ATE521987T1 - Thermoelektrische einrichtungen - Google Patents
Thermoelektrische einrichtungenInfo
- Publication number
- ATE521987T1 ATE521987T1 AT01999225T AT01999225T ATE521987T1 AT E521987 T1 ATE521987 T1 AT E521987T1 AT 01999225 T AT01999225 T AT 01999225T AT 01999225 T AT01999225 T AT 01999225T AT E521987 T1 ATE521987 T1 AT E521987T1
- Authority
- AT
- Austria
- Prior art keywords
- thermoelement
- electrical conductor
- thermoelectric
- thermoelectric devices
- electrically coupled
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/731,614 US6608250B2 (en) | 2000-12-07 | 2000-12-07 | Enhanced interface thermoelectric coolers using etched thermoelectric material tips |
PCT/GB2001/005195 WO2002047178A2 (en) | 2000-12-07 | 2001-11-23 | Thermoelectric devices |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE521987T1 true ATE521987T1 (de) | 2011-09-15 |
Family
ID=24940247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01999225T ATE521987T1 (de) | 2000-12-07 | 2001-11-23 | Thermoelektrische einrichtungen |
Country Status (10)
Country | Link |
---|---|
US (1) | US6608250B2 (de) |
EP (1) | EP1364416B1 (de) |
JP (1) | JP4288067B2 (de) |
KR (1) | KR100558802B1 (de) |
CN (1) | CN1552106B (de) |
AT (1) | ATE521987T1 (de) |
AU (1) | AU2002220823A1 (de) |
IL (2) | IL156319A0 (de) |
TW (1) | TW538514B (de) |
WO (1) | WO2002047178A2 (de) |
Families Citing this family (51)
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US6680214B1 (en) | 1998-06-08 | 2004-01-20 | Borealis Technical Limited | Artificial band gap |
US6712258B2 (en) * | 2001-12-13 | 2004-03-30 | International Business Machines Corporation | Integrated quantum cold point coolers |
US20040018729A1 (en) * | 2002-02-11 | 2004-01-29 | Ghoshal Uttam Shyamalindu | Enhanced interface thermoelectric coolers with all-metal tips |
US8574663B2 (en) | 2002-03-22 | 2013-11-05 | Borealis Technical Limited | Surface pairs |
US6639242B1 (en) * | 2002-07-01 | 2003-10-28 | International Business Machines Corporation | Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits |
GB0224300D0 (en) * | 2002-10-20 | 2002-11-27 | Tavkhelidze Avto | Thermoelectric material with intergrated broglie wave filter |
AU2003293034A1 (en) * | 2002-11-25 | 2004-06-18 | Pratima Addepalli | Trans-thermoelectric device |
US6815256B2 (en) | 2002-12-23 | 2004-11-09 | Intel Corporation | Silicon building blocks in integrated circuit packaging |
EP1480327B1 (de) * | 2003-05-20 | 2007-11-21 | Grundfos A/S | Elektromotor |
US20050016575A1 (en) * | 2003-06-13 | 2005-01-27 | Nalin Kumar | Field emission based thermoelectric device |
US20050028858A1 (en) * | 2003-08-04 | 2005-02-10 | Andrea Rossi | Thermoelectric module and generator |
US7081684B2 (en) * | 2003-10-06 | 2006-07-25 | Hewlett-Packard Development Company, L.P. | Converting heat generated by a component to electrical energy |
US20100257871A1 (en) * | 2003-12-11 | 2010-10-14 | Rama Venkatasubramanian | Thin film thermoelectric devices for power conversion and cooling |
US20050150539A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Monolithic thin-film thermoelectric device including complementary thermoelectric materials |
US20050150537A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers Inc. | Thermoelectric devices |
US20050150536A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials |
US20050150535A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor |
US20050160752A1 (en) * | 2004-01-23 | 2005-07-28 | Nanocoolers, Inc. | Apparatus and methodology for cooling of high power density devices by electrically conducting fluids |
US7081686B2 (en) * | 2004-03-22 | 2006-07-25 | Peter Yang | Power supply device for notebook computers |
US7305839B2 (en) * | 2004-06-30 | 2007-12-11 | General Electric Company | Thermal transfer device and system and method incorporating same |
EP1612870A1 (de) * | 2004-07-01 | 2006-01-04 | Interuniversitair Microelektronica Centrum Vzw | Verfahren zur Herstellung eines thermoelektrischen Generators und thermoelektrischer Generator dadurch erhalten |
US20060068611A1 (en) * | 2004-09-30 | 2006-03-30 | Weaver Stanton E Jr | Heat transfer device and system and method incorporating same |
US20060076046A1 (en) * | 2004-10-08 | 2006-04-13 | Nanocoolers, Inc. | Thermoelectric device structure and apparatus incorporating same |
US7523617B2 (en) * | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
US7260939B2 (en) * | 2004-12-17 | 2007-08-28 | General Electric Company | Thermal transfer device and system and method incorporating same |
US7293416B2 (en) * | 2004-12-23 | 2007-11-13 | Nanocoolers, Inc. | Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle |
US7475551B2 (en) | 2004-12-23 | 2009-01-13 | Nanocoolers, Inc. | System employing temporal integration of thermoelectric action |
US7296417B2 (en) * | 2004-12-23 | 2007-11-20 | Nanocoolers, Inc. | Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator |
GB0501413D0 (en) | 2005-01-24 | 2005-03-02 | Tavkhelidze Avto | Method for modification of built in potential of diodes |
US20060181855A1 (en) * | 2005-02-14 | 2006-08-17 | Asia Vital Component Co., Ltd. | Heat generation assembly with cooling structure |
US7498507B2 (en) | 2005-03-16 | 2009-03-03 | General Electric Company | Device for solid state thermal transfer and power generation |
WO2006113607A2 (en) * | 2005-04-18 | 2006-10-26 | Nextreme Thermal Solutions | Thermoelectric generators for solar conversion and related systems and methods |
US8227885B2 (en) | 2006-07-05 | 2012-07-24 | Borealis Technical Limited | Selective light absorbing semiconductor surface |
GB0617934D0 (en) | 2006-09-12 | 2006-10-18 | Borealis Tech Ltd | Transistor |
GB0618268D0 (en) | 2006-09-18 | 2006-10-25 | Tavkhelidze Avto | High efficiency solar cell with selective light absorbing surface |
US20080178920A1 (en) * | 2006-12-28 | 2008-07-31 | Schlumberger Technology Corporation | Devices for cooling and power |
US20080314429A1 (en) * | 2007-02-09 | 2008-12-25 | Stichting Imec Nederland | Method for Thermal Matching of a Thermoelectric Generator with a Heat Source Having High Thermal Resistance and Thermoelectric Generator thus Obtained |
EP1976034A3 (de) * | 2007-03-29 | 2011-11-09 | Stichting IMEC Nederland | Herstellungsverfahren für eine Thermosäule, damit hergestellte Thermosäule und thermoelektrischer Generator mit solchen Thermosäulen |
US20090214848A1 (en) * | 2007-10-04 | 2009-08-27 | Purdue Research Foundation | Fabrication of nanowire array composites for thermoelectric power generators and microcoolers |
US8018053B2 (en) * | 2008-01-31 | 2011-09-13 | Northrop Grumman Systems Corporation | Heat transfer device |
CN102130076B (zh) * | 2010-12-25 | 2012-05-30 | 紫光股份有限公司 | 一种热电式计算机芯片散热器 |
US8957299B2 (en) * | 2011-01-24 | 2015-02-17 | Samsung Electronics Co., Ltd. | Thermoelectric material including nano-inclusions, thermoelectric module and thermoelectric apparatus including the same |
FR2977976A1 (fr) * | 2011-07-13 | 2013-01-18 | St Microelectronics Rousset | Procede de generation d'energie electrique au sein d'une structure integree tridimensionnelle, et dispositif de liaison correspondant |
KR102001062B1 (ko) | 2012-01-16 | 2019-10-01 | 삼성전자주식회사 | 나노복합체형 열전재료, 이를 포함하는 열전모듈과 열전장치 |
CN102637816A (zh) * | 2012-05-15 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Led半导体散热支架 |
TWI499101B (zh) | 2012-07-13 | 2015-09-01 | Ind Tech Res Inst | 熱電轉換結構及使用其之散熱結構 |
US10164164B2 (en) * | 2013-06-13 | 2018-12-25 | Brian Isaac Ashkenazi | Futuristic hybrid thermoelectric devices and designs and methods of using same |
GB2521353A (en) | 2013-12-17 | 2015-06-24 | Ibm | Thermoelectric device |
TWI563698B (en) * | 2014-11-13 | 2016-12-21 | Univ Nat Tsing Hua | Manufacturing process of the thermoelectric conversion element |
US11124992B2 (en) | 2016-12-29 | 2021-09-21 | Townsteel, Inc. | Sliding actuator assembly for a latchset |
US10890020B2 (en) | 2016-12-29 | 2021-01-12 | Townsteel, Inc. | Double latch lockset |
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US3880674A (en) | 1970-01-20 | 1975-04-29 | Rockwell International Corp | Thermoelectric elements and devices and process therefor |
DE2547262C3 (de) * | 1975-10-22 | 1981-07-16 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische Anordnung mit großen Temperaturgradienten und Verwendung |
US4268710A (en) * | 1977-08-29 | 1981-05-19 | Minnesota Mining And Manufacturing Company | Hot-junction electrode members for copper/silver chalocogenides |
DE3404137A1 (de) | 1984-02-07 | 1985-08-08 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische anordnung mit fremdschicht-kontakten |
DE3404138A1 (de) | 1984-02-07 | 1985-08-08 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische anordnung mit engewiderstaenden |
DE3818192A1 (de) | 1988-05-28 | 1989-12-07 | Dahlberg Reinhard | Thermoelektrische anordnung mit tunnelkontakten |
JP2670366B2 (ja) | 1989-11-09 | 1997-10-29 | 日本原子力発電株式会社 | 熱電発電素子 |
EP0437654A1 (de) | 1990-01-16 | 1991-07-24 | Reinhard Dr. Dahlberg | Thermoelement-Schenkel mit richtungsabhängiger Quantisierung der Ladungsträger |
JPH05168846A (ja) | 1990-10-30 | 1993-07-02 | Nippondenso Co Ltd | 除湿装置 |
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JPH0539966A (ja) | 1991-08-07 | 1993-02-19 | Matsushita Electric Ind Co Ltd | ヒートポンプデバイス |
JP2924369B2 (ja) | 1991-11-20 | 1999-07-26 | 松下電器産業株式会社 | ヒートポンプデバイス |
JPH05226704A (ja) | 1992-02-10 | 1993-09-03 | Matsushita Electric Ind Co Ltd | 熱電装置およびその製造方法 |
JPH05266704A (ja) * | 1992-03-19 | 1993-10-15 | Shimizu Corp | 照明源を有する室内構造 |
RU2034207C1 (ru) | 1992-11-05 | 1995-04-30 | Товарищество с ограниченной ответственностью компании "Либрация" | Способ охлаждения объекта каскадной термоэлектрической батареей |
US5900071A (en) | 1993-01-12 | 1999-05-04 | Massachusetts Institute Of Technology | Superlattice structures particularly suitable for use as thermoelectric materials |
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JPH08125237A (ja) * | 1994-10-28 | 1996-05-17 | Aisin Seiki Co Ltd | 熱電素子 |
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US5712448A (en) | 1996-02-07 | 1998-01-27 | California Institute Of Technology | Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices |
WO1998044562A1 (en) * | 1997-03-31 | 1998-10-08 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
US5867990A (en) | 1997-12-10 | 1999-02-09 | International Business Machines Corporation | Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms |
US5966941A (en) | 1997-12-10 | 1999-10-19 | International Business Machines Corporation | Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms |
US6000225A (en) | 1998-04-27 | 1999-12-14 | International Business Machines Corporation | Two dimensional thermoelectric cooler configuration |
US6388185B1 (en) | 1998-08-07 | 2002-05-14 | California Institute Of Technology | Microfabricated thermoelectric power-generation devices |
US6161388A (en) | 1998-12-28 | 2000-12-19 | International Business Machines Corporation | Enhanced duty cycle design for micro thermoelectromechanical coolers |
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JP2000269561A (ja) * | 1999-03-19 | 2000-09-29 | Asahi Chem Ind Co Ltd | 複合構造体 |
-
2000
- 2000-12-07 US US09/731,614 patent/US6608250B2/en not_active Expired - Lifetime
-
2001
- 2001-11-23 AT AT01999225T patent/ATE521987T1/de not_active IP Right Cessation
- 2001-11-23 WO PCT/GB2001/005195 patent/WO2002047178A2/en active IP Right Grant
- 2001-11-23 AU AU2002220823A patent/AU2002220823A1/en not_active Abandoned
- 2001-11-23 JP JP2002548795A patent/JP4288067B2/ja not_active Expired - Lifetime
- 2001-11-23 IL IL15631901A patent/IL156319A0/xx not_active IP Right Cessation
- 2001-11-23 CN CN018184855A patent/CN1552106B/zh not_active Expired - Lifetime
- 2001-11-23 EP EP01999225A patent/EP1364416B1/de not_active Expired - Lifetime
- 2001-11-23 KR KR1020037007300A patent/KR100558802B1/ko not_active IP Right Cessation
- 2001-12-04 TW TW090129977A patent/TW538514B/zh not_active IP Right Cessation
-
2003
- 2003-06-04 IL IL156319A patent/IL156319A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2002047178A3 (en) | 2003-09-12 |
TW538514B (en) | 2003-06-21 |
AU2002220823A1 (en) | 2002-06-18 |
JP2004515926A (ja) | 2004-05-27 |
IL156319A0 (en) | 2004-01-04 |
IL156319A (en) | 2007-05-15 |
US6608250B2 (en) | 2003-08-19 |
EP1364416B1 (de) | 2011-08-24 |
CN1552106A (zh) | 2004-12-01 |
US20020092557A1 (en) | 2002-07-18 |
WO2002047178A2 (en) | 2002-06-13 |
JP4288067B2 (ja) | 2009-07-01 |
EP1364416A2 (de) | 2003-11-26 |
KR100558802B1 (ko) | 2006-03-10 |
KR20030059298A (ko) | 2003-07-07 |
CN1552106B (zh) | 2010-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |