Three-dimensional finite element simulation of electro and stress migration effects in interconnect lines. Sven Rzepka, Matt A Korhonen, Eicke R Weber, Che-Yu Li Materials reliability in microelectronics VII, 329-335, 1997. A ...
... 2. EG Colgan, Mat. Sci. Rep. 5, 3 (1990). 3. PA Flinn, DS Gardner, and WD Nix, IEEE Trans. Electron. Dev. ED-34, 689 (1987). 4. PR Besser, JE Sanchez, Jr and RAAlvis, MRS Symp. Proc. Vol. 355 (1995), 5. DB Knorr, Rensselaer... more
... 2. EG Colgan, Mat. Sci. Rep. 5, 3 (1990). 3. PA Flinn, DS Gardner, and WD Nix, IEEE Trans. Electron. Dev. ED-34, 689 (1987). 4. PR Besser, JE Sanchez, Jr and RAAlvis, MRS Symp. Proc. Vol. 355 (1995), 5. DB Knorr, Rensselaer Polytechnic Institute, Private Communication. ...
Research Interests:
ABSTRACT
