ATE491762T1 - Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten - Google Patents
Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstratenInfo
- Publication number
- ATE491762T1 ATE491762T1 AT06802491T AT06802491T ATE491762T1 AT E491762 T1 ATE491762 T1 AT E491762T1 AT 06802491 T AT06802491 T AT 06802491T AT 06802491 T AT06802491 T AT 06802491T AT E491762 T1 ATE491762 T1 AT E491762T1
- Authority
- AT
- Austria
- Prior art keywords
- metallic substrate
- devices
- high temperature
- polymeric film
- metal substrates
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C3/00—Selection of compositions for coating the surfaces of moulds, cores, or patterns
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49227—Insulator making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Formation Of Insulating Films (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72170805P | 2005-09-29 | 2005-09-29 | |
PCT/US2006/033548 WO2007040870A1 (en) | 2005-09-29 | 2006-08-30 | Method of releasing high temperature films and/or devices from metallic substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE491762T1 true ATE491762T1 (de) | 2011-01-15 |
Family
ID=37496438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06802491T ATE491762T1 (de) | 2005-09-29 | 2006-08-30 | Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten |
Country Status (9)
Country | Link |
---|---|
US (2) | US8356407B2 (de) |
EP (1) | EP1940989B1 (de) |
JP (1) | JP2009510216A (de) |
KR (1) | KR101285575B1 (de) |
CN (1) | CN101278025A (de) |
AT (1) | ATE491762T1 (de) |
DE (1) | DE602006018976D1 (de) |
TW (1) | TWI404221B (de) |
WO (1) | WO2007040870A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7612143B2 (en) * | 1999-08-04 | 2009-11-03 | Hybrid Plastics, Inc. | Metallized nanostructured chemicals alloyed into polymers |
US7737228B2 (en) * | 2003-12-18 | 2010-06-15 | Hybrid Plastics, Inc. | Metallized polyhedral oligomeric silsesquioxanes as catalysts for polyurethanes |
JP5313478B2 (ja) * | 2007-10-05 | 2013-10-09 | 東レ・ダウコーニング株式会社 | セラミック状酸化ケイ素系被膜の形成方法、セラミック状酸化ケイ素系被膜を有する無機質基材の製造方法、セラミック状酸化ケイ素系被膜形成剤および半導体装置 |
ATE524530T1 (de) * | 2008-01-30 | 2011-09-15 | Dow Corning | Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik |
US9336925B1 (en) * | 2008-11-26 | 2016-05-10 | Thin Film Electronics Asa | Siloxanes, doped siloxanes, methods for their synthesis, compositions containing the same, and films formed therefrom |
JP5337572B2 (ja) * | 2009-04-30 | 2013-11-06 | 日東電工株式会社 | 積層体およびそれを用いた配線回路基板 |
KR101079650B1 (ko) | 2009-05-21 | 2011-11-03 | 주식회사 엠에스하이텍 | 반도체 리젝트 다이로부터 합성수지 필름을 제거하는 방법 |
WO2011142804A1 (en) * | 2010-05-10 | 2011-11-17 | The University Of Toledo | Flexible photovoltaic cells and modules having an improved adhesion characteristic |
WO2011150290A2 (en) | 2010-05-26 | 2011-12-01 | The University Of Toledo | Photovoltaic structures having a light scattering interface layer and methods of making the same |
CN101968127B (zh) * | 2010-09-17 | 2012-05-30 | 北京海林节能设备股份有限公司 | 集水器 |
US8871425B2 (en) * | 2012-02-09 | 2014-10-28 | Az Electronic Materials (Luxembourg) S.A.R.L. | Low dielectric photoimageable compositions and electronic devices made therefrom |
JP2015104843A (ja) * | 2013-11-29 | 2015-06-08 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法 |
US20170326850A1 (en) * | 2014-12-03 | 2017-11-16 | Tokyo Ohka Kogy Co., Ltd. | Laminate production method, substrate processing method, and laminate |
CN105118893A (zh) * | 2015-08-31 | 2015-12-02 | 苏州瑞晟纳米科技有限公司 | 一种微晶玻璃覆盖柔性薄膜太阳能电池样片的热处理方法 |
DE102015015452A1 (de) * | 2015-12-02 | 2017-06-08 | Forschungszentrum Jülich GmbH | Verfahren zum Planarisieren von Nanostrukturen |
TW201806779A (zh) | 2016-05-16 | 2018-03-01 | 道康寧公司 | 用於顯示裝置基板處理之包括矽倍半氧烷聚合物及矽烷中至少一者的黏合劑剝離層 |
CN106009016A (zh) * | 2016-08-11 | 2016-10-12 | 潘忠宁 | 一种单分散聚倍半硅氧烷球形薄膜制备方法 |
CN111629899A (zh) * | 2018-01-17 | 2020-09-04 | Agc株式会社 | 层叠体、层叠体的制造方法和电子设备的制造方法 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615272A (en) | 1968-11-04 | 1971-10-26 | Dow Corning | Condensed soluble hydrogensilsesquioxane resin |
US3649274A (en) * | 1969-09-18 | 1972-03-14 | Bunker Ramo | Coaxial circuit construction method |
US3691136A (en) | 1971-03-29 | 1972-09-12 | Standard Oil Co | Use of phosphorus compounds as stripping agents for polyamide-imide films |
US3990098A (en) * | 1972-12-22 | 1976-11-02 | E. I. Du Pont De Nemours And Co. | Structure capable of forming a diode and associated conductive path |
EP0021818B1 (de) | 1979-06-21 | 1983-10-05 | Fujitsu Limited | Elektronische Vorrichtung mit einer Mehrschicht-Bedrahtungsstruktur |
JPS5937736U (ja) * | 1982-08-31 | 1984-03-09 | 白光金属工業株式会社 | 集積回路の取外し装置 |
US4571354A (en) * | 1983-12-27 | 1986-02-18 | Rogers Corporation | Tape automated bonding of integrated circuits |
JPS60159014A (ja) * | 1984-01-31 | 1985-08-20 | Nippon Kogaku Kk <Nikon> | 精密成形品 |
JPS60244507A (ja) | 1984-05-18 | 1985-12-04 | Ube Ind Ltd | 芳香族ポリイミドフイルムの製造法 |
US4828162A (en) * | 1988-02-29 | 1989-05-09 | Hughes Aircraft Company | Moving jaw reflow soldering head |
JP2864389B2 (ja) | 1989-09-16 | 1999-03-03 | 株式会社ニコン | 超音波モータ |
US4999397A (en) | 1989-07-28 | 1991-03-12 | Dow Corning Corporation | Metastable silane hydrolyzates and process for their preparation |
US5010159A (en) | 1989-09-01 | 1991-04-23 | Dow Corning Corporation | Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol |
JP3103084B2 (ja) | 1989-12-08 | 2000-10-23 | 株式会社アイ.エス.テイ | 管状物の製造方法 |
CA2059020C (en) * | 1991-01-09 | 1998-08-18 | Kohji Kimbara | Polyimide multilayer wiring board and method of producing same |
US5174016A (en) * | 1991-04-25 | 1992-12-29 | Toddco General, Inc. | Chip removal apparatus and method of using same |
JPH05147055A (ja) * | 1991-11-26 | 1993-06-15 | Showa Alum Corp | プリント基板積層用離型シート |
US5715592A (en) * | 1994-11-08 | 1998-02-10 | Nec Corporation | Parts disassembling apparatus |
JPH09221630A (ja) * | 1996-02-13 | 1997-08-26 | Showa Denko Kk | 塗料組成物及びそれを用いて得られる塗膜 |
US5776235A (en) * | 1996-10-04 | 1998-07-07 | Dow Corning Corporation | Thick opaque ceramic coatings |
US6048804A (en) | 1997-04-29 | 2000-04-11 | Alliedsignal Inc. | Process for producing nanoporous silica thin films |
JPH10320989A (ja) | 1997-05-16 | 1998-12-04 | Toshiba Microelectron Corp | 不揮発性半導体メモリ |
EP0940427A1 (de) * | 1998-03-06 | 1999-09-08 | Imation Corp. | Verfahren zur Herstellung eines mikroporösen Films und bildempfindliches Element |
US6143643A (en) * | 1998-07-08 | 2000-11-07 | International Business Machines Corporation | Process for manufacture of integrated circuit device using organosilicate insulative matrices |
DE19835615A1 (de) * | 1998-08-06 | 2000-02-10 | Basf Ag | Für elektrochemische Zellen geeignete Zusammensetzungen |
US6464912B1 (en) * | 1999-01-06 | 2002-10-15 | Cvd, Incorporated | Method for producing near-net shape free standing articles by chemical vapor deposition |
CA2259043A1 (en) * | 1999-01-18 | 2000-07-18 | Ibm Canada Limited-Ibm Canada Limitee | Apparatus and method for non-destructive, low stress removal of soldered electronic components |
WO2000076014A2 (en) * | 1999-06-09 | 2000-12-14 | Moltech Corporation | Methods of preparing electrochemical cells |
US6342454B1 (en) * | 1999-11-16 | 2002-01-29 | International Business Machines Corporation | Electronic devices with dielectric compositions and method for their manufacture |
US6214733B1 (en) * | 1999-11-17 | 2001-04-10 | Elo Technologies, Inc. | Process for lift off and handling of thin film materials |
US6143360A (en) * | 1999-12-13 | 2000-11-07 | Dow Corning Corporation | Method for making nanoporous silicone resins from alkylydridosiloxane resins |
US6488721B1 (en) * | 2000-06-09 | 2002-12-03 | Moltech Corporation | Methods of preparing electrochemical cells |
US6271273B1 (en) * | 2000-07-14 | 2001-08-07 | Shipley Company, L.L.C. | Porous materials |
JP3848070B2 (ja) * | 2000-09-27 | 2006-11-22 | 株式会社東芝 | パターン形成方法 |
US6399210B1 (en) | 2000-11-27 | 2002-06-04 | Dow Corning Corporation | Alkoxyhydridosiloxane resins |
EP1223149A1 (de) * | 2001-01-10 | 2002-07-17 | Corning Incorporated | Silsesquioxan beschichtete Substrate zur Imobilisierung von Biomolekülen |
JP2002322370A (ja) * | 2001-04-24 | 2002-11-08 | Asahi Kasei Corp | シルセスキオキサン含有樹脂組成物 |
JP2004527320A (ja) * | 2001-05-07 | 2004-09-09 | コクレア リミテッド | 導電性部品の製造方法 |
JP3667661B2 (ja) | 2001-06-05 | 2005-07-06 | 昭和電線電纜株式会社 | ポリイミドスリーブの製造方法 |
JP2002361659A (ja) * | 2001-06-06 | 2002-12-18 | Rigaku Industrial Co | ポリイミドフィルムおよびその作製方法 |
US20030096090A1 (en) | 2001-10-22 | 2003-05-22 | Boisvert Ronald Paul | Etch-stop resins |
US6730617B2 (en) | 2002-04-24 | 2004-05-04 | Ibm | Method of fabricating one or more tiers of an integrated circuit |
GB0213722D0 (en) * | 2002-06-14 | 2002-07-24 | Suisse Electronique Microtech | Micro electrical mechanical systems |
JP3957611B2 (ja) * | 2002-10-30 | 2007-08-15 | 日東電工株式会社 | ポリシルセスキオキサン薄膜 |
JP4050631B2 (ja) * | 2003-02-21 | 2008-02-20 | 株式会社ルネサステクノロジ | 電子デバイスの製造方法 |
JP2004255795A (ja) | 2003-02-27 | 2004-09-16 | Fuji Xerox Co Ltd | 樹脂製無端ベルトの製造方法及び樹脂製無端ベルト |
JP2004319977A (ja) * | 2003-03-28 | 2004-11-11 | Fuji Photo Film Co Ltd | 絶縁膜形成用材料及びそれを用いた絶縁膜 |
US6875464B2 (en) * | 2003-04-22 | 2005-04-05 | General Electric Company | In-situ method and composition for repairing a thermal barrier coating |
JP4379002B2 (ja) * | 2003-05-30 | 2009-12-09 | 富士ゼロックス株式会社 | カーボンナノチューブデバイスの製造方法、並びに、カーボンナノチューブ転写体 |
JP2005045188A (ja) * | 2003-07-25 | 2005-02-17 | Fuji Xerox Co Ltd | 電子素子、集積回路およびその製造方法 |
US7622399B2 (en) * | 2003-09-23 | 2009-11-24 | Silecs Oy | Method of forming low-k dielectrics using a rapid curing process |
US20050069718A1 (en) * | 2003-09-30 | 2005-03-31 | Voss-Kehl Jessica L. | Printable insulating compositions and printable articles |
KR100861522B1 (ko) * | 2003-12-26 | 2008-10-02 | 후지제롯쿠스 가부시끼가이샤 | 정류 소자 및 그것을 사용한 전자 회로, 및 정류 소자의제조 방법 |
JP2005268405A (ja) * | 2004-03-17 | 2005-09-29 | Dow Corning Toray Co Ltd | 光学装置用金属ベース回路基板およびその製造方法 |
JP2008537643A (ja) * | 2005-04-06 | 2008-09-18 | アクゾ ノーベル ナムローゼ フェンノートシャップ | たとえばtcoの無機コーティングを有する箔片の製造方法 |
WO2007111008A1 (ja) * | 2006-03-28 | 2007-10-04 | Sharp Kabushiki Kaisha | 半導体素子の転写方法及び半導体装置の製造方法並びに半導体装置 |
KR100813850B1 (ko) * | 2007-03-29 | 2008-03-17 | 삼성에스디아이 주식회사 | 발광 장치 |
US7790503B2 (en) * | 2007-12-18 | 2010-09-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming integrated passive device module |
ATE524530T1 (de) | 2008-01-30 | 2011-09-15 | Dow Corning | Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik |
US7838332B2 (en) * | 2008-11-26 | 2010-11-23 | Infineon Technologies Ag | Method of manufacturing a semiconductor package with a bump using a carrier |
-
2006
- 2006-08-30 KR KR1020087007670A patent/KR101285575B1/ko active Active
- 2006-08-30 DE DE200660018976 patent/DE602006018976D1/de active Active
- 2006-08-30 WO PCT/US2006/033548 patent/WO2007040870A1/en active Application Filing
- 2006-08-30 CN CNA2006800360886A patent/CN101278025A/zh active Pending
- 2006-08-30 AT AT06802491T patent/ATE491762T1/de not_active IP Right Cessation
- 2006-08-30 JP JP2008533362A patent/JP2009510216A/ja active Pending
- 2006-08-30 US US11/991,831 patent/US8356407B2/en not_active Expired - Fee Related
- 2006-08-30 EP EP20060802491 patent/EP1940989B1/de not_active Not-in-force
- 2006-09-15 TW TW95134153A patent/TWI404221B/zh not_active IP Right Cessation
-
2012
- 2012-12-12 US US13/711,780 patent/US20130108501A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1940989B1 (de) | 2010-12-15 |
TWI404221B (zh) | 2013-08-01 |
US8356407B2 (en) | 2013-01-22 |
KR101285575B1 (ko) | 2013-07-15 |
KR20080063761A (ko) | 2008-07-07 |
WO2007040870A1 (en) | 2007-04-12 |
JP2009510216A (ja) | 2009-03-12 |
US20090098393A1 (en) | 2009-04-16 |
CN101278025A (zh) | 2008-10-01 |
EP1940989A1 (de) | 2008-07-09 |
US20130108501A1 (en) | 2013-05-02 |
DE602006018976D1 (de) | 2011-01-27 |
TW200721524A (en) | 2007-06-01 |
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