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AU2000275687A1 - A mold - Google Patents

A mold

Info

Publication number
AU2000275687A1
AU2000275687A1 AU2000275687A AU7568700A AU2000275687A1 AU 2000275687 A1 AU2000275687 A1 AU 2000275687A1 AU 2000275687 A AU2000275687 A AU 2000275687A AU 7568700 A AU7568700 A AU 7568700A AU 2000275687 A1 AU2000275687 A1 AU 2000275687A1
Authority
AU
Australia
Prior art keywords
mold
leadframe
section
molding
defining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000275687A
Inventor
Shu Chuen Ho
Man Ho Hui
Juay Sim Koh
Teng Hock Kuah
Loon Aik Lim
Charles Joseph Vath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT Singapore Pte Ltd
Original Assignee
ASM Technology Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Technology Singapore Pte Ltd filed Critical ASM Technology Singapore Pte Ltd
Publication of AU2000275687A1 publication Critical patent/AU2000275687A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
    • H10W72/5522—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Pens And Brushes (AREA)
  • Materials For Medical Uses (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
AU2000275687A 2000-09-08 2000-09-08 A mold Abandoned AU2000275687A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2000/000140 WO2002020236A2 (en) 2000-09-08 2000-09-08 A mold

Publications (1)

Publication Number Publication Date
AU2000275687A1 true AU2000275687A1 (en) 2002-03-22

Family

ID=20428860

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000275687A Abandoned AU2000275687A1 (en) 2000-09-08 2000-09-08 A mold

Country Status (7)

Country Link
US (1) US6770163B1 (en)
EP (1) EP1315605B1 (en)
CN (1) CN1387678A (en)
AT (1) ATE263431T1 (en)
AU (1) AU2000275687A1 (en)
DE (1) DE60009579D1 (en)
WO (1) WO2002020236A2 (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10254648A1 (en) * 2002-11-22 2004-06-09 Infineon Technologies Ag Semiconductor chip carrier structure has venting structure allowing escape of air from bonding channel during encapsulation
JP2005327830A (en) * 2004-05-13 2005-11-24 Mitsubishi Electric Corp Semiconductor microdevice
TW200703606A (en) * 2005-07-15 2007-01-16 Siliconware Precision Industries Co Ltd Semiconductor package and fabrication method thereof
US20080013298A1 (en) 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
EP2094768A4 (en) 2006-12-22 2010-04-14 Kiram Ab Method for recovering a low sodium content lignin fuel from black liquor
US7816772B2 (en) * 2007-03-29 2010-10-19 Allegro Microsystems, Inc. Methods and apparatus for multi-stage molding of integrated circuit package
TWI351091B (en) * 2007-10-31 2011-10-21 Chipmos Technologies Inc Leadframe for leadless package
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US8093670B2 (en) * 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US8486755B2 (en) 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
US20100188078A1 (en) * 2009-01-28 2010-07-29 Andrea Foletto Magnetic sensor with concentrator for increased sensing range
US20110133732A1 (en) * 2009-12-03 2011-06-09 Allegro Microsystems, Inc. Methods and apparatus for enhanced frequency response of magnetic sensors
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
CN102744176B (en) * 2012-07-07 2017-04-26 上海鼎虹电子有限公司 Cleaning agent coating bracket in encapsulation of electronic elements
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US9337064B2 (en) * 2014-09-15 2016-05-10 Micron Technology, Inc. Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
US12523717B2 (en) 2024-02-15 2026-01-13 Allegro Microsystems, Llc Closed loop magnetic field sensor with current control

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPS62244139A (en) * 1986-04-17 1987-10-24 Citizen Watch Co Ltd Resin sealed type pin grid array and manufacture thereof
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
IT1252575B (en) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics MOLD AND PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR PLASTIC DEVICES, WITH VISIBLE METALLIC DISSIPATOR FOR WELDING CONTROL
US5656549A (en) * 1996-08-19 1997-08-12 Motorola, Inc. Method of packaging a semiconductor device
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US5766535A (en) * 1997-06-04 1998-06-16 Integrated Packaging Assembly Corporation Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
JP2971834B2 (en) * 1997-06-27 1999-11-08 松下電子工業株式会社 Method for manufacturing resin-encapsulated semiconductor device
US5923959A (en) * 1997-07-23 1999-07-13 Micron Technology, Inc. Ball grid array (BGA) encapsulation mold
JP3897478B2 (en) * 1999-03-31 2007-03-22 松下電器産業株式会社 Apparatus for manufacturing resin-encapsulated semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
ATE263431T1 (en) 2004-04-15
WO2002020236A2 (en) 2002-03-14
US6770163B1 (en) 2004-08-03
DE60009579D1 (en) 2004-05-06
EP1315605B1 (en) 2004-03-31
WO2002020236A3 (en) 2002-05-23
CN1387678A (en) 2002-12-25
EP1315605A2 (en) 2003-06-04

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