[go: up one dir, main page]

ATA37372A - Halter fur mindestens ein zwischen druckstucken eingespanntes halbleiterbauelement - Google Patents

Halter fur mindestens ein zwischen druckstucken eingespanntes halbleiterbauelement

Info

Publication number
ATA37372A
ATA37372A AT72373A AT37372A ATA37372A AT A37372 A ATA37372 A AT A37372A AT 72373 A AT72373 A AT 72373A AT 37372 A AT37372 A AT 37372A AT A37372 A ATA37372 A AT A37372A
Authority
AT
Austria
Prior art keywords
holder
semiconductor component
component clamped
printing pieces
printing
Prior art date
Application number
AT72373A
Other languages
English (en)
Other versions
AT337254B (de
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of ATA37372A publication Critical patent/ATA37372A/de
Application granted granted Critical
Publication of AT337254B publication Critical patent/AT337254B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT37372A 1971-03-11 1972-01-17 Halter fur mindestens ein zwischen druckstucken eingespanntes halbleiterbauelement AT337254B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (de) 1971-03-11 1971-03-11 Halter für mindestens ein scheibenförmiges Halbleiterelement

Publications (2)

Publication Number Publication Date
ATA37372A true ATA37372A (de) 1976-10-15
AT337254B AT337254B (de) 1977-06-27

Family

ID=4261441

Family Applications (1)

Application Number Title Priority Date Filing Date
AT37372A AT337254B (de) 1971-03-11 1972-01-17 Halter fur mindestens ein zwischen druckstucken eingespanntes halbleiterbauelement

Country Status (4)

Country Link
US (1) US3786168A (de)
AT (1) AT337254B (de)
CH (1) CH528817A (de)
DE (2) DE2115637A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS159563B1 (de) * 1972-12-28 1975-01-31
US3989095A (en) * 1972-12-28 1976-11-02 Ckd Praha, Oborovy Podnik Semi conductor cooling system
US3936704A (en) * 1974-11-18 1976-02-03 Chrysler Corporation Mounting arrangement for electronic semi-conductor devices
US4159483A (en) * 1977-11-25 1979-06-26 Cutler-Hammer, Inc. Low profile force indicating fastener, especially for semiconductor clamps
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
US6859370B1 (en) * 2003-09-04 2005-02-22 Speed Tech Corp. Board to board array type connector
BRPI0806533B1 (pt) * 2007-01-26 2018-10-09 Inductotherm Corp dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor
GB2544419B (en) * 2015-07-27 2017-09-06 Sevcon Ltd Power electronics assembly
USD768097S1 (en) * 2015-10-20 2016-10-04 LWE, Inc. Insulator for press pack clamp
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
CA3177782A1 (en) * 2020-05-12 2021-11-18 Maurizio MIOZZA Electronic device cooling systems using cooled fluid and control of same

Also Published As

Publication number Publication date
CH528817A (de) 1972-09-30
DE7112386U (de) 1972-12-21
DE2115637A1 (de) 1972-09-28
AT337254B (de) 1977-06-27
US3786168A (en) 1974-01-15

Similar Documents

Publication Publication Date Title
BE763528A (fr) Procede de preparation de methylazoles n-(1,1,1-trisubstitues)
IT966132B (it) Processo per fabbricare alcossi silani
AT337254B (de) Halter fur mindestens ein zwischen druckstucken eingespanntes halbleiterbauelement
BR7202852D0 (pt) Alca aperfeicoada para um transportador de objetos
CH538749A (de) Vorrichtung für die Halterung von flachen Gegenständen
BR7108656D0 (pt) Maquina para fazer copos de lata
BE786840A (fr) Procede de preparation de 1,2,4-triazine -5-ones
BE789907A (fr) Procede de cementation
BE791287A (fr) Procede de pyro-affinage de cuivre
RO69127A (ro) Procedeu pentru cristalizarea fructozei
BG20410A3 (bg) Метод за получаване на 3,4-дихидро-2н- изохинолин-1-они
BE778610A (fr) Procede de teinture
AT301301B (de) Aufspannplatte für Werkzeugmaschinen
BE784616A (fr) Procede de nitration
BE772194A (fr) Procede de regulation.
IT963896B (it) Apparecchio per stampa di tessili
YU36017B (en) Process for obtaining d-penicillamine
AT309858B (de) Vorrichtung für doppeltes Drucken
BE785174A (fr) Procede de preparation de n-(2,4-dihalogeno-s-triazin-6-yl)- urees
BR7207834D0 (pt) Processo para obtencao de metilcobalamina
BR7202834D0 (pt) Processo para preparacao de compostos oxo
IT971400B (it) Macchina per fucinatura
CH527026A (de) Spanneinrichtung für Werkzeuge
BE791884A (fr) Procede de meulage
BE783646A (fr) Procede de deparaffinage

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee