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ATE201849T1 - Umgekehrtes prägeverfahren - Google Patents

Umgekehrtes prägeverfahren

Info

Publication number
ATE201849T1
ATE201849T1 AT97910024T AT97910024T ATE201849T1 AT E201849 T1 ATE201849 T1 AT E201849T1 AT 97910024 T AT97910024 T AT 97910024T AT 97910024 T AT97910024 T AT 97910024T AT E201849 T1 ATE201849 T1 AT E201849T1
Authority
AT
Austria
Prior art keywords
die
pct
embossing process
sec
wet
Prior art date
Application number
AT97910024T
Other languages
English (en)
Inventor
Richard J Ross
Original Assignee
Rjr Polymers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr Polymers Inc filed Critical Rjr Polymers Inc
Application granted granted Critical
Publication of ATE201849T1 publication Critical patent/ATE201849T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F1/00—Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed
    • B41F1/26—Details
    • B41F1/40—Inking units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Methods (AREA)
  • Vending Machines For Individual Products (AREA)
  • Forging (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
  • Confectionery (AREA)
  • General Preparation And Processing Of Foods (AREA)
AT97910024T 1996-10-10 1997-10-07 Umgekehrtes prägeverfahren ATE201849T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2730396P 1996-10-10 1996-10-10
PCT/US1997/018173 WO1998015410A1 (en) 1996-10-10 1997-10-07 Inverted stamping process

Publications (1)

Publication Number Publication Date
ATE201849T1 true ATE201849T1 (de) 2001-06-15

Family

ID=21836910

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97910024T ATE201849T1 (de) 1996-10-10 1997-10-07 Umgekehrtes prägeverfahren

Country Status (11)

Country Link
US (1) US5816158A (de)
EP (1) EP0930974B1 (de)
JP (1) JP3428028B2 (de)
KR (1) KR100457148B1 (de)
CN (1) CN1078532C (de)
AT (1) ATE201849T1 (de)
AU (1) AU4749997A (de)
DE (1) DE69705124T2 (de)
DK (1) DK0930974T3 (de)
HK (1) HK1021719A1 (de)
WO (1) WO1998015410A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214152B1 (en) * 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
US20030202242A1 (en) * 2002-04-26 2003-10-30 Roberto Sgaravatto Slide for the microscopic examination of biological fluids
US20060196375A1 (en) * 2004-10-22 2006-09-07 Seth Coe-Sullivan Method and system for transferring a patterned material
US7598122B1 (en) * 2006-03-08 2009-10-06 National Semiconductor Corporation Die attach method and microarray leadframe structure
EP1884830A1 (de) * 2006-08-04 2008-02-06 Sony Deutschland GmbH Verfahren zum Aufbringen eines Materials auf ein Substrat
US8530279B2 (en) * 2008-09-11 2013-09-10 Texas Instruments Incorporated Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter
US8283769B2 (en) * 2009-10-14 2012-10-09 Stmicroelectronics, Inc. Modular low stress package technology
US9027247B2 (en) 2012-10-22 2015-05-12 Xerox Corporation Liquid adhesive application by contact printing
US10115605B2 (en) 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB566461A (en) * 1942-08-19 1945-01-01 Goss Printing Press Co Ltd Method of printing with water base and like inks
US2700629A (en) * 1950-01-30 1955-01-25 American Photofoil Corp Method for transferring a decoration to a surface
US2905085A (en) * 1956-11-15 1959-09-22 British Tufting Machinery Ltd Textile printing
US3140655A (en) * 1961-11-03 1964-07-14 John J Lally Apparatus for impressing type face
US3741764A (en) * 1971-05-21 1973-06-26 Jerobee Ind Inc Method of making accurate reproduction
KR0153260B1 (ko) * 1989-06-16 1998-11-02 기다지마 요시도시 미세패턴의 인쇄방법
US5095817A (en) * 1990-11-30 1992-03-17 Kabushiki Kaisha Shinkawa Thin film supplying mechanism

Also Published As

Publication number Publication date
KR100457148B1 (ko) 2004-11-16
CN1078532C (zh) 2002-01-30
JP3428028B2 (ja) 2003-07-22
DK0930974T3 (da) 2001-09-03
DE69705124D1 (de) 2001-07-12
AU4749997A (en) 1998-05-05
US5816158A (en) 1998-10-06
HK1021719A1 (en) 2000-06-30
JP2001501882A (ja) 2001-02-13
WO1998015410A1 (en) 1998-04-16
EP0930974B1 (de) 2001-06-06
KR20000049049A (ko) 2000-07-25
EP0930974A1 (de) 1999-07-28
CN1237927A (zh) 1999-12-08
DE69705124T2 (de) 2001-09-27

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UEP Publication of translation of european patent specification