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ATE395567T1 - METHOD FOR PRODUCING A HEAT EXCHANGER DEVICE - Google Patents

METHOD FOR PRODUCING A HEAT EXCHANGER DEVICE

Info

Publication number
ATE395567T1
ATE395567T1 AT04025179T AT04025179T ATE395567T1 AT E395567 T1 ATE395567 T1 AT E395567T1 AT 04025179 T AT04025179 T AT 04025179T AT 04025179 T AT04025179 T AT 04025179T AT E395567 T1 ATE395567 T1 AT E395567T1
Authority
AT
Austria
Prior art keywords
evaporator
heat conductor
connecting pipe
hollow tube
mortised
Prior art date
Application number
AT04025179T
Other languages
German (de)
Inventor
Bin-Juine Huang
Chern-Shi Lam
Chih-Hung Wang
Huan-Hsiang Huang
Yu-Yuan Yen
Original Assignee
Advanced Thermal Device Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Thermal Device Inc filed Critical Advanced Thermal Device Inc
Application granted granted Critical
Publication of ATE395567T1 publication Critical patent/ATE395567T1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Air-Conditioning For Vehicles (AREA)
  • Separation By Low-Temperature Treatments (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
  • Details Of Heat-Exchange And Heat-Transfer (AREA)

Abstract

The heat transfer device (200) at least comprises: an evaporator (210), a heat conductor (220) and a connecting pipe (230). The evaporator (210) comprises: a first holow tube; a porous core (214) mortised inside the first hollow tube (212), and a second hollow tube (216) mortised on the first hollow tube (212). The heat conductor (220) covers the evaporator (210). The heat conductor (220) is on the heating device. The connecting pipe (230) is connected to first and second hollow tubes (212,216). The connecting pipe (230) is used for containing a working fluid. The condenser is on the connecting pipe. The porous core (214), the first and second hollow tube (212,216), and the heat conductor (220) are mortised together so as to simplify the manufacturing process, and reduce the cost. Further, the evaporator (210) is tightly covered and fixed by the heat conductor (220) so that the heat generated by the heating device (20) can be uniformly conducted to the evaporator (210).
AT04025179T 2003-10-27 2004-10-22 METHOD FOR PRODUCING A HEAT EXCHANGER DEVICE ATE395567T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2003101023642A CN1303494C (en) 2003-10-27 2003-10-27 Heat removal device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
ATE395567T1 true ATE395567T1 (en) 2008-05-15

Family

ID=34398368

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04025179T ATE395567T1 (en) 2003-10-27 2004-10-22 METHOD FOR PRODUCING A HEAT EXCHANGER DEVICE

Country Status (5)

Country Link
EP (2) EP1528349B1 (en)
CN (1) CN1303494C (en)
AT (1) ATE395567T1 (en)
DE (1) DE602004013702D1 (en)
ES (1) ES2305643T3 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7116840B2 (en) 2002-10-31 2006-10-03 Microsoft Corporation Decoding and error correction in 2-D arrays
US7133563B2 (en) 2002-10-31 2006-11-07 Microsoft Corporation Passive embedded interaction code
US7583842B2 (en) 2004-01-06 2009-09-01 Microsoft Corporation Enhanced approach of m-array decoding and error correction
US7263224B2 (en) 2004-01-16 2007-08-28 Microsoft Corporation Strokes localization by m-array decoding and fast image matching
US7607076B2 (en) 2005-02-18 2009-10-20 Microsoft Corporation Embedded interaction code document
US7826074B1 (en) 2005-02-25 2010-11-02 Microsoft Corporation Fast embedded interaction code printing with custom postscript commands
US7599560B2 (en) 2005-04-22 2009-10-06 Microsoft Corporation Embedded interaction code recognition
US7421439B2 (en) 2005-04-22 2008-09-02 Microsoft Corporation Global metadata embedding and decoding
US7400777B2 (en) 2005-05-25 2008-07-15 Microsoft Corporation Preprocessing for information pattern analysis
US7729539B2 (en) 2005-05-31 2010-06-01 Microsoft Corporation Fast error-correcting of embedded interaction codes
US7580576B2 (en) 2005-06-02 2009-08-25 Microsoft Corporation Stroke localization and binding to electronic document
US7619607B2 (en) 2005-06-30 2009-11-17 Microsoft Corporation Embedding a pattern design onto a liquid crystal display
US7622182B2 (en) 2005-08-17 2009-11-24 Microsoft Corporation Embedded interaction code enabled display
US7817816B2 (en) 2005-08-17 2010-10-19 Microsoft Corporation Embedded interaction code enabled surface type identification
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
JP2012149819A (en) * 2011-01-19 2012-08-09 Fujitsu Ltd Loop heat pipe, and electronic device
CN104519706A (en) * 2013-09-26 2015-04-15 君瞻科技股份有限公司 Heat pipe
JP6230020B2 (en) * 2013-10-02 2017-11-15 国立大学法人名古屋大学 Loop type heat pipe and method for manufacturing loop type heat pipe
CN105423790A (en) * 2015-12-04 2016-03-23 王轶珂 Heat absorption and dissipation device
DE102016105592A1 (en) * 2016-03-24 2017-09-28 Benteler Automobiltechnik Gmbh Heating device and method for heating a motor vehicle
JP6805438B2 (en) * 2016-10-19 2020-12-23 国立大学法人東海国立大学機構 Heat exchangers, evaporators, and equipment
CN107317574B (en) * 2017-06-09 2020-08-11 南京理工大学 Self-cooling high voltage pulse switching device
EP4019252A1 (en) * 2020-12-23 2022-06-29 ABB Schweiz AG Heat-transfer device and method to produce such a device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387653A (en) * 1967-01-26 1968-06-11 Wakefield Eng Inc Heat transfer apparatus
US3750745A (en) * 1970-07-06 1973-08-07 R Moore High heat flux heat pipe
JPS5347057A (en) * 1976-10-13 1978-04-27 Oki Densen Kk Heat pipe and production thereof
DE3042985A1 (en) * 1980-11-14 1982-06-24 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover Heat-sink for electronic components - has heat-pipes connected end=to=end to cover long distances
JPS602892A (en) * 1983-06-20 1985-01-09 Toshiba Corp Heat pipe
DE3679978D1 (en) * 1985-12-13 1991-08-01 Hasler Ag Ascom METHOD AND DEVICE FOR DISCHARGING THE LOSS OF HEAT AT LEAST ONE ASSEMBLY OF ELECTRICAL ELEMENTS.
JP3450148B2 (en) * 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
JP3857774B2 (en) * 1997-03-19 2006-12-13 株式会社フジクラ Heat pipe holding structure
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
CN2543122Y (en) * 2002-03-20 2003-04-02 鸿富锦精密工业（深圳）有限公司 Heat Pipe radiator

Also Published As

Publication number Publication date
CN1612083A (en) 2005-05-04
DE602004013702D1 (en) 2008-06-26
ES2305643T3 (en) 2008-11-01
CN1303494C (en) 2007-03-07
EP1528349B1 (en) 2008-05-14
EP1528349A1 (en) 2005-05-04
EP1906128A3 (en) 2008-04-09
EP1906128A2 (en) 2008-04-02

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Legal Events

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