AT325678B - PROCESS FOR ALKALINE ETCHING OF PN-TRANSITIONS PROVIDED SEMI-CONDUCTOR ARRANGEMENTS - Google Patents
PROCESS FOR ALKALINE ETCHING OF PN-TRANSITIONS PROVIDED SEMI-CONDUCTOR ARRANGEMENTSInfo
- Publication number
- AT325678B AT325678B AT1017072A AT1017072A AT325678B AT 325678 B AT325678 B AT 325678B AT 1017072 A AT1017072 A AT 1017072A AT 1017072 A AT1017072 A AT 1017072A AT 325678 B AT325678 B AT 325678B
- Authority
- AT
- Austria
- Prior art keywords
- alkaline etching
- conductor arrangements
- provided semi
- transitions provided
- transitions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30612—Etching of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722214197 DE2214197C3 (en) | 1972-03-23 | 1972-03-23 | Process for etching semiconductor wafers containing PN junctions |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA1017072A ATA1017072A (en) | 1975-01-15 |
AT325678B true AT325678B (en) | 1975-11-10 |
Family
ID=5839938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT1017072A AT325678B (en) | 1972-03-23 | 1972-11-29 | PROCESS FOR ALKALINE ETCHING OF PN-TRANSITIONS PROVIDED SEMI-CONDUCTOR ARRANGEMENTS |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS525230B2 (en) |
AT (1) | AT325678B (en) |
BE (1) | BE797244A (en) |
CH (1) | CH575175A5 (en) |
DE (1) | DE2214197C3 (en) |
ES (1) | ES409621A1 (en) |
FR (1) | FR2176664B1 (en) |
GB (1) | GB1362507A (en) |
IT (1) | IT972618B (en) |
NL (1) | NL7217673A (en) |
SE (1) | SE378478B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB889872A (en) * | 1957-04-24 | 1962-02-21 | Sarkes Tarzian | A method of treating a semi-conductor device |
FR1266612A (en) * | 1960-06-02 | 1961-07-17 | Etching solutions for the surface treatment of semiconductor materials | |
NL271850A (en) * | 1961-02-03 | |||
GB980513A (en) * | 1961-11-17 | 1965-01-13 | Licentia Gmbh | Improvements relating to the use of silicon in semi-conductor devices |
DE1621511A1 (en) * | 1967-04-01 | 1970-07-23 | Siemens Ag | Process for anti-reflective coating of silicon single crystal surfaces |
-
1972
- 1972-03-23 DE DE19722214197 patent/DE2214197C3/en not_active Expired
- 1972-11-29 CH CH1742472A patent/CH575175A5/xx not_active IP Right Cessation
- 1972-11-29 AT AT1017072A patent/AT325678B/en active
- 1972-12-14 ES ES409621A patent/ES409621A1/en not_active Expired
- 1972-12-20 IT IT3323272A patent/IT972618B/en active
- 1972-12-21 FR FR7245655A patent/FR2176664B1/fr not_active Expired
- 1972-12-27 NL NL7217673A patent/NL7217673A/xx unknown
-
1973
- 1973-01-25 GB GB380173A patent/GB1362507A/en not_active Expired
- 1973-03-22 JP JP3304473A patent/JPS525230B2/ja not_active Expired
- 1973-03-23 BE BE129187A patent/BE797244A/en unknown
- 1973-03-23 SE SE7304136A patent/SE378478B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL7217673A (en) | 1973-09-25 |
FR2176664B1 (en) | 1977-12-30 |
JPS4915371A (en) | 1974-02-09 |
JPS525230B2 (en) | 1977-02-10 |
FR2176664A1 (en) | 1973-11-02 |
DE2214197B2 (en) | 1981-04-23 |
DE2214197A1 (en) | 1973-09-27 |
BE797244A (en) | 1973-07-16 |
ES409621A1 (en) | 1975-12-01 |
ATA1017072A (en) | 1975-01-15 |
GB1362507A (en) | 1974-08-07 |
SE378478B (en) | 1975-09-01 |
IT972618B (en) | 1974-05-31 |
DE2214197C3 (en) | 1982-01-14 |
CH575175A5 (en) | 1976-04-30 |
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