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AT279994B - Vorrichtung zum Aufbringen von dünnen Schichten - Google Patents

Vorrichtung zum Aufbringen von dünnen Schichten

Info

Publication number
AT279994B
AT279994B AT1089868A AT1089868A AT279994B AT 279994 B AT279994 B AT 279994B AT 1089868 A AT1089868 A AT 1089868A AT 1089868 A AT1089868 A AT 1089868A AT 279994 B AT279994 B AT 279994B
Authority
AT
Austria
Prior art keywords
thin layers
applying thin
applying
layers
thin
Prior art date
Application number
AT1089868A
Other languages
English (en)
Inventor
Joseph Wurm
Pierre Beucherie
Michel Block
Original Assignee
Euratom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Euratom filed Critical Euratom
Application granted granted Critical
Publication of AT279994B publication Critical patent/AT279994B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Adornments (AREA)
  • Drying Of Semiconductors (AREA)
AT1089868A 1967-11-10 1968-11-08 Vorrichtung zum Aufbringen von dünnen Schichten AT279994B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT262715D
BE50663 1967-11-10

Publications (1)

Publication Number Publication Date
AT279994B true AT279994B (de) 1970-03-25

Family

ID=25608192

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1089868A AT279994B (de) 1967-11-10 1968-11-08 Vorrichtung zum Aufbringen von dünnen Schichten

Country Status (9)

Country Link
US (1) US3619402A (de)
JP (1) JPS4929818B1 (de)
AT (1) AT279994B (de)
DE (1) DE1765850A1 (de)
DK (1) DK131005B (de)
ES (1) ES360009A1 (de)
LU (1) LU57245A1 (de)
NO (1) NO120815B (de)
SE (1) SE347296B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1365492A (en) * 1971-02-05 1974-09-04 Triplex Safety Glass Co Metal oxide films
DE2558947A1 (de) * 1975-12-29 1977-07-14 Max Planck Gesellschaft Mehrschichtmesselektroden
JPS54155009A (en) * 1978-05-26 1979-12-06 Matsushita Electric Ind Co Ltd Wireless transmission/reception stereo system
US4406252A (en) * 1980-12-29 1983-09-27 Rockwell International Corporation Inductive heating arrangement for evaporating thin film alloy onto a substrate
DE3206421A1 (de) * 1982-02-23 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von schichten aus hochschmelzenden metallen bzw. metallverbindungen durch abscheidung aus der dampfphase
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
US5073245A (en) * 1990-07-10 1991-12-17 Hedgcoth Virgle L Slotted cylindrical hollow cathode/magnetron sputtering device
US5567261A (en) * 1992-08-06 1996-10-22 Leonhard Kurz Gmbh & Co. Method and apparatus for decorating articles having a conical peripheral surface portion
US5391281A (en) * 1993-04-09 1995-02-21 Materials Research Corp. Plasma shaping plug for control of sputter etching
US5569363A (en) 1994-10-25 1996-10-29 Sony Corporation Inductively coupled plasma sputter chamber with conductive material sputtering capabilities
US6264812B1 (en) 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6368469B1 (en) 1996-05-09 2002-04-09 Applied Materials, Inc. Coils for generating a plasma and for sputtering
KR100489918B1 (ko) * 1996-05-09 2005-08-04 어플라이드 머티어리얼스, 인코포레이티드 플라즈마발생및스퍼터링용코일
US6254737B1 (en) 1996-10-08 2001-07-03 Applied Materials, Inc. Active shield for generating a plasma for sputtering
US6190513B1 (en) 1997-05-14 2001-02-20 Applied Materials, Inc. Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition
US6217715B1 (en) * 1997-02-06 2001-04-17 Applied Materials, Inc. Coating of vacuum chambers to reduce pump down time and base pressure
US6103070A (en) * 1997-05-14 2000-08-15 Applied Materials, Inc. Powered shield source for high density plasma
US6077402A (en) * 1997-05-16 2000-06-20 Applied Materials, Inc. Central coil design for ionized metal plasma deposition
US6565717B1 (en) 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
US6168690B1 (en) * 1997-09-29 2001-01-02 Lam Research Corporation Methods and apparatus for physical vapor deposition
US6146508A (en) * 1998-04-22 2000-11-14 Applied Materials, Inc. Sputtering method and apparatus with small diameter RF coil
US6132566A (en) * 1998-07-30 2000-10-17 Applied Materials, Inc. Apparatus and method for sputtering ionized material in a plasma
DE19923018C2 (de) * 1999-05-19 2001-09-27 Univ Dresden Tech Vorrichtung zur Bearbeitung bandförmiger Werkstücke mit Hilfe resonanter Hochfrequenzplasmen
JP4677123B2 (ja) * 2001-05-31 2011-04-27 株式会社アルバック 高密度へリコンプラズマを利用した緻密な硬質薄膜の形成装置及び形成方法
US8158016B2 (en) * 2004-02-04 2012-04-17 Veeco Instruments, Inc. Methods of operating an electromagnet of an ion source
US7557362B2 (en) * 2004-02-04 2009-07-07 Veeco Instruments Inc. Ion sources and methods for generating an ion beam with a controllable ion current density distribution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3250694A (en) * 1962-10-17 1966-05-10 Ibm Apparatus for coating articles by cathode sputtering
US3291715A (en) * 1963-08-19 1966-12-13 Litton Systems Inc Apparatus for cathode sputtering including a plasmaconfining chamber
NL130959C (de) * 1965-12-17
US3451917A (en) * 1966-01-10 1969-06-24 Bendix Corp Radio frequency sputtering apparatus
US3501393A (en) * 1967-05-05 1970-03-17 Litton Systems Inc Apparatus for sputtering wherein the plasma is confined by the target structure

Also Published As

Publication number Publication date
DE1765850A1 (de) 1971-10-28
SE347296B (de) 1972-07-31
JPS4929818B1 (de) 1974-08-07
ES360009A1 (es) 1970-10-16
US3619402A (en) 1971-11-09
DK131005C (de) 1975-11-10
DK131005B (da) 1975-05-12
LU57245A1 (de) 1969-02-11
NO120815B (de) 1970-12-07

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Legal Events

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ELJ Ceased due to non-payment of the annual fee