Table 1
Table 2
Claims (16)
1. A silicone coating composition comprising:
(A) a solventless silicone coating composition; and
(B) a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (mPa.s) (1 millipascal-second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal- containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1:4.6.
2. A composition according to Claim 1, wherein (A) comprises (i) an organosilicon compound containing at least two silicon-bonded alkenyl groups per molecule; (ii) an organohydrogensilicon compound containing at least two silicon-bonded hydrogen atoms per molecule, the ratio of the number of silicon-bonded hydrogen atoms of (ii) to the number of silicon-bonded alkenyl groups of (i) is from 0.5:1 to 4.5:1, (iii) a platinum group metal- containing catalyst; and (iv) an inhibitor.
3. A composition according to Claim 1, wherein (A) is obtained by a method comprising mixing (i) an organosilicon compound containing at least two silicon-bonded alkenyl groups per molecule; (ii) an organohydrogensilicon compound containing at least two silicon-bonded hydrogen atoms per molecule, the ratio of the number of silicon-bonded hydrogen atoms of (ii) to the number of silicon-bonded alkenyl groups of (i) is from 0.5:1 to 4.5:1, (iii) a platinum group metal-containing catalyst; and (iv) an inhibitor.
4. A composition according to Claim 2, wherein the ratio of the number of silicon-bonded hydrogen atoms of (ii) to the number of silicon-bonded alkenyl groups of (i) is from 0.5:1 to 3:1.
5. A composition according to Claim 3, wherein the ratio of the number of silicon-bonded hydrogen atoms of (ii) to the number of silicon-bonded alkenyl groups of (i) is from 0.5:1 to 3:1.
6. A composition according to Claim 1, wherein the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of alkenyl groups of Component (b) is from
1:4.6 to 1:500.
7. A composition according to Claim 2, wherein the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of alkenyl groups of Component (b) is from 1:4.6 to 1:500.
8. A composition according to Claim 3, wherein the ratio of the number of silicon-bonded 5 hydrogen atoms of Component (a) to the number of alkenyl groups of Component (b) is from
1:4.6 to 1:500.
9. A composition according to Claim 4, wherein the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of alkenyl groups of Component (b) is from 1 :4.6 to 1:500.
10 10. A composition according to Claim 5, wherein the ratio of the number of silicon- bonded hydrogen atoms of Component (a) to the number of alkenyl groups of Component (b) is
11. A composition according to Claim 1, wherein the method of obtaining the silicone mist suppressant composition further comprises adding (d) an inhibitor after mixing (a), (b), and
15 (c).
12. A silicone coating composition comprising:
(A) an organosilicon compound containing at least two silicon-bonded alkenyl groups per molecule; and
(B) a liquid silicone mist suppressant composition having a viscosity of from 150 to
20 50,000 millipascal-seconds(mPa.s) (1 millipascal-second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal- containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of
25 platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1:4.6.
13. A composition according to Claim 13, wherein the composition further comprises (C) an inhibitor.
30 14. A method of reducing mist in a silicone coating composition comprising adding to a solventless silicone coating composition a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (1 millipascal second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal-containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1:4.6.
15. A method of making a cured coating, the method comprising the steps of:
(I) adding a liquid silicone mist suppressant composition having a viscosity of from 150 to 50,000 millipascal-seconds (1 millipascal second = 1 centipoise) obtained by a method comprising mixing: (a) at least one organohydrogensilicon compound containing at least two silicon-bonded hydrogen groups per molecule, (b) at least one organoalkenylsiloxane containing at least three silicon-bonded alkenyl groups per molecule, and (c) a platinum group metal- containing catalyst which is present in an amount sufficient to provide 1 to 250 weight parts of platinum group metal per million weight parts of (a)+(b), with the proviso that the ratio of the number of silicon-bonded hydrogen atoms of Component (a) to the number of silicon-bonded alkenyl groups of Component (b) is less than or equal to 1 :4.6 to a solventless silicone coating composition;
(II) coating the mixture from (I) on the surface of a substrate; and (III) exposing the coating and the substrate to an energy source selected from (i) heat or
(ii) actinic radiation in an amount sufficient to cure the coating.
16. A method according to Claim 16, wherein the method further comprises applying a pressure sensitive adhesive on the coating after step (III).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/599,381 US6586535B1 (en) | 2000-06-22 | 2000-06-22 | Coatings containing silicone mist suppressant compositions |
US09/599,381 | 2000-06-22 | ||
PCT/US2001/018163 WO2001098420A2 (en) | 2000-06-22 | 2001-06-05 | Silicone coatings containing silicone mist suppressant compositions |
Publications (2)
Publication Number | Publication Date |
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AU2001265371A1 true AU2001265371A1 (en) | 2002-03-21 |
AU2001265371B2 AU2001265371B2 (en) | 2005-02-17 |
Family
ID=24399387
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AU6537101A Pending AU6537101A (en) | 2000-06-22 | 2001-06-05 | Coatings containing silicone mist suppressant compositions |
AU2001265371A Ceased AU2001265371B2 (en) | 2000-06-22 | 2001-06-05 | Silicone coatings containing silicone mist suppressant compositions |
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Application Number | Title | Priority Date | Filing Date |
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AU6537101A Pending AU6537101A (en) | 2000-06-22 | 2001-06-05 | Coatings containing silicone mist suppressant compositions |
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US (1) | US6586535B1 (en) |
EP (1) | EP1294818B1 (en) |
JP (1) | JP5033294B2 (en) |
KR (1) | KR100750079B1 (en) |
CN (1) | CN1179009C (en) |
AT (1) | ATE257852T1 (en) |
AU (2) | AU6537101A (en) |
CA (1) | CA2413155A1 (en) |
DE (1) | DE60101800T2 (en) |
MX (1) | MXPA02012803A (en) |
TW (1) | TWI273123B (en) |
WO (1) | WO2001098420A2 (en) |
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- 2001-06-05 MX MXPA02012803A patent/MXPA02012803A/en active IP Right Grant
- 2001-06-05 CN CNB018114830A patent/CN1179009C/en not_active Expired - Fee Related
- 2001-06-05 JP JP2002504373A patent/JP5033294B2/en not_active Expired - Fee Related
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- 2001-06-05 CA CA002413155A patent/CA2413155A1/en not_active Abandoned
- 2001-06-05 WO PCT/US2001/018163 patent/WO2001098420A2/en active IP Right Grant
- 2001-06-05 AU AU2001265371A patent/AU2001265371B2/en not_active Ceased
- 2001-06-05 EP EP01939901A patent/EP1294818B1/en not_active Expired - Lifetime
- 2001-06-05 KR KR1020027017424A patent/KR100750079B1/en not_active Expired - Fee Related
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