1 September 2006, Volume 45, Issue 25, pp. 6315-6645
44 articles
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Top: schematics that demonstrate tasks and implementation of a 3D processor-memory-bus interconnect. Bottom: an assembled 3D free-space optical multilayer prototype. For details, see the paper by Jarczynski et al., pp. 6335-6341.
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- Atmospheric and ocean optics (2)
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