ATE419560T1 - Kopieren eines musters mit hilfe eines zwischenstempels - Google Patents
Kopieren eines musters mit hilfe eines zwischenstempelsInfo
- Publication number
- ATE419560T1 ATE419560T1 AT05110290T AT05110290T ATE419560T1 AT E419560 T1 ATE419560 T1 AT E419560T1 AT 05110290 T AT05110290 T AT 05110290T AT 05110290 T AT05110290 T AT 05110290T AT E419560 T1 ATE419560 T1 AT E419560T1
- Authority
- AT
- Austria
- Prior art keywords
- polymer stamp
- moldable layer
- pattern
- template
- target surface
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Steroid Compounds (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Credit Cards Or The Like (AREA)
- Color Printing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59515405P | 2005-06-10 | 2005-06-10 | |
EP05105100A EP1731961B1 (de) | 2005-06-10 | 2005-06-10 | Verfahren zum Kopieren eines Modells |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE419560T1 true ATE419560T1 (de) | 2009-01-15 |
Family
ID=35717449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05110290T ATE419560T1 (de) | 2005-06-10 | 2005-11-03 | Kopieren eines musters mit hilfe eines zwischenstempels |
Country Status (12)
Country | Link |
---|---|
US (1) | US7704425B2 (de) |
EP (2) | EP1959299B1 (de) |
JP (1) | JP5276436B2 (de) |
KR (1) | KR101229100B1 (de) |
CN (1) | CN101198903B (de) |
AT (1) | ATE419560T1 (de) |
DE (1) | DE602005012068D1 (de) |
ES (1) | ES2317159T3 (de) |
HK (2) | HK1096162A1 (de) |
MY (1) | MY152606A (de) |
TW (2) | TWI313788B (de) |
WO (1) | WO2006131153A1 (de) |
Families Citing this family (131)
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US9040090B2 (en) | 2003-12-19 | 2015-05-26 | The University Of North Carolina At Chapel Hill | Isolated and fixed micro and nano structures and methods thereof |
US20070228608A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Preserving Filled Features when Vacuum Wiping |
EP1731965B1 (de) * | 2005-06-10 | 2012-08-08 | Obducat AB | Druckstempel mit zyklischem Olefincopolymer |
US7854873B2 (en) | 2005-06-10 | 2010-12-21 | Obducat Ab | Imprint stamp comprising cyclic olefin copolymer |
US7586601B2 (en) | 2005-06-14 | 2009-09-08 | Ebstein Steven M | Applications of laser-processed substrate for molecular diagnostics |
US7715003B2 (en) | 2005-06-14 | 2010-05-11 | President & Fellows Of Harvard College | Metalized semiconductor substrates for raman spectroscopy |
US8184284B2 (en) | 2005-06-14 | 2012-05-22 | Ebstein Steven M | Laser-processed substrate for molecular diagnostics |
EP1925019A4 (de) * | 2005-09-15 | 2012-03-28 | Dow Corning | Nano-formprozess |
JP2007133970A (ja) * | 2005-11-10 | 2007-05-31 | Canon Inc | 光記録媒体およびその製造方法 |
ATE549294T1 (de) * | 2005-12-09 | 2012-03-15 | Obducat Ab | Vorrichtung und verfahren zum transfer von mustern mit zwischenstempel |
US7500431B2 (en) * | 2006-01-12 | 2009-03-10 | Tsai-Wei Wu | System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure |
US7377765B2 (en) | 2006-02-14 | 2008-05-27 | Hitachi Global Storage Technologies | System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper |
US7862756B2 (en) * | 2006-03-30 | 2011-01-04 | Asml Netherland B.V. | Imprint lithography |
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US8294891B2 (en) | 2007-01-23 | 2012-10-23 | President And Fellows Of Harvard College | Non-invasive optical analysis using surface enhanced raman spectroscopy |
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Also Published As
Publication number | Publication date |
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KR20080023252A (ko) | 2008-03-12 |
TW200705123A (en) | 2007-02-01 |
EP1959299A2 (de) | 2008-08-20 |
HK1096162A1 (en) | 2007-05-25 |
TWI416280B (zh) | 2013-11-21 |
EP1731962B1 (de) | 2008-12-31 |
KR101229100B1 (ko) | 2013-02-15 |
TW200643613A (en) | 2006-12-16 |
CN101198903B (zh) | 2011-09-07 |
HK1121243A1 (en) | 2009-04-17 |
EP1731962A1 (de) | 2006-12-13 |
JP2008542081A (ja) | 2008-11-27 |
TWI313788B (en) | 2009-08-21 |
US20060279025A1 (en) | 2006-12-14 |
ES2317159T3 (es) | 2009-04-16 |
US7704425B2 (en) | 2010-04-27 |
MY152606A (en) | 2014-10-31 |
CN101198903A (zh) | 2008-06-11 |
EP1959299A3 (de) | 2010-10-06 |
DE602005012068D1 (de) | 2009-02-12 |
EP1959299B1 (de) | 2012-12-26 |
JP5276436B2 (ja) | 2013-08-28 |
WO2006131153A1 (en) | 2006-12-14 |
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