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AU2001247499A1 - Cluster tool systems and methods for processing wafers - Google Patents

Cluster tool systems and methods for processing wafers

Info

Publication number
AU2001247499A1
AU2001247499A1 AU2001247499A AU4749901A AU2001247499A1 AU 2001247499 A1 AU2001247499 A1 AU 2001247499A1 AU 2001247499 A AU2001247499 A AU 2001247499A AU 4749901 A AU4749901 A AU 4749901A AU 2001247499 A1 AU2001247499 A1 AU 2001247499A1
Authority
AU
Australia
Prior art keywords
methods
cluster tool
tool systems
processing wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247499A
Inventor
Duncan Dobson
Krishna Vepa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wafer Solutions Inc
Original Assignee
Wafer Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wafer Solutions Inc filed Critical Wafer Solutions Inc
Publication of AU2001247499A1 publication Critical patent/AU2001247499A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001247499A 2000-03-17 2001-03-16 Cluster tool systems and methods for processing wafers Abandoned AU2001247499A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US19027800P 2000-03-17 2000-03-17
US19022100P 2000-03-17 2000-03-17
US60190221 2000-03-17
US60190278 2000-03-17
US20249500P 2000-05-05 2000-05-05
US60202495 2000-05-05
US09/808,790 US20010024877A1 (en) 2000-03-17 2001-03-15 Cluster tool systems and methods for processing wafers
US09808749 2001-03-15
US09808790 2001-03-15
US09808748 2001-03-15
US09/808,748 US20020004358A1 (en) 2000-03-17 2001-03-15 Cluster tool systems and methods to eliminate wafer waviness during grinding
US09/808,749 US6852012B2 (en) 2000-03-17 2001-03-15 Cluster tool systems and methods for in fab wafer processing
PCT/US2001/008506 WO2001070454A1 (en) 2000-03-17 2001-03-16 Cluster tool systems and methods for processing wafers

Publications (1)

Publication Number Publication Date
AU2001247499A1 true AU2001247499A1 (en) 2001-10-03

Family

ID=27497840

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247499A Abandoned AU2001247499A1 (en) 2000-03-17 2001-03-16 Cluster tool systems and methods for processing wafers

Country Status (3)

Country Link
US (3) US20010024877A1 (en)
AU (1) AU2001247499A1 (en)
WO (1) WO2001070454A1 (en)

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JP3838341B2 (en) * 2001-09-14 2006-10-25 信越半導体株式会社 Wafer shape evaluation method, wafer and wafer sorting method
US6932869B2 (en) * 2001-11-15 2005-08-23 Alcatel UV-cure of coating for optical fiber assisted by ultrasound
JP3806680B2 (en) * 2002-08-13 2006-08-09 大昌精機株式会社 Grinding method for vertical double-sided surface grinder
KR100628455B1 (en) * 2002-12-21 2006-09-28 주식회사 이오테크닉스 Chip scale markers and marking methods
TWI244691B (en) * 2003-05-15 2005-12-01 Siltronic Ag Process for polishing a semiconductor wafer
JP4345357B2 (en) * 2003-05-27 2009-10-14 株式会社Ｓｕｍｃｏ Manufacturing method of semiconductor wafer
JP2005166925A (en) * 2003-12-02 2005-06-23 Tokyo Seimitsu Co Ltd Wafer processing method and wafer processing apparatus
US8403727B1 (en) * 2004-03-31 2013-03-26 Lam Research Corporation Pre-planarization system and method
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
US20080318152A1 (en) * 2004-09-17 2008-12-25 Takeyuki Mizutani Substrate for Exposure, Exposure Method and Device Manufacturing Method
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
US7422634B2 (en) * 2005-04-07 2008-09-09 Cree, Inc. Three inch silicon carbide wafer with low warp, bow, and TTV
WO2006124472A2 (en) * 2005-05-12 2006-11-23 Applied Materials, Inc. Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US20080206992A1 (en) * 2006-12-29 2008-08-28 Siltron Inc. Method for manufacturing high flatness silicon wafer
JP5301802B2 (en) * 2007-09-25 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Manufacturing method of semiconductor wafer
US8536054B2 (en) * 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8586398B2 (en) * 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US20100258173A1 (en) * 2009-04-13 2010-10-14 Joseph Laia Polishing a thin metallic substrate for a solar cell
JP2011129232A (en) * 2009-12-21 2011-06-30 Asahi Glass Co Ltd Process for producing glass substrate
TWI532116B (en) * 2010-04-11 2016-05-01 肯提克有限公司 Method and system for wafer registration
CN102240926B (en) * 2010-05-13 2013-06-05 鸿富锦精密工业（深圳）有限公司 Method for grinding surface of zirconium base bulk amorphous alloy
US20120115398A1 (en) * 2010-11-09 2012-05-10 James Bopp Chemical-mechanical polishing wafer and method of use
US9718164B2 (en) * 2012-12-06 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing system and polishing method
JP5967040B2 (en) * 2013-09-11 2016-08-10 信越半導体株式会社 Mirror polished wafer manufacturing method
DE102015215624A1 (en) * 2015-08-17 2017-02-23 Schaeffler Technologies AG & Co. KG Process for producing bearing components by means of a production line, production line and manufacturing plant
JP6548513B2 (en) 2015-08-21 2019-07-24 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP2019021674A (en) * 2017-07-12 2019-02-07 東京エレクトロン株式会社 Substrate processing system and substrate processing method
JP7394821B2 (en) 2020-06-30 2023-12-08 株式会社荏原製作所 Substrate processing equipment
JP7200345B2 (en) * 2020-06-30 2023-01-06 株式会社荏原製作所 Substrate processing equipment
EP4494812A1 (en) * 2023-07-21 2025-01-22 Siltronic AG Method for processing semiconductor wafers

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US4853286A (en) * 1984-05-29 1989-08-01 Mitsui Toatsu Chemicals, Incorporated Wafer processing film
JPS61152358A (en) * 1984-12-24 1986-07-11 Toshiba Corp Grinding method for semiconductor wafer
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US5476566A (en) 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
JP2554432B2 (en) * 1992-11-20 1996-11-13 住友シチックス株式会社 Peripheral surface processing equipment for semiconductor wafers
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WO1999031723A1 (en) * 1997-12-12 1999-06-24 Memc Electronic Materials, Inc. Method of improving the flatness of polished semiconductor wafers
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US5972234A (en) 1998-04-06 1999-10-26 Taiwan Semiconductor Manufacturing Co., Ltd. Debris-free wafer marking method
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Also Published As

Publication number Publication date
US6852012B2 (en) 2005-02-08
WO2001070454A1 (en) 2001-09-27
US20010027082A1 (en) 2001-10-04
US20020004358A1 (en) 2002-01-10
US20010024877A1 (en) 2001-09-27

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