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ATE251783T1 - Flip chip montage eines ic-kartenelements - Google Patents

Flip chip montage eines ic-kartenelements

Info

Publication number
ATE251783T1
ATE251783T1 AT00985420T AT00985420T ATE251783T1 AT E251783 T1 ATE251783 T1 AT E251783T1 AT 00985420 T AT00985420 T AT 00985420T AT 00985420 T AT00985420 T AT 00985420T AT E251783 T1 ATE251783 T1 AT E251783T1
Authority
AT
Austria
Prior art keywords
integrated circuit
flip chip
card element
chip assembly
support
Prior art date
Application number
AT00985420T
Other languages
English (en)
Inventor
Sophie Girard
Stephane Provost
Original Assignee
Schlumberger Systems & Service
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systems & Service filed Critical Schlumberger Systems & Service
Application granted granted Critical
Publication of ATE251783T1 publication Critical patent/ATE251783T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
AT00985420T 1999-12-30 2000-12-13 Flip chip montage eines ic-kartenelements ATE251783T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9916736A FR2803413A1 (fr) 1999-12-30 1999-12-30 Element de carte a circuit integre monte en flip-chip
PCT/FR2000/003500 WO2001050415A2 (fr) 1999-12-30 2000-12-13 Element de carte a circuit integre monte en flip-chip

Publications (1)

Publication Number Publication Date
ATE251783T1 true ATE251783T1 (de) 2003-10-15

Family

ID=9554046

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00985420T ATE251783T1 (de) 1999-12-30 2000-12-13 Flip chip montage eines ic-kartenelements

Country Status (9)

Country Link
US (1) US7026720B2 (de)
EP (1) EP1242971B1 (de)
JP (1) JP2003519847A (de)
CN (1) CN1171178C (de)
AT (1) ATE251783T1 (de)
DE (1) DE60005858T2 (de)
ES (1) ES2208451T3 (de)
FR (1) FR2803413A1 (de)
WO (1) WO2001050415A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101356A (ja) * 2003-09-25 2005-04-14 Toshiba Corp 無線カード
DE102005007643A1 (de) * 2005-02-19 2006-08-31 Assa Abloy Identification Technology Group Ab Verfahren und Anordnung zum Kontaktieren von Halbleiterchips auf einem metallischen Substrat
JP4714026B2 (ja) 2006-01-10 2011-06-29 株式会社東芝 電子部品実装装置、電子部品実装方法及び電子部品装置
JP5266723B2 (ja) 2007-11-07 2013-08-21 富士通株式会社 Ｒｆｉｄタグ製造方法
FR2976382B1 (fr) * 2011-06-10 2013-07-05 Oberthur Technologies Module a microcircuit et carte a puce le comportant
US11446116B2 (en) 2020-07-06 2022-09-20 Perfect Fit Crowns, Llc Method and apparatus for dental crown restorations using prefabricated sleeve-crown pairs

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5662296A (en) * 1996-02-05 1997-09-02 Sports World Enterprise Co., Ltd. Controlling means of a golf bag stand
FR2756955B1 (fr) 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2769441A1 (fr) * 1997-10-07 1999-04-09 Philips Electronics Nv Carte electronique sans contact et son procede de fabrication

Also Published As

Publication number Publication date
CN1171178C (zh) 2004-10-13
EP1242971A2 (de) 2002-09-25
DE60005858D1 (de) 2003-11-13
CN1415104A (zh) 2003-04-30
US7026720B2 (en) 2006-04-11
ES2208451T3 (es) 2004-06-16
EP1242971B1 (de) 2003-10-08
WO2001050415A2 (fr) 2001-07-12
JP2003519847A (ja) 2003-06-24
US20040036178A1 (en) 2004-02-26
FR2803413A1 (fr) 2001-07-06
DE60005858T2 (de) 2004-09-09
WO2001050415A3 (fr) 2002-01-31

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties