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AT302763B - Process for the production of pore-free metallic copper coatings of high ductility - Google Patents

Process for the production of pore-free metallic copper coatings of high ductility

Info

Publication number
AT302763B
AT302763B AT626370A AT626370A AT302763B AT 302763 B AT302763 B AT 302763B AT 626370 A AT626370 A AT 626370A AT 626370 A AT626370 A AT 626370A AT 302763 B AT302763 B AT 302763B
Authority
AT
Austria
Prior art keywords
pore
production
metallic copper
high ductility
free metallic
Prior art date
Application number
AT626370A
Other languages
German (de)
Original Assignee
Werner Fluehmann Galvanische A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Werner Fluehmann Galvanische A filed Critical Werner Fluehmann Galvanische A
Application granted granted Critical
Publication of AT302763B publication Critical patent/AT302763B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/06Filtering particles other than ions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
AT626370A 1969-07-10 1970-07-09 Process for the production of pore-free metallic copper coatings of high ductility AT302763B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1056369A CH494824A (en) 1969-07-10 1969-07-10 Process for the electrodeposition of copper with high ductility

Publications (1)

Publication Number Publication Date
AT302763B true AT302763B (en) 1972-10-25

Family

ID=4364536

Family Applications (1)

Application Number Title Priority Date Filing Date
AT626370A AT302763B (en) 1969-07-10 1970-07-09 Process for the production of pore-free metallic copper coatings of high ductility

Country Status (7)

Country Link
US (1) US3660251A (en)
AT (1) AT302763B (en)
CH (1) CH494824A (en)
DE (1) DE2034144A1 (en)
FR (1) FR2051660B3 (en)
GB (1) GB1316846A (en)
NL (1) NL7010237A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2558423B2 (en) * 1975-12-23 1978-09-07 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Process for the electrodeposition of nickel from a nickel sulfamate bath
FR2531458A1 (en) * 1982-08-04 1984-02-10 Stephanois Rech Mec PROCESS FOR SURFACE TREATMENT OF FERROUS SURFACES TO IMPROVE THEIR FRICTION QUALITY AND RESISTANCE TO WEAR AND INJURY
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
DE3687089T3 (en) * 1985-07-05 1999-10-07 Mitsui Mining & Smelting Co., Ltd. Process for producing copper foil by electrodeposition.
EP0283681B1 (en) * 1987-02-23 1992-05-06 Siemens Aktiengesellschaft Apparatus for bump-plating chips
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
EP0823719B1 (en) * 1996-07-26 2002-06-05 Nec Corporation Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof
GB2564149A (en) * 2017-07-05 2019-01-09 Skf Ab Electroplated cage for rolling element bearing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA715549A (en) * 1965-08-10 Martin Rudolf Electro-deposition assemblies
US1798994A (en) * 1929-01-04 1931-03-31 Gen Electric Electroplating apparatus
US3222268A (en) * 1961-07-13 1965-12-07 Udylite Corp Particle separator device for plating baths
BE621297A (en) * 1961-08-10
US3208921A (en) * 1962-01-02 1965-09-28 Sperry Rand Corp Method for making printed circuit boards
US3186932A (en) * 1962-12-10 1965-06-01 Audio Matrix Inc Apparatus for forming phonograph record masters, mothers, and stampers
US3532801A (en) * 1965-02-23 1970-10-06 Burroughs Corp Method and apparatus for fabricating laminated circuit boards

Also Published As

Publication number Publication date
FR2051660B3 (en) 1973-04-27
DE2034144A1 (en) 1971-02-11
CH494824A (en) 1970-08-15
US3660251A (en) 1972-05-02
FR2051660A7 (en) 1971-04-09
NL7010237A (en) 1971-01-12
GB1316846A (en) 1973-05-16

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee