[go: up one dir, main page]

ATE533229T1 - Elektronische vorrichtung - Google Patents

Elektronische vorrichtung

Info

Publication number
ATE533229T1
ATE533229T1 AT01915158T AT01915158T ATE533229T1 AT E533229 T1 ATE533229 T1 AT E533229T1 AT 01915158 T AT01915158 T AT 01915158T AT 01915158 T AT01915158 T AT 01915158T AT E533229 T1 ATE533229 T1 AT E533229T1
Authority
AT
Austria
Prior art keywords
electronic device
capacitor electrode
conducting layer
electrically conducting
layer
Prior art date
Application number
AT01915158T
Other languages
English (en)
Inventor
Nicolas Pulsford
Beek Jozef Van
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE533229T1 publication Critical patent/ATE533229T1/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
AT01915158T 2000-02-15 2001-01-24 Elektronische vorrichtung ATE533229T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00200496 2000-02-15
PCT/EP2001/000774 WO2001061847A1 (en) 2000-02-15 2001-01-24 Electronic device

Publications (1)

Publication Number Publication Date
ATE533229T1 true ATE533229T1 (de) 2011-11-15

Family

ID=8171011

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01915158T ATE533229T1 (de) 2000-02-15 2001-01-24 Elektronische vorrichtung

Country Status (7)

Country Link
US (1) US6538874B2 (de)
EP (1) EP1177622B1 (de)
JP (1) JP5231702B2 (de)
KR (1) KR100697405B1 (de)
CN (1) CN1223082C (de)
AT (1) ATE533229T1 (de)
WO (1) WO2001061847A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030069543A (ko) * 2002-02-21 2003-08-27 엘지전자 주식회사 박막 용적 탄성파 공진기를 이용한 전압제어발진기 및 그박막 용적 탄성파 공진기 제조방법
US8018307B2 (en) * 2003-06-26 2011-09-13 Nxp B.V. Micro-electromechanical device and module and method of manufacturing same
US7456035B2 (en) 2003-07-29 2008-11-25 Lumination Llc Flip chip light emitting diode devices having thinned or removed substrates
WO2005062905A2 (en) 2003-12-24 2005-07-14 Gelcore Llc Laser lift-off of sapphire from a nitride flip-chip
CN100533967C (zh) * 2004-05-06 2009-08-26 Nxp股份有限公司 电子装置
JP4499731B2 (ja) 2004-07-15 2010-07-07 富士通株式会社 容量素子とその製造方法、及び半導体装置
US7125734B2 (en) 2005-03-09 2006-10-24 Gelcore, Llc Increased light extraction from a nitride LED
JP2007067012A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 半導体装置
CN101473437B (zh) 2006-06-20 2011-01-12 Nxp股份有限公司 集成电路以及采用该集成电路的装置
CN101473433B (zh) 2006-06-20 2011-12-07 Nxp股份有限公司 功率放大器装置
EP2067165A2 (de) 2006-09-18 2009-06-10 Nxp B.V. Verfahren zur herstellung einer integrierten schaltung
US20080119002A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US20080119001A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a mems device
US20080119003A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US20080116534A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US20170046809A1 (en) * 2015-04-06 2017-02-16 Evelyn Laureano-Osorio My Personal Identification Mobile Wallet
FR3083004B1 (fr) * 2018-06-22 2021-01-15 Commissariat Energie Atomique Dispositif transducteur piezoelectrique et procede de realisation d'un tel dispositif
JP7355827B2 (ja) * 2018-12-20 2023-10-03 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 精密に制御された容量性エリアを有するコンデンサを備える多層電子デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140560A (ja) 1986-12-02 1988-06-13 Mitsubishi Electric Corp 半導体モノリシツクバイアス給電回路
KR900019227A (ko) * 1988-05-18 1990-12-24 아오이 죠이치 적층형 캐피시터를 갖춘 반도체기억장치 및 그 제조방법
US5589251A (en) * 1990-08-06 1996-12-31 Tokai Electronics Co., Ltd. Resonant tag and method of manufacturing the same
US5508881A (en) * 1994-02-01 1996-04-16 Quality Microcircuits Corporation Capacitors and interconnect lines for use with integrated circuits
TW367621B (en) * 1995-02-27 1999-08-21 Nxp Bv Electronic component comprising a thin-film structure with passive elements
JP3737274B2 (ja) * 1998-03-18 2006-01-18 ユーディナデバイス株式会社 半導体装置の製造方法およびエッチング方法

Also Published As

Publication number Publication date
EP1177622B1 (de) 2011-11-09
KR100697405B1 (ko) 2007-03-20
CN1223082C (zh) 2005-10-12
KR20010113788A (ko) 2001-12-28
CN1363139A (zh) 2002-08-07
JP5231702B2 (ja) 2013-07-10
JP2003523639A (ja) 2003-08-05
WO2001061847A1 (en) 2001-08-23
US20020006024A1 (en) 2002-01-17
US6538874B2 (en) 2003-03-25
EP1177622A1 (de) 2002-02-06

Similar Documents

Publication Publication Date Title
ATE533229T1 (de) Elektronische vorrichtung
AU2002211084A1 (en) Methods of manufacturing a printed circuit board shielded against interfering radiation
EP1117067A4 (de) Ic-karte
TW351911B (en) Laminar stackable circuit board structure with capacitor
CA2381117A1 (en) Improved multiple terminal capacitor structure
EP2312664A3 (de) Elektronische anordnung
WO2005086788A3 (en) Rf communications apparatus and manufacturing method threfor
TW200501182A (en) A capacitor structure
EP1416636A3 (de) Sensorelement-Vorrichtung für einen kapazitiven Berührungsschalter mit einem elektrisch leitfähigen Körper und Verfahren zur Herstellung eines solchen Körpers
SE9803392D0 (sv) Printed board assembly and method of its manufacture
ATE278823T1 (de) Elastisches kontaktelement
TW200511134A (en) Secure component for radio frequency identification
ATE352977T1 (de) Leiterplatte mit mindestens einem elektronischen bauteil
AU2003224689A1 (en) Conductive polymer device and method of manufacturing same
ATE240581T1 (de) Folie für einen folienkondensator und folienkondensator
DE60121908D1 (de) Metallische Platte für elektrische/elektronische Instrumente und elektrische/elektronische Instrumente mit dieser Platte
DE50002616D1 (de) Flächiger träger mit mindestens einem halbleiterchip
TW200516728A (en) Capacitor-related systems for addressing package/motherboard resonance
TW200503324A (en) Film antenna and method for manufacturing the same
AU2003254588A1 (en) Data support with transponder coil
TW200603366A (en) Model-based insertion of irregular dummy features
AU3941897A (en) Resonant circuit for electronic anti-theft element
SE9801118D0 (sv) Electrical device
TW200733335A (en) Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
TW200520157A (en) Device and method for manufacturing the same