ATE300098T1 - Heisse platte - Google Patents
Heisse platteInfo
- Publication number
- ATE300098T1 ATE300098T1 AT01938705T AT01938705T ATE300098T1 AT E300098 T1 ATE300098 T1 AT E300098T1 AT 01938705 T AT01938705 T AT 01938705T AT 01938705 T AT01938705 T AT 01938705T AT E300098 T1 ATE300098 T1 AT E300098T1
- Authority
- AT
- Austria
- Prior art keywords
- hot plate
- ceramic substrate
- superior
- temperature
- present
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000001816 cooling Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052734 helium Inorganic materials 0.000 abstract 1
- 239000001307 helium Substances 0.000 abstract 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Optical Integrated Circuits (AREA)
- Ceramic Products (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000181941A JP3516392B2 (ja) | 2000-06-16 | 2000-06-16 | 半導体製造・検査装置用ホットプレート |
| PCT/JP2001/005147 WO2001097264A1 (fr) | 2000-06-16 | 2001-06-15 | Plaque chauffante |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE300098T1 true ATE300098T1 (de) | 2005-08-15 |
Family
ID=18682795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01938705T ATE300098T1 (de) | 2000-06-16 | 2001-06-15 | Heisse platte |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6825555B2 (de) |
| EP (1) | EP1229571B1 (de) |
| JP (1) | JP3516392B2 (de) |
| AT (1) | ATE300098T1 (de) |
| DE (1) | DE60112033T2 (de) |
| WO (1) | WO2001097264A1 (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550477A (zh) * | 1999-09-06 | 2004-12-01 | Ibiden股份有限公司 | 含碳的氮化铝烧结体，用于半导体制造/检测设备的基材 |
| WO2001062686A1 (fr) * | 2000-02-24 | 2001-08-30 | Ibiden Co., Ltd. | Piece frittee en nitrure d'aluminium, substrat en ceramique, corps chauffant en ceramique et mandrin electrostatique |
| JP2001247382A (ja) * | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | セラミック基板 |
| WO2001078456A1 (fr) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Element ceramique chauffant |
| JP3516392B2 (ja) * | 2000-06-16 | 2004-04-05 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
| TW512645B (en) * | 2000-07-25 | 2002-12-01 | Ibiden Co Ltd | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clamp holder, and substrate for wafer prober |
| US20040253551A1 (en) * | 2003-03-06 | 2004-12-16 | Tsuyoshi Shibata | Baking apparatus, substrate heat treatment method and semiconductor device manufacturing method for using baking apparatus, pattern forming method and semiconductor device manufacturing method for using pattern forming method |
| DE10356790A1 (de) * | 2003-12-04 | 2005-07-07 | BSH Bosch und Siemens Hausgeräte GmbH | Heizvorrichtung für Fluide, Durchlauferhitzer und Verfahren zu deren Herstellung |
| US20060011139A1 (en) * | 2004-07-16 | 2006-01-19 | Applied Materials, Inc. | Heated substrate support for chemical vapor deposition |
| US20060088692A1 (en) * | 2004-10-22 | 2006-04-27 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/examining device |
| US7730737B2 (en) * | 2004-12-21 | 2010-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cooling station lifter pins |
| US8282768B1 (en) | 2005-04-26 | 2012-10-09 | Novellus Systems, Inc. | Purging of porogen from UV cure chamber |
| US8137465B1 (en) | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
| US20100270004A1 (en) * | 2005-05-12 | 2010-10-28 | Landess James D | Tailored profile pedestal for thermo-elastically stable cooling or heating of substrates |
| KR100771628B1 (ko) * | 2006-05-11 | 2007-10-31 | 엘지전자 주식회사 | 전기레인지 |
| JP4394667B2 (ja) * | 2006-08-22 | 2010-01-06 | 日本碍子株式会社 | ヒータ付き静電チャックの製造方法 |
| WO2008105958A2 (en) * | 2006-10-16 | 2008-09-04 | Alcon Research, Ltd. | Ceramic chamber with integrated temperature control device for ophthalmic medical device |
| US7960297B1 (en) | 2006-12-07 | 2011-06-14 | Novellus Systems, Inc. | Load lock design for rapid wafer heating |
| US8052419B1 (en) * | 2007-11-08 | 2011-11-08 | Novellus Systems, Inc. | Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation |
| US8033769B2 (en) * | 2007-11-30 | 2011-10-11 | Novellus Systems, Inc. | Loadlock designs and methods for using same |
| US20090277388A1 (en) * | 2008-05-09 | 2009-11-12 | Applied Materials, Inc. | Heater with detachable shaft |
| US8288288B1 (en) | 2008-06-16 | 2012-10-16 | Novellus Systems, Inc. | Transferring heat in loadlocks |
| US8033771B1 (en) * | 2008-12-11 | 2011-10-11 | Novellus Systems, Inc. | Minimum contact area wafer clamping with gas flow for rapid wafer cooling |
| US8371567B2 (en) | 2011-04-13 | 2013-02-12 | Novellus Systems, Inc. | Pedestal covers |
| WO2013103594A1 (en) | 2012-01-06 | 2013-07-11 | Novellus Systems, Inc. | Adaptive heat transfer methods and systems for uniform heat transfer |
| US9984866B2 (en) * | 2012-06-12 | 2018-05-29 | Component Re-Engineering Company, Inc. | Multiple zone heater |
| JP6219229B2 (ja) * | 2014-05-19 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構 |
| US10347547B2 (en) | 2016-08-09 | 2019-07-09 | Lam Research Corporation | Suppressing interfacial reactions by varying the wafer temperature throughout deposition |
| JP7202322B2 (ja) * | 2020-02-03 | 2023-01-11 | 日本碍子株式会社 | セラミックヒータ |
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|---|---|---|---|---|
| US6635853B2 (en) * | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
| US4092520A (en) * | 1976-12-16 | 1978-05-30 | Baxter Travenol Laboratories, Inc. | Leakage current thermostat |
| JPH03138101A (ja) * | 1989-10-24 | 1991-06-12 | Matsushita Electric Ind Co Ltd | 高密度セラミック基板の製造方法 |
| US5229549A (en) * | 1989-11-13 | 1993-07-20 | Sumitomo Electric Industries, Ltd. | Ceramic circuit board and a method of manufacturing the ceramic circuit board |
| JP2763664B2 (ja) | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
| JPH05238710A (ja) | 1992-02-26 | 1993-09-17 | Sumitomo Electric Ind Ltd | 窒化ケイ素粉末 |
| JPH05201766A (ja) * | 1992-01-27 | 1993-08-10 | Denki Kagaku Kogyo Kk | 窒化珪素質焼結体 |
| JPH0648840A (ja) | 1992-07-31 | 1994-02-22 | Kyocera Corp | 窒化アルミニウム質基板 |
| US5413360A (en) | 1992-12-01 | 1995-05-09 | Kyocera Corporation | Electrostatic chuck |
| JP3340171B2 (ja) | 1993-01-29 | 2002-11-05 | 旭硝子株式会社 | 窒化アルミニウム焼結体の製造方法 |
| JP3138101B2 (ja) | 1993-02-23 | 2001-02-26 | ミサワホーム株式会社 | 建物ユニット |
| JPH07126070A (ja) * | 1993-10-29 | 1995-05-16 | Kyocera Corp | 炭化珪素質焼結体の製造方法 |
| JPH07307377A (ja) | 1993-12-27 | 1995-11-21 | Shin Etsu Chem Co Ltd | 静電チャック付セラミックスヒーター |
| JP3662955B2 (ja) | 1994-09-16 | 2005-06-22 | 株式会社東芝 | 回路基板および回路基板の製造方法 |
| JP2807429B2 (ja) | 1995-09-13 | 1998-10-08 | 株式会社東芝 | 窒化アルミニウム焼結体 |
| JP3670416B2 (ja) * | 1995-11-01 | 2005-07-13 | 日本碍子株式会社 | 金属包含材および静電チャック |
| JPH10287483A (ja) * | 1997-04-09 | 1998-10-27 | Ngk Insulators Ltd | 気密部品およびその製造方法 |
| JP3165396B2 (ja) * | 1997-07-19 | 2001-05-14 | イビデン株式会社 | ヒーターおよびその製造方法 |
| JPH11209171A (ja) | 1998-01-21 | 1999-08-03 | Kyocera Corp | 緻密質低熱膨張セラミックス及びその製造方法、並びに半導体製造装置用部材 |
| JPH11343168A (ja) | 1998-05-29 | 1999-12-14 | Kyocera Corp | 低熱膨張黒色セラミックス及びその製造方法、並びに半導体製造装置用部材 |
| JPH11220012A (ja) | 1998-01-30 | 1999-08-10 | Kyocera Corp | 静電チャック |
| JP2000058237A (ja) * | 1998-06-05 | 2000-02-25 | Ngk Spark Plug Co Ltd | セラミックヒ―タ及びそれを用いた酸素センサ |
| JP2000063177A (ja) | 1998-08-11 | 2000-02-29 | Ngk Insulators Ltd | 窒化アルミニウム質焼結体、金属埋設品および半導体保持装置 |
| TW444893U (en) * | 1998-08-26 | 2001-07-01 | Mitac Int Corp | Computer with the continuous balance display |
| JP2000277239A (ja) | 1999-03-19 | 2000-10-06 | Sumitomo Osaka Cement Co Ltd | セラミックスヒータ |
| JP2000277592A (ja) | 1999-03-19 | 2000-10-06 | Sumitomo Osaka Cement Co Ltd | 基板保持装置 |
| WO2000069219A1 (fr) * | 1999-05-07 | 2000-11-16 | Ibiden Co., Ltd. | Plaque chauffante et son procede de fabrication |
| US6835916B2 (en) * | 1999-08-09 | 2004-12-28 | Ibiden, Co., Ltd | Ceramic heater |
| JP2001118664A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| JP3381909B2 (ja) * | 1999-08-10 | 2003-03-04 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| EP1120829A4 (de) * | 1999-08-10 | 2009-05-27 | Ibiden Co Ltd | Keramische platte für halbleiterproduktionsanordnung |
| CN1550477A (zh) * | 1999-09-06 | 2004-12-01 | Ibiden股份有限公司 | 含碳的氮化铝烧结体，用于半导体制造/检测设备的基材 |
| WO2001031978A1 (fr) * | 1999-10-22 | 2001-05-03 | Ibiden Co., Ltd. | Plaque chauffante en ceramique |
| US6632512B1 (en) * | 1999-11-10 | 2003-10-14 | Ibiden Co., Ltd. | Ceramic substrate |
| WO2001039551A1 (fr) | 1999-11-19 | 2001-05-31 | Ibiden Co., Ltd. | Plaque chauffante en ceramique |
| EP1137321A1 (de) * | 1999-11-30 | 2001-09-26 | Ibiden Co., Ltd. | Keramisches heizelement |
| WO2002091457A1 (fr) * | 1999-12-09 | 2002-11-14 | Ibiden Co., Ltd. | Plaque ceramique pour appareil de production/controle de semi-conducteurs |
| JP2001237053A (ja) * | 1999-12-14 | 2001-08-31 | Ibiden Co Ltd | 半導体製造・検査装置用セラミックヒータおよび支持ピン |
| US20040016746A1 (en) * | 1999-12-29 | 2004-01-29 | Ibiden Co., Ltd. | Ceramic heater |
| JP3228923B2 (ja) | 2000-01-18 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| JP3228924B2 (ja) | 2000-01-21 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| US6891263B2 (en) * | 2000-02-07 | 2005-05-10 | Ibiden Co., Ltd. | Ceramic substrate for a semiconductor production/inspection device |
| US7011874B2 (en) * | 2000-02-08 | 2006-03-14 | Ibiden Co., Ltd. | Ceramic substrate for semiconductor production and inspection devices |
| EP1187185A1 (de) * | 2000-02-10 | 2002-03-13 | Ibiden Co., Ltd. | Heizplatteneinheit |
| WO2001062686A1 (fr) * | 2000-02-24 | 2001-08-30 | Ibiden Co., Ltd. | Piece frittee en nitrure d'aluminium, substrat en ceramique, corps chauffant en ceramique et mandrin electrostatique |
| JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
| US20030098299A1 (en) * | 2000-03-06 | 2003-05-29 | Ibiden Co., Ltd. | Ceramic heater |
| WO2001066488A1 (fr) * | 2000-03-07 | 2001-09-13 | Ibiden Co., Ltd. | Substrat ceramique pour fabrication/inspection de semi-conducteur |
| JP2001253777A (ja) * | 2000-03-13 | 2001-09-18 | Ibiden Co Ltd | セラミック基板 |
| US20040074586A1 (en) * | 2000-03-15 | 2004-04-22 | Yasuji Hiramatsu | Method of producing electrostatic chucks and method of producing ceramic heaters |
| EP1272006A1 (de) * | 2000-04-07 | 2003-01-02 | Ibiden Co., Ltd. | Keramisches heizelement |
| WO2001078456A1 (fr) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Element ceramique chauffant |
| WO2001078455A1 (fr) * | 2000-04-10 | 2001-10-18 | Ibiden Co., Ltd. | Plaque ceramique |
| JP3565496B2 (ja) * | 2000-04-13 | 2004-09-15 | イビデン株式会社 | セラミックヒータ、静電チャックおよびウエハプローバ |
| WO2001080601A1 (fr) * | 2000-04-14 | 2001-10-25 | Ibiden Co., Ltd. | Dispositif de chauffage en ceramique |
| JP2001302330A (ja) * | 2000-04-24 | 2001-10-31 | Ibiden Co Ltd | セラミック基板 |
| US20020134775A1 (en) * | 2000-04-29 | 2002-09-26 | Jun Ohashi | Ceramic heater and method of controlling temperature of the ceramic heater |
| JP2002025758A (ja) * | 2000-05-02 | 2002-01-25 | Ibiden Co Ltd | ホットプレートユニット |
| EP1225790A1 (de) * | 2000-05-02 | 2002-07-24 | Ibiden Co., Ltd. | Keramisches heizelement |
| US20020155262A1 (en) * | 2000-05-02 | 2002-10-24 | Yasutaka Ito | Ceramic heater |
| WO2001086717A1 (fr) * | 2000-05-10 | 2001-11-15 | Ibiden Co., Ltd. | Mandrin electrostatique |
| WO2001091166A1 (fr) * | 2000-05-26 | 2001-11-29 | Ibiden Co., Ltd. | Dispositif de fabrication et de controle d'un semi-conducteur |
| EP1220303B1 (de) * | 2000-06-02 | 2004-09-08 | Ibiden Co., Ltd. | Heizplatteneinheit |
| JP3618640B2 (ja) * | 2000-06-15 | 2005-02-09 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
| JP3516392B2 (ja) * | 2000-06-16 | 2004-04-05 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
| WO2002003434A1 (fr) * | 2000-07-03 | 2002-01-10 | Ibiden Co., Ltd. | Radiateur ceramique pour appareil de fabrication ou de test de semi-conducteurs |
| EP1229572A1 (de) * | 2000-07-04 | 2002-08-07 | Ibiden Co., Ltd. | Heisse platte für die verarbeitung und das testen von halbleitern |
| EP1255284A1 (de) * | 2000-07-19 | 2002-11-06 | Ibiden Co., Ltd. | Keramischer heizkörper für die bearbeitung bzw. das testen von halbleitern |
| US6967312B2 (en) * | 2000-07-19 | 2005-11-22 | Ibiden Co., Ltd. | Semiconductor manufacturing/testing ceramic heater, production method for the ceramic heater and production system for the ceramic heater |
| TW512645B (en) * | 2000-07-25 | 2002-12-01 | Ibiden Co Ltd | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clamp holder, and substrate for wafer prober |
| US6878906B2 (en) * | 2000-08-30 | 2005-04-12 | Ibiden Co., Ltd. | Ceramic heater for semiconductor manufacturing and inspecting equipment |
| JP2002076102A (ja) * | 2000-08-31 | 2002-03-15 | Ibiden Co Ltd | セラミック基板 |
| US20040035846A1 (en) * | 2000-09-13 | 2004-02-26 | Yasuji Hiramatsu | Ceramic heater for semiconductor manufacturing and inspecting equipment |
| JP2002160974A (ja) * | 2000-11-22 | 2002-06-04 | Ibiden Co Ltd | 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、セラミック基板およびセラミック基板の製造方法 |
| JPWO2002043441A1 (ja) * | 2000-11-24 | 2004-04-02 | イビデン株式会社 | セラミックヒータ、および、セラミックヒータの製造方法 |
| JP2002170651A (ja) * | 2000-11-29 | 2002-06-14 | Ibiden Co Ltd | セラミックヒータ |
| US20030000938A1 (en) * | 2000-12-01 | 2003-01-02 | Yanling Zhou | Ceramic heater, and ceramic heater resistor paste |
| EP1341216A1 (de) * | 2000-12-05 | 2003-09-03 | Ibiden Co., Ltd. | Keramisches substrat für vorrrichtungen zur herstellung und überprüfung von halbleitern und verfahren zur herstellung dieses substrats |
| IL154264A0 (en) * | 2001-06-06 | 2003-09-17 | Ibiden Co Ltd | Wafer prober |
| EP1422754A1 (de) * | 2001-08-10 | 2004-05-26 | Ibiden Co., Ltd. | Keramischer verbindungskörper |
-
2000
- 2000-06-16 JP JP2000181941A patent/JP3516392B2/ja not_active Expired - Fee Related
-
2001
- 2001-06-15 EP EP01938705A patent/EP1229571B1/de not_active Expired - Lifetime
- 2001-06-15 WO PCT/JP2001/005147 patent/WO2001097264A1/ja active IP Right Grant
- 2001-06-15 US US10/048,989 patent/US6825555B2/en not_active Expired - Lifetime
- 2001-06-15 AT AT01938705T patent/ATE300098T1/de not_active IP Right Cessation
- 2001-06-15 DE DE60112033T patent/DE60112033T2/de not_active Expired - Lifetime
-
2004
- 2004-07-29 US US10/901,109 patent/US20050258164A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002008828A (ja) | 2002-01-11 |
| DE60112033D1 (de) | 2005-08-25 |
| EP1229571B1 (de) | 2005-07-20 |
| US6825555B2 (en) | 2004-11-30 |
| EP1229571A4 (de) | 2003-01-29 |
| WO2001097264A1 (fr) | 2001-12-20 |
| EP1229571A1 (de) | 2002-08-07 |
| DE60112033T2 (de) | 2006-06-08 |
| US20030010765A1 (en) | 2003-01-16 |
| JP3516392B2 (ja) | 2004-04-05 |
| US20050258164A1 (en) | 2005-11-24 |
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