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AU2001237583A1 - Magnetron sputter ion plating system - Google Patents

Magnetron sputter ion plating system

Info

Publication number
AU2001237583A1
AU2001237583A1 AU2001237583A AU3758301A AU2001237583A1 AU 2001237583 A1 AU2001237583 A1 AU 2001237583A1 AU 2001237583 A AU2001237583 A AU 2001237583A AU 3758301 A AU3758301 A AU 3758301A AU 2001237583 A1 AU2001237583 A1 AU 2001237583A1
Authority
AU
Australia
Prior art keywords
ion plating
plating system
magnetron sputter
sputter ion
magnetron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001237583A
Inventor
Stephen Morley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulster University
Original Assignee
Ulster University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulster University filed Critical Ulster University
Publication of AU2001237583A1 publication Critical patent/AU2001237583A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/358—Inductive energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AU2001237583A 2000-03-08 2001-03-07 Magnetron sputter ion plating system Abandoned AU2001237583A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0005411 2000-03-08
GB0005411A GB0005411D0 (en) 2000-03-08 2000-03-08 Magnetron sputter ion plating system
PCT/GB2001/000986 WO2001067484A1 (en) 2000-03-08 2001-03-07 Magnetron sputter ion plating system

Publications (1)

Publication Number Publication Date
AU2001237583A1 true AU2001237583A1 (en) 2001-09-17

Family

ID=9887083

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001237583A Abandoned AU2001237583A1 (en) 2000-03-08 2001-03-07 Magnetron sputter ion plating system

Country Status (3)

Country Link
AU (1) AU2001237583A1 (en)
GB (1) GB0005411D0 (en)
WO (1) WO2001067484A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104831238B (en) * 2015-03-31 2017-07-18 嘉兴中科奥度新材料有限公司 Composite material ion plating nano-metal process and its products
WO2018161511A1 (en) * 2017-03-09 2018-09-13 北京北方华创微电子装备有限公司 Magnetic field generation mechanism of reaction chamber and reaction chamber

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
WO1992007969A1 (en) * 1990-10-31 1992-05-14 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
EP0955390A3 (en) * 1998-04-29 2003-10-15 General Motors Corporation Low temperature deposition of transition metal nitrides

Also Published As

Publication number Publication date
WO2001067484A1 (en) 2001-09-13
GB0005411D0 (en) 2000-04-26

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