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Design and Experience of Virtual Ski Resort Based on VR Technology and Meteorological Condition Simulation

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Cyber Security Intelligence and Analytics (CSIA 2023)

Part of the book series: Lecture Notes on Data Engineering and Communications Technologies ((LNDECT,volume 173))

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Abstract

Daily snowfall, average wind speed, and maximum daily temperature are the most representative influencing factors for skiing among all meteorological factors. In this paper, various VR skiing virtual environments that incorporate the impact of meteorological conditions are designed. Firstly, different levels of snowfall simulation effects are designed at different stages of the skiing experience. Secondly, an intelligent environmental wind field simulation system is developed to dynamically simulate the impact of different wind forces during the skiing process on the sliding experience. A wind speed change function is created to simulate the fluctuation of wind force at level 2 in the snow field, and the corresponding levels of wind force simulation system are activated according to the simulated wind forces in the snow field. Thirdly, the temperature is designed to change with the wind force and snowfall, and the dynamic real-time temperature of the corresponding range is simulated in different regions. The process lasts for 3–4 min and experiences the simulated skiing weather indexes: level 1, level 2, and level 3, and end before level 4. The collection of ski movement data through the ski platform and controlment of the computer virtual simulation system for human-computer interaction make the experiencer have a simulation experience of skiing in the virtual skiing resort.

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Correspondence to Haimin Cheng .

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Cheng, H., Fu, G., Liu, Y. (2023). Design and Experience of Virtual Ski Resort Based on VR Technology and Meteorological Condition Simulation. In: Xu, Z., Alrabaee, S., Loyola-González, O., Cahyani, N.D.W., Ab Rahman, N.H. (eds) Cyber Security Intelligence and Analytics. CSIA 2023. Lecture Notes on Data Engineering and Communications Technologies, vol 173. Springer, Cham. https://doi.org/10.1007/978-3-031-31775-0_46

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