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AU2001232987A1 - A method for forming a micromechanical device - Google Patents

A method for forming a micromechanical device

Info

Publication number
AU2001232987A1
AU2001232987A1 AU2001232987A AU3298701A AU2001232987A1 AU 2001232987 A1 AU2001232987 A1 AU 2001232987A1 AU 2001232987 A AU2001232987 A AU 2001232987A AU 3298701 A AU3298701 A AU 3298701A AU 2001232987 A1 AU2001232987 A1 AU 2001232987A1
Authority
AU
Australia
Prior art keywords
forming
micromechanical device
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001232987A
Inventor
Andrew G. Huibers
Randall J. True
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reflectivity Inc
Original Assignee
Reflectivity Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reflectivity Inc filed Critical Reflectivity Inc
Publication of AU2001232987A1 publication Critical patent/AU2001232987A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00658—Treatments for improving the stiffness of a vibrating element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
AU2001232987A 2000-01-28 2001-01-25 A method for forming a micromechanical device Abandoned AU2001232987A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US17890200P 2000-01-28 2000-01-28
US60178902 2000-01-28
PCT/US2001/002541 WO2001056066A1 (en) 2000-01-28 2001-01-25 A method for forming a micromechanical device
USNOTGIVEN 2002-12-03

Publications (1)

Publication Number Publication Date
AU2001232987A1 true AU2001232987A1 (en) 2001-08-07

Family

ID=22654369

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001232987A Abandoned AU2001232987A1 (en) 2000-01-28 2001-01-25 A method for forming a micromechanical device

Country Status (3)

Country Link
US (1) US20010040675A1 (en)
AU (1) AU2001232987A1 (en)
WO (1) WO2001056066A1 (en)

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US7228156B2 (en) * 2000-05-02 2007-06-05 Bae Systems Information And Electronic Systems Integration Inc. RF-actuated MEMS switching element
US7057246B2 (en) * 2000-08-23 2006-06-06 Reflectivity, Inc Transition metal dielectric alloy materials for MEMS
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US6995034B2 (en) * 2000-12-07 2006-02-07 Reflectivity, Inc Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
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US20030107794A1 (en) * 2001-12-11 2003-06-12 Siekkinen James W. Micro mirror array
US7244367B2 (en) 2001-12-11 2007-07-17 Jds Uniphase Corporation Metal alloy elements in micromachined devices
US6794119B2 (en) 2002-02-12 2004-09-21 Iridigm Display Corporation Method for fabricating a structure for a microelectromechanical systems (MEMS) device
US6813054B2 (en) * 2002-03-21 2004-11-02 Agere Systems Inc. Micro-electro-mechanical device having improved torsional members and a method of manufacturing therefor
US20040004753A1 (en) * 2002-06-19 2004-01-08 Pan Shaoher X. Architecture of a reflective spatial light modulator
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
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US7319260B1 (en) * 2002-10-17 2008-01-15 The United States Of America As Represented By The Secretary Of The Air Force Hinged bonding of micromechanical devices
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US7187485B2 (en) 2003-07-31 2007-03-06 Corning Incorporated Integrated continuous spectrum spatial light modulator
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US20050106774A1 (en) * 2003-11-13 2005-05-19 Dmitri Simonian Surface processes in fabrications of microstructures
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US7514012B2 (en) * 2004-01-27 2009-04-07 Texas Instruments Incorporated Pre-oxidization of deformable elements of microstructures
US6999224B2 (en) * 2004-03-10 2006-02-14 Reflectivity, Inc Micromirror modulation method and digital apparatus with improved grayscale
US7553684B2 (en) 2004-09-27 2009-06-30 Idc, Llc Method of fabricating interferometric devices using lift-off processing techniques
US7492502B2 (en) 2004-09-27 2009-02-17 Idc, Llc Method of fabricating a free-standing microstructure
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US7373026B2 (en) 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7369296B2 (en) 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7405861B2 (en) 2004-09-27 2008-07-29 Idc, Llc Method and device for protecting interferometric modulators from electrostatic discharge
US7417783B2 (en) 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7161730B2 (en) 2004-09-27 2007-01-09 Idc, Llc System and method for providing thermal compensation for an interferometric modulator display
US7349136B2 (en) 2004-09-27 2008-03-25 Idc, Llc Method and device for a display having transparent components integrated therein
US7420728B2 (en) 2004-09-27 2008-09-02 Idc, Llc Methods of fabricating interferometric modulators by selectively removing a material
TW200628877A (en) 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
US7408250B2 (en) * 2005-04-05 2008-08-05 Texas Instruments Incorporated Micromirror array device with compliant adhesive
US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
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KR20080041663A (en) 2005-07-22 2008-05-13 콸콤 인코포레이티드 Supporting structures for MEMS devices and methods thereof
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US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
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US7527996B2 (en) 2006-04-19 2009-05-05 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7623287B2 (en) 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7417784B2 (en) 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
US7369292B2 (en) 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7405863B2 (en) 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
JP4327183B2 (en) * 2006-07-31 2009-09-09 株式会社日立製作所 High pressure fuel pump control device for internal combustion engine
US7566664B2 (en) 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7545552B2 (en) 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US7880952B2 (en) * 2007-05-03 2011-02-01 Silicon Quest Kabushiki-Kaisha Mirror device with an anti-stiction layer
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Also Published As

Publication number Publication date
WO2001056066A1 (en) 2001-08-02
US20010040675A1 (en) 2001-11-15

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